ATE368241T1 - Resistzusammensetzung - Google Patents

Resistzusammensetzung

Info

Publication number
ATE368241T1
ATE368241T1 AT03004395T AT03004395T ATE368241T1 AT E368241 T1 ATE368241 T1 AT E368241T1 AT 03004395 T AT03004395 T AT 03004395T AT 03004395 T AT03004395 T AT 03004395T AT E368241 T1 ATE368241 T1 AT E368241T1
Authority
AT
Austria
Prior art keywords
group
acidic
blocked
acidic group
fluoropolymer
Prior art date
Application number
AT03004395T
Other languages
English (en)
Inventor
Shinji Okada
Yasuhide Kawaguchi
Yoko Takebe
Isamu Kaneko
Shun-Ichi Kodama
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Application granted granted Critical
Publication of ATE368241T1 publication Critical patent/ATE368241T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/115—Cationic or anionic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
AT03004395T 2002-03-04 2003-03-03 Resistzusammensetzung ATE368241T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002057342A JP4010160B2 (ja) 2002-03-04 2002-03-04 レジスト組成物

Publications (1)

Publication Number Publication Date
ATE368241T1 true ATE368241T1 (de) 2007-08-15

Family

ID=27751036

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03004395T ATE368241T1 (de) 2002-03-04 2003-03-03 Resistzusammensetzung

Country Status (8)

Country Link
US (1) US6815146B2 (de)
EP (1) EP1343047B1 (de)
JP (1) JP4010160B2 (de)
KR (1) KR20040002451A (de)
CN (1) CN100422853C (de)
AT (1) ATE368241T1 (de)
DE (1) DE60315085T2 (de)
TW (1) TWI300882B (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2001274579A1 (en) * 2000-06-21 2002-01-02 Asahi Glass Company, Limited Resist composition
JP2004004561A (ja) * 2002-02-19 2004-01-08 Sumitomo Chem Co Ltd ポジ型レジスト組成物
JP2003330196A (ja) * 2002-03-05 2003-11-19 Jsr Corp 感放射線性樹脂組成物
JP2004004703A (ja) * 2002-04-03 2004-01-08 Sumitomo Chem Co Ltd ポジ型レジスト組成物
US6866983B2 (en) * 2002-04-05 2005-03-15 Shin-Etsu Chemical Co., Ltd. Resist compositions and patterning process
JP3856122B2 (ja) * 2002-04-05 2006-12-13 信越化学工業株式会社 レジスト材料及びパターン形成方法
JP4186054B2 (ja) * 2002-04-05 2008-11-26 信越化学工業株式会社 レジスト材料及びパターン形成方法
AU2003257656A1 (en) * 2002-08-21 2004-03-11 Asahi Glass Company, Limited Fluorine compounds, fluoropolymers, and process for production thereof
JPWO2004024787A1 (ja) * 2002-09-13 2006-01-05 ダイキン工業株式会社 レジスト用含フッ素重合体の製造方法
KR20050071666A (ko) * 2002-11-07 2005-07-07 아사히 가라스 가부시키가이샤 레지스트 조성물
KR20050084631A (ko) * 2002-11-07 2005-08-26 아사히 가라스 가부시키가이샤 함불소 폴리머
JP2005060664A (ja) * 2003-07-31 2005-03-10 Asahi Glass Co Ltd 含フッ素化合物、含フッ素ポリマーとその製造方法およびそれを含むレジスト組成物
JP2005097531A (ja) * 2003-08-21 2005-04-14 Asahi Glass Co Ltd 含フッ素共重合体とその製造方法およびそれを含むレジスト組成物
WO2005042453A1 (ja) * 2003-10-31 2005-05-12 Asahi Glass Company, Limited 含フッ素化合物、含フッ素ポリマーとその製造方法
JP2005162861A (ja) * 2003-12-02 2005-06-23 Asahi Glass Co Ltd 含フッ素ポリマー
JP2005173463A (ja) * 2003-12-15 2005-06-30 Tokyo Ohka Kogyo Co Ltd ホトレジスト組成物およびレジストパターン形成方法
US7256873B2 (en) * 2004-01-28 2007-08-14 Asml Netherlands B.V. Enhanced lithographic resolution through double exposure
JP4568278B2 (ja) * 2004-03-08 2010-10-27 三菱レイヨン株式会社 レジスト材料、レジスト組成物、およびパターン製造方法、並びにレジスト用重合体用原料化合物
JP4407358B2 (ja) * 2004-04-14 2010-02-03 旭硝子株式会社 含フッ素ポリマーおよびレジスト組成物
CN1946751B (zh) 2004-04-27 2010-12-08 东京应化工业株式会社 用于形成液浸曝光工艺用光刻胶保护膜的材料、以及使用该保护膜的光刻胶图案形成方法
WO2005108446A1 (ja) * 2004-05-07 2005-11-17 Asahi Glass Company, Limited 含フッ素共重合体とその製造方法およびそれを含むレジスト組成物
JPWO2006011427A1 (ja) * 2004-07-30 2008-05-01 旭硝子株式会社 含フッ素化合物、含フッ素ポリマー、レジスト組成物、およびレジスト保護膜組成物
JP4368267B2 (ja) 2004-07-30 2009-11-18 東京応化工業株式会社 レジスト保護膜形成用材料、およびこれを用いたレジストパターン形成方法
US20060249332A1 (en) * 2005-05-06 2006-11-09 General Electric Company Oil supply and scavenge system
WO2006132287A1 (ja) * 2005-06-08 2006-12-14 Asahi Glass Company, Limited 含フッ素共重合体とその製造方法およびそれを含むレジスト組成物
JP4677857B2 (ja) * 2005-08-23 2011-04-27 ヤマハ株式会社 楽器用部材または楽器とその製造方法
CN101646696B (zh) * 2007-03-30 2012-07-04 旭硝子株式会社 新的含氟化合物、含氟聚合物及其制造方法
JP5238399B2 (ja) * 2008-08-04 2013-07-17 東京応化工業株式会社 ポジ型レジスト組成物、レジストパターン形成方法、高分子化合物、化合物
CN107848947B (zh) * 2015-07-23 2025-06-20 Dic株式会社 含氟化合物、活性聚合引发剂、含氟聚合物、含氟聚合物的制造方法及抗蚀剂组合物
US10529552B2 (en) * 2017-11-29 2020-01-07 Taiwan Semiconductor Manufacturing Co., Ltd. Method for manufacturing a semiconductor device and a coating material
JP6860032B2 (ja) * 2019-04-04 2021-04-14 ダイキン工業株式会社 パーフルオロアルキン化合物の製造方法
KR20240151730A (ko) * 2022-02-21 2024-10-18 에이지씨 가부시키가이샤 함불소 중합체, 조성물, 방습 코트제 및 물품

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459804A (ja) * 1990-06-29 1992-02-26 Asahi Glass Co Ltd 溶融成形性に優れた樹脂
JP3005040B2 (ja) * 1990-11-22 2000-01-31 旭硝子株式会社 コーティング用樹脂組成物
JP3025799B2 (ja) * 1990-11-22 2000-03-27 旭硝子株式会社 紫外光透過性に優れた重合体およびその製法
AU6056099A (en) * 1998-09-23 2000-04-10 E.I. Du Pont De Nemours And Company Photoresists, polymers and processes for microlithography
WO2000067072A1 (en) 1999-05-04 2000-11-09 E.I. Du Pont De Nemours And Company Fluorinated polymers, photoresists and processes for microlithography
US6468712B1 (en) * 2000-02-25 2002-10-22 Massachusetts Institute Of Technology Resist materials for 157-nm lithography
JP4923376B2 (ja) 2000-04-04 2012-04-25 ダイキン工業株式会社 酸反応性基を有する新規なフッ素ポリマーおよびそれを用いた化学増幅型フォトレジスト組成物
WO2002064648A1 (en) 2001-02-09 2002-08-22 Asahi Glass Company, Limited Fluorine-containing compounds and polymers and processes for producing the same
DE60223654T2 (de) * 2001-02-09 2008-10-30 Asahi Glass Co., Ltd. Resistzusammensetzung

Also Published As

Publication number Publication date
DE60315085T2 (de) 2008-04-10
US20040013970A1 (en) 2004-01-22
CN1442753A (zh) 2003-09-17
DE60315085D1 (de) 2007-09-06
JP4010160B2 (ja) 2007-11-21
EP1343047A3 (de) 2004-01-02
KR20040002451A (ko) 2004-01-07
CN100422853C (zh) 2008-10-01
EP1343047B1 (de) 2007-07-25
EP1343047A2 (de) 2003-09-10
TW200304047A (en) 2003-09-16
TWI300882B (en) 2008-09-11
US6815146B2 (en) 2004-11-09
JP2003255540A (ja) 2003-09-10

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Legal Events

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