ATE370464T1 - Schutz für einen integrierten schaltungschip, der vertrauliche daten enthält - Google Patents

Schutz für einen integrierten schaltungschip, der vertrauliche daten enthält

Info

Publication number
ATE370464T1
ATE370464T1 AT04816603T AT04816603T ATE370464T1 AT E370464 T1 ATE370464 T1 AT E370464T1 AT 04816603 T AT04816603 T AT 04816603T AT 04816603 T AT04816603 T AT 04816603T AT E370464 T1 ATE370464 T1 AT E370464T1
Authority
AT
Austria
Prior art keywords
integrated circuit
circuit chip
protection
confidential data
chip
Prior art date
Application number
AT04816603T
Other languages
English (en)
Inventor
Olivier Savry
Christophe Billard
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE370464T1 publication Critical patent/ATE370464T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
    • H10W42/405—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering using active circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Storage Device Security (AREA)
AT04816603T 2003-12-29 2004-12-23 Schutz für einen integrierten schaltungschip, der vertrauliche daten enthält ATE370464T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0351221A FR2864667B1 (fr) 2003-12-29 2003-12-29 Protection d'une puce de circuit integre contenant des donnees confidentielles

Publications (1)

Publication Number Publication Date
ATE370464T1 true ATE370464T1 (de) 2007-09-15

Family

ID=34639768

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04816603T ATE370464T1 (de) 2003-12-29 2004-12-23 Schutz für einen integrierten schaltungschip, der vertrauliche daten enthält

Country Status (7)

Country Link
US (1) US8110894B2 (de)
EP (1) EP1700256B1 (de)
JP (1) JP4717011B2 (de)
AT (1) ATE370464T1 (de)
DE (1) DE602004008339T2 (de)
FR (1) FR2864667B1 (de)
WO (1) WO2005069210A1 (de)

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FR2910708A1 (fr) * 2006-12-20 2008-06-27 Commissariat Energie Atomique Protection de donnees confidentielles dans les circuits integres
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US20100123469A1 (en) * 2008-11-19 2010-05-20 Edward Craig Hyatt System and method for protecting circuit boards
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JP5484720B2 (ja) * 2008-12-19 2014-05-07 デクセリアルズ株式会社 アンテナモジュール、及び、その製造方法
DE102009043617A1 (de) 2009-09-29 2011-03-31 Giesecke & Devrient Gmbh Chipmodul und tragbarer Datenträger mit einem Chipmodul
DE102010003450B4 (de) 2010-03-30 2021-12-02 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Halbleiterbauelement mit E-Sicherung auf Metallbasis mit verbesserter Programmiereffizienz durch Erhöhen der Wärmeerzeugung
CN102340358B (zh) * 2010-07-16 2014-03-12 国民技术股份有限公司 一种用于低频信号检测及传输的装置
DE102010060354A1 (de) * 2010-11-04 2012-05-10 Wincor Nixdorf International Gmbh Vorrichtung zur datentechnischen Verbindung von Datenverarbeitungsmodulen und Verfahren zum Schutz einer Datenübertragung vor Manipulation
DE112010006090B4 (de) 2010-12-24 2021-10-21 Toyota Jidosha Kabushiki Kaisha System für kontaktloses Laden, Verfahren für kontaktloses Laden, Fahrzeug zum kontaktlosen Laden und Verwaltungsvorrichtung für kontaktloses Laden
US9442854B2 (en) 2012-11-15 2016-09-13 Elwha Llc Memory circuitry including computational circuitry for performing supplemental functions
US8996951B2 (en) 2012-11-15 2015-03-31 Elwha, Llc Error correction with non-volatile memory on an integrated circuit
US8966310B2 (en) 2012-11-15 2015-02-24 Elwha Llc Redundancy for loss-tolerant data in non-volatile memory
US9323499B2 (en) 2012-11-15 2016-04-26 Elwha Llc Random number generator functions in memory
US9582465B2 (en) 2012-11-15 2017-02-28 Elwha Llc Flexible processors and flexible memory
US8925098B2 (en) * 2012-11-15 2014-12-30 Elwha Llc Data security and access tracking in memory
US9026719B2 (en) 2012-11-15 2015-05-05 Elwha, Llc Intelligent monitoring for computation in memory
FR2998419B1 (fr) * 2012-11-21 2015-01-16 St Microelectronics Rousset Protection d'un circuit integre contre des attaques
DE102013205729A1 (de) * 2013-03-28 2014-10-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren mit einem Träger mit Schaltungsstrukturen
GB201311834D0 (en) 2013-07-02 2013-08-14 Qinetiq Ltd Electronic hardware assembly
FR3012237B1 (fr) 2013-10-22 2017-03-03 Commissariat Energie Atomique Puce electronique comprenant des moyens de protection de sa face arriere
JP6323643B2 (ja) * 2013-11-07 2018-05-16 セイコーエプソン株式会社 半導体回路装置、発振器、電子機器及び移動体
JP2017079336A (ja) * 2014-01-31 2017-04-27 国立大学法人東北大学 サイドチャネル攻撃の検知装置、サイドチャネル攻撃の検知装置によるサイドチャネル攻撃の検知方法
FR3035267B1 (fr) 2015-04-20 2018-05-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives Puce electronique comportant une face arriere protegee
FR3041454B1 (fr) * 2015-09-22 2018-03-16 Thales Dispositif de protection d'un circuit electronique avec detection d'un changement de reactance electrique
EP3147830B1 (de) 2015-09-23 2020-11-18 Nxp B.V. Schutz fuer eine integrierte schaltung
EP3166139B1 (de) * 2015-11-03 2019-07-24 Nxp B.V. Integrierte schaltung und verfahren zur herstellung einer integrierten schaltung
FR3048102B1 (fr) 2016-02-24 2018-03-09 Commissariat A L'energie Atomique Et Aux Energies Alternatives Methode d'execution confidentielle d'un programme operant sur des donnees chiffrees par un chiffrement homomorphe
FR3048319B1 (fr) 2016-02-25 2018-03-09 Commissariat A L'energie Atomique Et Aux Energies Alternatives Methode de gestion de certificats implicites au moyen d'une infrastructure a cles publiques distribuee
US9773153B1 (en) 2016-03-24 2017-09-26 Fingerprint Cards Ab Fingerprint sensor module
FR3055471B1 (fr) * 2016-08-31 2018-09-14 Stmicroelectronics (Crolles 2) Sas Puce protegee contre les attaques face arriere
US10547461B2 (en) 2017-03-07 2020-01-28 Nxp B.V. Method and apparatus for binding stacked die using a physically unclonable function
US10568202B2 (en) 2017-07-25 2020-02-18 International Business Machines Corporation Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout
FR3069703B1 (fr) 2017-07-27 2020-01-24 Stmicroelectronics (Crolles 2) Sas Puce electronique
FR3079623B1 (fr) 2018-03-29 2022-04-08 St Microelectronics Grenoble 2 Capot pour dispositif electronique et procede de fabrication
DE102018209818B4 (de) 2018-06-18 2024-10-10 Bundesdruckerei Gmbh Verfahren zum Herstellen eines Wert- oder Sicherheitsdokumentenrohlings mit einer elektronischen Schaltung, ein Wert- oder Sicherheitsdokumentenrohling und ein Sicherheits- und Wertdokument
WO2020177082A1 (zh) * 2019-03-05 2020-09-10 华为技术有限公司 一种用于裸片保护的电路、裸片及集成电路
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Also Published As

Publication number Publication date
WO2005069210A1 (fr) 2005-07-28
DE602004008339D1 (de) 2007-09-27
JP2007535022A (ja) 2007-11-29
DE602004008339T2 (de) 2008-05-08
EP1700256A1 (de) 2006-09-13
US8110894B2 (en) 2012-02-07
FR2864667A1 (fr) 2005-07-01
JP4717011B2 (ja) 2011-07-06
US20070121575A1 (en) 2007-05-31
EP1700256B1 (de) 2007-08-15
FR2864667B1 (fr) 2006-02-24

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