ATE371265T1 - Verfahren zur herstellung elektrischer/mechanischer verbindungen - Google Patents

Verfahren zur herstellung elektrischer/mechanischer verbindungen

Info

Publication number
ATE371265T1
ATE371265T1 AT01921615T AT01921615T ATE371265T1 AT E371265 T1 ATE371265 T1 AT E371265T1 AT 01921615 T AT01921615 T AT 01921615T AT 01921615 T AT01921615 T AT 01921615T AT E371265 T1 ATE371265 T1 AT E371265T1
Authority
AT
Austria
Prior art keywords
mechanical connections
producing electrical
mass
pin
electronic carrier
Prior art date
Application number
AT01921615T
Other languages
English (en)
Inventor
Elwyn Paul Michael Wakefield
Original Assignee
Elwyn Paul Michael Wakefield
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0009839A external-priority patent/GB2362504A/en
Priority claimed from GB0108418A external-priority patent/GB2362036A/en
Application filed by Elwyn Paul Michael Wakefield filed Critical Elwyn Paul Michael Wakefield
Application granted granted Critical
Publication of ATE371265T1 publication Critical patent/ATE371265T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07252—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49181—Assembling terminal to elongated conductor by deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Processing Of Terminals (AREA)
  • Conductive Materials (AREA)
AT01921615T 2000-04-20 2001-04-17 Verfahren zur herstellung elektrischer/mechanischer verbindungen ATE371265T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0009839A GB2362504A (en) 2000-04-20 2000-04-20 Pin contacts
GB0028595A GB2362035B (en) 2000-04-20 2000-11-23 Forming electrical/mechincal connections
GB0108418A GB2362036A (en) 2000-04-20 2001-04-03 Forming pin contacts to electronic devices

Publications (1)

Publication Number Publication Date
ATE371265T1 true ATE371265T1 (de) 2007-09-15

Family

ID=27255686

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01921615T ATE371265T1 (de) 2000-04-20 2001-04-17 Verfahren zur herstellung elektrischer/mechanischer verbindungen

Country Status (6)

Country Link
US (1) US7137547B2 (de)
EP (1) EP1275143B1 (de)
AT (1) ATE371265T1 (de)
AU (1) AU2001248586A1 (de)
DE (1) DE60130111D1 (de)
WO (1) WO2001082362A2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6856007B2 (en) 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US6972480B2 (en) 2003-06-16 2005-12-06 Shellcase Ltd. Methods and apparatus for packaging integrated circuit devices
WO2005004195A2 (en) 2003-07-03 2005-01-13 Shellcase Ltd. Method and apparatus for packaging integrated circuit devices
US7224056B2 (en) * 2003-09-26 2007-05-29 Tessera, Inc. Back-face and edge interconnects for lidded package
US7249702B2 (en) * 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
US20060183270A1 (en) * 2005-02-14 2006-08-17 Tessera, Inc. Tools and methods for forming conductive bumps on microelectronic elements
US8143095B2 (en) 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
US7936062B2 (en) 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
JP4595018B2 (ja) * 2009-02-23 2010-12-08 株式会社新川 半導体装置の製造方法およびボンディング装置
US8540136B1 (en) 2012-09-06 2013-09-24 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for stud bump formation and apparatus for performing the same
US9093515B2 (en) * 2013-07-17 2015-07-28 Freescale Semiconductor, Inc. Wire bonding capillary with working tip protrusion
DE102014204205A1 (de) * 2014-03-07 2015-09-10 Dr. Johannes Heidenhain Gmbh Vorrichtung zur Messung der Schwingungsamplitude einer Kapillare eines Draht-Bonders
US9165904B1 (en) * 2014-06-17 2015-10-20 Freescale Semiconductor, Inc. Insulated wire bonding with EFO before second bond
JP6543579B2 (ja) * 2016-01-28 2019-07-10 株式会社沖データ 光学ヘッド、画像形成装置および画像読取装置
US12362310B2 (en) * 2019-08-09 2025-07-15 Nagase Chemtex Corporation Multi-layer sheet for mold underfill encapsulation, method for mold underfill encapsulation, electronic component mounting substrate, and production method for electronic component

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3373481A (en) * 1965-06-22 1968-03-19 Sperry Rand Corp Method of electrically interconnecting conductors
NL184184C (nl) 1981-03-20 1989-05-01 Philips Nv Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.
EP0376924A3 (de) 1987-05-21 1990-08-22 RAYCHEM CORPORATION (a Delaware corporation) Gold-Kompressionsverbindung
US5195237A (en) 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5037023A (en) * 1988-11-28 1991-08-06 Hitachi, Ltd. Method and apparatus for wire bonding
US5192015A (en) * 1991-11-20 1993-03-09 Santa Barbara Research Center Method for wire bonding
US5311404A (en) * 1992-06-30 1994-05-10 Hughes Aircraft Company Electrical interconnection substrate with both wire bond and solder contacts
JP3041812B2 (ja) * 1993-09-21 2000-05-15 株式会社新川 ワイヤボンデイング装置
US5558270A (en) 1995-01-06 1996-09-24 Kulicke And Soffa Investments, Inc Fine pitch capillary/wedge bonding tool
JP3086158B2 (ja) * 1995-07-26 2000-09-11 株式会社日立製作所 超音波ボンディング方法
JP3333399B2 (ja) 1996-08-21 2002-10-15 株式会社新川 ワイヤボンディング装置用キャピラリ
DE69739125D1 (de) * 1996-10-01 2009-01-02 Panasonic Corp Kapillare zum Drahtverbinden zur Herstellung von Höckerelektroden
US5938105A (en) 1997-01-15 1999-08-17 National Semiconductor Corporation Encapsulated ball bonding apparatus and method
US5871141A (en) 1997-05-22 1999-02-16 Kulicke And Soffa, Investments, Inc. Fine pitch bonding tool for constrained bonding
WO1999004453A1 (de) * 1997-07-16 1999-01-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Kontakt sowie verfahren zur herstellung eines kontaktes

Also Published As

Publication number Publication date
EP1275143B1 (de) 2007-08-22
WO2001082362A3 (en) 2002-06-20
AU2001248586A1 (en) 2001-11-07
WO2001082362B1 (en) 2002-07-25
US7137547B2 (en) 2006-11-21
EP1275143A2 (de) 2003-01-15
WO2001082362A8 (en) 2004-04-15
WO2001082362A2 (en) 2001-11-01
DE60130111D1 (de) 2007-10-04
US20030159276A1 (en) 2003-08-28

Similar Documents

Publication Publication Date Title
DE60130111D1 (de) Verfahren zur herstellung elektrischer/mechanischer verbindungen
ATE286282T1 (de) Elektronische wertmarke und verfahren zu ihrer herstellung
ATE365764T1 (de) Verfahren zur herstellung elektrisch leitfähiger thermoplastischer polymerzusammensetzungen
ATE242518T1 (de) Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art
EP1656005A3 (de) Substrat mit einem Durchgangsloch und einer Verdrahtung verbunden mit diesem Durchgangsloch, und ein Herstellungsverfahren dafür
DE69910133D1 (de) Verfahren zur herstellung vorfabrizierter bauelemente und vorgespannte baukonstruktion aus solchen elementen hergestellt
ATE369626T1 (de) Verfahren zur herstellung von elektronischen bauelementen
DE69912305D1 (de) Verfahren zur herstellung mikroverkapselte zusammensetzungen
ATE380395T1 (de) Solarzelle sowie verfahren zur herstellung einer solchen
EP1393881A3 (de) Verfahren zum Versiegeln mit Kunststoff
EP2067455A8 (de) Verfahren zur Herstellung einer Urin-Schleuse
WO2004015085A3 (en) Method and compositions relating to 5’-chimeric ribonucleic acids
EP1191587A3 (de) Verpackungsstruktur und Verfahren für selbstbewegende Komponente
TW200517807A (en) ASIC clock floor planning method and structure
WO2003021668A1 (en) Wiring board, semiconductor device and method for producing them
WO2004025739A3 (de) Verfahren zum herstellen einer integrierten pin-diode und zugehörige schaltungsanordnung
ATE516142T1 (de) Verfahren und vorrichtung zur herstellung einer lauffläche für einen reifen
WO2007127733A3 (en) Systems and methods for efficiently implementing an n-step manufacturing process for producing a mechanical part
GB2337222B (en) Method of manufacturing connector for flat cable,connector for flat cable,and applying member for applying ultrasonic vibrations to be used for the same metho
HUP0303318A3 (en) Metal blocks suitable for machining applications and method for making metal blocks, aircraft structural components and injection molds
GB2387149B (en) A method of manufacture of an automobile structure and an automobile structure made by the method
DE50015837D1 (de) Plattenförmiges formelement auf naturfaserbasis und verfahren zu seiner herstellung
WO2008056065A3 (fr) Dispositif de moulage et procede de fabrication
CA2381403A1 (en) Method for manufacturing aluminum nitride sintered body in which via hole is made
DE50003319D1 (de) Unlösbare elektrische und mechanische verbindung, kontaktteil für eine unlösbare elektrische und mechanische verbindung und verfahren zur herstellung einer unlösbaren elektrischen und mechanischen verbindung

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties