ATE371266T1 - Verbesserung der qualität einer in einem plattierungsbad abgeschiedenen metallhaltigen schicht - Google Patents

Verbesserung der qualität einer in einem plattierungsbad abgeschiedenen metallhaltigen schicht

Info

Publication number
ATE371266T1
ATE371266T1 AT00870141T AT00870141T ATE371266T1 AT E371266 T1 ATE371266 T1 AT E371266T1 AT 00870141 T AT00870141 T AT 00870141T AT 00870141 T AT00870141 T AT 00870141T AT E371266 T1 ATE371266 T1 AT E371266T1
Authority
AT
Austria
Prior art keywords
metal
containing layer
plating bath
quality
improvement
Prior art date
Application number
AT00870141T
Other languages
English (en)
Inventor
Sywert H Brongersma
Emmanuel Richard
Iwan Vervoort
Karen Maex
Original Assignee
Imec Inter Uni Micro Electr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP99870194A external-priority patent/EP1087432A1/de
Application filed by Imec Inter Uni Micro Electr filed Critical Imec Inter Uni Micro Electr
Application granted granted Critical
Publication of ATE371266T1 publication Critical patent/ATE371266T1/de

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemically Coating (AREA)
AT00870141T 1999-06-22 2000-06-22 Verbesserung der qualität einer in einem plattierungsbad abgeschiedenen metallhaltigen schicht ATE371266T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14048499P 1999-06-22 1999-06-22
EP99870194A EP1087432A1 (de) 1999-09-24 1999-09-24 Verbesserung der Qualität einer in einem Metallisierungsbad abgeschiedenen Schicht

Publications (1)

Publication Number Publication Date
ATE371266T1 true ATE371266T1 (de) 2007-09-15

Family

ID=26153854

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00870141T ATE371266T1 (de) 1999-06-22 2000-06-22 Verbesserung der qualität einer in einem plattierungsbad abgeschiedenen metallhaltigen schicht

Country Status (3)

Country Link
JP (1) JP4937437B2 (de)
AT (1) ATE371266T1 (de)
DE (1) DE60036052T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4961185B2 (ja) * 2006-09-28 2012-06-27 株式会社日立製作所 半導体装置の製造方法
US7843063B2 (en) 2008-02-14 2010-11-30 International Business Machines Corporation Microstructure modification in copper interconnect structure
JP5968657B2 (ja) * 2012-03-22 2016-08-10 東京エレクトロン株式会社 めっき処理方法、めっき処理システムおよび記憶媒体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63149392A (ja) * 1986-12-12 1988-06-22 Toshiba Corp 電解Ｎｉめつき方法
US5264107A (en) * 1991-12-17 1993-11-23 At&T Bell Laboratories Pseudo-electroless, followed by electroless, metallization of nickel on metallic wires, as for semiconductor chip-to-chip interconnections
JPH09284015A (ja) * 1996-04-16 1997-10-31 Matsushita Electric Ind Co Ltd 同軸型共振器の電極形成方法
JP3187011B2 (ja) * 1998-08-31 2001-07-11 日本電気株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JP4937437B2 (ja) 2012-05-23
DE60036052D1 (de) 2007-10-04
JP2001118848A (ja) 2001-04-27
DE60036052T2 (de) 2008-05-08

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Legal Events

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