ATE374846T1 - Verfahren zur herstellung von hochreinem ruthenium-sputter-target - Google Patents
Verfahren zur herstellung von hochreinem ruthenium-sputter-targetInfo
- Publication number
- ATE374846T1 ATE374846T1 AT99929828T AT99929828T ATE374846T1 AT E374846 T1 ATE374846 T1 AT E374846T1 AT 99929828 T AT99929828 T AT 99929828T AT 99929828 T AT99929828 T AT 99929828T AT E374846 T1 ATE374846 T1 AT E374846T1
- Authority
- AT
- Austria
- Prior art keywords
- ruthenium
- sputtering target
- solution
- purity
- purity ruthenium
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/145—Chemical treatment, e.g. passivation or decarburisation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/001—Starting from powder comprising reducible metal compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
- B22F9/22—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds using gaseous reductors
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B61/00—Obtaining metals not elsewhere provided for in this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
- B22F2009/245—Reduction reaction in an Ionic Liquid [IL]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10198766A JP2000034563A (ja) | 1998-07-14 | 1998-07-14 | 高純度ルテニウムスパッタリングターゲットの製造方法及び高純度ルテニウムスパッタリングターゲット |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE374846T1 true ATE374846T1 (de) | 2007-10-15 |
Family
ID=16396588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT99929828T ATE374846T1 (de) | 1998-07-14 | 1999-07-14 | Verfahren zur herstellung von hochreinem ruthenium-sputter-target |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6284013B1 (de) |
| EP (1) | EP1026283B1 (de) |
| JP (1) | JP2000034563A (de) |
| KR (1) | KR100319223B1 (de) |
| AT (1) | ATE374846T1 (de) |
| DE (1) | DE69937224T2 (de) |
| TW (1) | TW452602B (de) |
| WO (1) | WO2000004202A1 (de) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6458183B1 (en) * | 1999-09-07 | 2002-10-01 | Colonial Metals, Inc. | Method for purifying ruthenium and related processes |
| WO2004001092A1 (ja) * | 2002-06-24 | 2003-12-31 | Nikko Materials Company, Limited | AlRuスパッタリングターゲット及びその製造方法 |
| JP4544501B2 (ja) * | 2002-08-06 | 2010-09-15 | 日鉱金属株式会社 | 導電性酸化物焼結体、同焼結体からなるスパッタリングターゲット及びこれらの製造方法 |
| CA2507370C (en) † | 2002-11-29 | 2012-04-24 | Mitsubishi Materials Corporation | Separation process for platinum group elements |
| US20040127584A1 (en) * | 2002-12-31 | 2004-07-01 | Phillips Petroleum Company | Chemical vapor deposition synthesis of polymerization catalyst composition |
| JP4522991B2 (ja) * | 2004-03-01 | 2010-08-11 | 日鉱金属株式会社 | 高純度Ru粉末の製造方法 |
| JP5043684B2 (ja) * | 2005-01-27 | 2012-10-10 | アプライド マテリアルズ インコーポレイテッド | ルテニウム層堆積装置及び方法 |
| US20060162658A1 (en) * | 2005-01-27 | 2006-07-27 | Applied Materials, Inc. | Ruthenium layer deposition apparatus and method |
| US20060237303A1 (en) * | 2005-03-31 | 2006-10-26 | Hoya Corporation | Sputtering target, method of manufacturing a multilayer reflective film coated substrate, method of manufacturing a reflective mask blank, and method of manufacturing a reflective mask |
| JP2006283054A (ja) * | 2005-03-31 | 2006-10-19 | Hoya Corp | スパッタリングターゲット、多層反射膜付き基板の製造方法、及び反射型マスクブランクの製造方法、並びに反射型マスクの製造方法 |
| CN101198717B (zh) * | 2005-06-16 | 2010-10-13 | 日矿金属株式会社 | 钌合金溅射靶 |
| KR101193964B1 (ko) * | 2005-10-14 | 2012-10-24 | 제이엑스 니폰 마이닝 앤 메탈즈 코포레이션 | 고순도 루테늄 합금 타겟트 및 그 제조방법과 스퍼터막 |
| WO2007062089A1 (en) * | 2005-11-22 | 2007-05-31 | Bodycote Imt, Inc. | Fabrication of ruthenium and ruthenium alloy sputtering targets with low oxygen content |
| US8118984B2 (en) * | 2006-02-22 | 2012-02-21 | Jx Nippon Mining & Metals Corporation | Sintered sputtering target made of refractory metals |
| US8133367B1 (en) | 2006-08-11 | 2012-03-13 | Raytheon Company | Sputtering system and method using a loose granular sputtering target |
| WO2008084867A1 (ja) * | 2007-01-10 | 2008-07-17 | Nec Corporation | 半導体装置及びその製造方法 |
| ZA200800816B (en) * | 2007-01-29 | 2008-12-31 | Nippon Mining Co | Method for producing ammonium hexachlororuther ate and ruthenium powder, as well as ammonium hexachlororuthenate |
| DE102007020142A1 (de) | 2007-04-26 | 2008-10-30 | Bayer Materialscience Ag | Verfahren zur Rückgewinnung von Ruthenium aus einem rutheniumhaltigen geträgerten Katalysatormaterial |
| KR100884369B1 (ko) * | 2007-05-14 | 2009-02-18 | 진인수 | 폐촉매 등에서 회수한 루테늄의 정제방법 |
| KR100885698B1 (ko) * | 2007-08-17 | 2009-02-26 | 희성금속 주식회사 | 단상구조를 갖는 고온재료용 Ru계 금속간화합물의제조방법 |
| KR100898746B1 (ko) * | 2007-08-17 | 2009-05-25 | 희성금속 주식회사 | 분말야금법을 이용한 고밀도 단상의 RuAl 금속간화합물제조방법 |
| US8118906B2 (en) * | 2007-10-29 | 2012-02-21 | Heraeus Inc. | Methodology for recycling Ru and Ru-alloy deposition targets and targets made of recycled Ru and Ru-based alloy powders |
| DE102008006797B4 (de) * | 2008-01-30 | 2014-05-22 | Heraeus Precious Metals Gmbh & Co. Kg | Verfahren und Vorrichtungen zum Entfernen von Ruthenium durch Destillation als RuO4 aus ruthenathaltigen Lösungen |
| DE102008006796A1 (de) * | 2008-01-30 | 2009-08-27 | W.C. Heraeus Gmbh | Verfahren zum Gewinnen von Ruthenium aus Ruthenium oder Rutheniumoxide enthaltenden Materialien oder rutheniumhaltigen Edelmetall-Erzkonzentraten |
| JP4514807B2 (ja) * | 2008-04-10 | 2010-07-28 | 山本貴金属地金株式会社 | 貴金属微粒子の製造方法 |
| JP4576470B1 (ja) * | 2009-05-29 | 2010-11-10 | 田中貴金属工業株式会社 | 塩化ルテニウム酸アンモニウムの製造方法 |
| KR101175676B1 (ko) * | 2010-03-25 | 2012-08-22 | 희성금속 주식회사 | 폐 루테늄(Ru) 타겟을 이용한 고순도화 및 미세화된 루테늄(Ru)분말 제조법 |
| CN101891261A (zh) * | 2010-08-31 | 2010-11-24 | 郴州高鑫铂业有限公司 | 一种粗钌粉制备三氯化钌的方法 |
| KR101335353B1 (ko) * | 2011-05-25 | 2013-12-02 | 성일하이텍(주) | 함(含)루테늄 금속 및 산화물 스크랩으로 부터 삼염화루테늄의 제조 방법 |
| KR101300778B1 (ko) | 2011-06-09 | 2013-08-29 | 성일하이텍(주) | 수소환원법을 이용한 루테늄 분말 제조 방법 |
| CN102605332A (zh) * | 2012-03-25 | 2012-07-25 | 昆明贵金属研究所 | 一种高纯Ru溅射靶及制备方法 |
| US10319571B2 (en) | 2012-07-30 | 2019-06-11 | Jx Nippon Mining & Metals Corporation | Ruthenium sputtering target and ruthenium alloy sputtering target |
| WO2014024358A1 (ja) * | 2012-08-10 | 2014-02-13 | キヤノンアネルバ株式会社 | トンネル磁気抵抗素子の製造装置 |
| CN103223493B (zh) * | 2013-04-02 | 2015-06-17 | 贵研资源(易门)有限公司 | 一种制备靶用钌粉的方法 |
| CN105705672A (zh) | 2013-11-06 | 2016-06-22 | 三井金属矿业株式会社 | 溅射靶 |
| CN104032270B (zh) * | 2014-06-12 | 2016-05-04 | 贵研铂业股份有限公司 | 一种大尺寸钌基合金溅射靶材及其制备方法 |
| EP3243914B1 (de) | 2016-05-13 | 2018-10-17 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur herstellung von partikulärem ruthenium |
| WO2018094311A1 (en) * | 2016-11-21 | 2018-05-24 | Materion Corporation | Ruthenium alloys for biosensors |
| US20220316996A1 (en) * | 2019-06-21 | 2022-10-06 | Tokuyama Corporation | Ruthenium oxide gas absorbent liquid, analysis method for ruthenium oxide, trap device, and quantitative analyzer |
| CN110919019A (zh) * | 2019-12-02 | 2020-03-27 | 河南东微电子材料有限公司 | 一种高纯钌粉的制备方法 |
| CN112758996B (zh) * | 2020-12-14 | 2022-04-19 | 清华大学 | 一种双功能氧电催化剂及其制备和应用 |
| CN114289727A (zh) * | 2021-12-09 | 2022-04-08 | 贵研铂业股份有限公司 | 一种高均质微粒径高纯钌粉及其制备方法 |
| CN116463123A (zh) * | 2023-04-27 | 2023-07-21 | 北京智慧能源研究院 | 含钌催化剂的刻蚀液、改性和回收方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1304297A (fr) * | 1961-10-20 | 1962-09-21 | Mond Nickel Co Ltd | Perfectionnements à la fabrication du ruthénium |
| US4731110A (en) * | 1987-03-16 | 1988-03-15 | Gte Products Corp. | Hydrometallurigcal process for producing finely divided spherical precious metal based powders |
| JP2503496B2 (ja) * | 1987-03-31 | 1996-06-05 | 石川島播磨重工業株式会社 | 放射性廃棄物からのルテニウム回収方法 |
| JP2685758B2 (ja) * | 1987-08-28 | 1997-12-03 | 田中貴金属工業株式会社 | ルテニウム中に含有されるオスミウムの除去方法 |
| JP3303065B2 (ja) * | 1995-01-24 | 2002-07-15 | 三菱マテリアル株式会社 | Ru薄膜形成用スパッタリングターゲット |
| JPH0941131A (ja) * | 1995-07-31 | 1997-02-10 | Mitsubishi Materials Corp | 高純度IrまたはRuスパッタリングターゲットの製造方法 |
| JP4058777B2 (ja) * | 1997-07-31 | 2008-03-12 | 日鉱金属株式会社 | 薄膜形成用高純度ルテニウム焼結体スパッタリングターゲット及び同ターゲットをスパッタリングすることによって形成される薄膜 |
| JPH1161392A (ja) * | 1997-08-20 | 1999-03-05 | Tanaka Kikinzoku Kogyo Kk | Ru薄膜形成用スパッタリングターゲットの製造方法 |
-
1998
- 1998-07-14 JP JP10198766A patent/JP2000034563A/ja active Pending
-
1999
- 1999-07-14 KR KR1020007002631A patent/KR100319223B1/ko not_active Expired - Fee Related
- 1999-07-14 EP EP99929828A patent/EP1026283B1/de not_active Expired - Lifetime
- 1999-07-14 DE DE69937224T patent/DE69937224T2/de not_active Expired - Lifetime
- 1999-07-14 WO PCT/JP1999/003795 patent/WO2000004202A1/ja not_active Ceased
- 1999-07-14 AT AT99929828T patent/ATE374846T1/de not_active IP Right Cessation
- 1999-07-14 US US09/508,256 patent/US6284013B1/en not_active Expired - Fee Related
- 1999-08-05 TW TW088112035A patent/TW452602B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE69937224T2 (de) | 2008-01-10 |
| EP1026283A4 (de) | 2005-01-26 |
| JP2000034563A (ja) | 2000-02-02 |
| US6284013B1 (en) | 2001-09-04 |
| EP1026283A1 (de) | 2000-08-09 |
| DE69937224D1 (de) | 2007-11-15 |
| WO2000004202A1 (en) | 2000-01-27 |
| EP1026283B1 (de) | 2007-10-03 |
| TW452602B (en) | 2001-09-01 |
| KR20010023932A (ko) | 2001-03-26 |
| KR100319223B1 (ko) | 2002-01-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |