ATE374847T1 - Anlage zum behandeln von substraten - Google Patents

Anlage zum behandeln von substraten

Info

Publication number
ATE374847T1
ATE374847T1 AT03076554T AT03076554T ATE374847T1 AT E374847 T1 ATE374847 T1 AT E374847T1 AT 03076554 T AT03076554 T AT 03076554T AT 03076554 T AT03076554 T AT 03076554T AT E374847 T1 ATE374847 T1 AT E374847T1
Authority
AT
Austria
Prior art keywords
vacuum
process chamber
substrates
permitting
assembly
Prior art date
Application number
AT03076554T
Other languages
English (en)
Inventor
Marinus Franciscus Johan Evers
Peter Brier
Leonardus Peterus Mari Clijsen
Original Assignee
Otb Group Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otb Group Bv filed Critical Otb Group Bv
Application granted granted Critical
Publication of ATE374847T1 publication Critical patent/ATE374847T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AT03076554T 2002-05-21 2003-05-20 Anlage zum behandeln von substraten ATE374847T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1020633A NL1020633C2 (nl) 2002-05-21 2002-05-21 Samenstel voor het behandelen van substraten.

Publications (1)

Publication Number Publication Date
ATE374847T1 true ATE374847T1 (de) 2007-10-15

Family

ID=29398574

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03076554T ATE374847T1 (de) 2002-05-21 2003-05-20 Anlage zum behandeln von substraten

Country Status (9)

Country Link
US (1) US7351292B2 (de)
EP (1) EP1365040B1 (de)
JP (1) JP4578784B2 (de)
KR (1) KR20030091719A (de)
AT (1) ATE374847T1 (de)
DE (1) DE60316624T2 (de)
ES (1) ES2292901T3 (de)
NL (1) NL1020633C2 (de)
TW (1) TWI248980B (de)

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WO2007067030A1 (en) * 2005-12-07 2007-06-14 Otb Group B.V. System and method for coating substrates and obtained products
WO2009060540A1 (ja) * 2007-11-09 2009-05-14 Canon Anelva Corporation インライン型ウェハ搬送装置
CN101441278A (zh) * 2007-11-20 2009-05-27 鸿富锦精密工业（深圳）有限公司 固持装置及固持方法
US20090324368A1 (en) * 2008-06-27 2009-12-31 Applied Materials, Inc. Processing system and method of operating a processing system
NL2001910C (en) * 2008-08-22 2010-03-10 Otb Solar Bv Conveyor assembly and method for conveying a substrate.
US7897525B2 (en) * 2008-12-31 2011-03-01 Archers Inc. Methods and systems of transferring, docking and processing substrates
US20100162954A1 (en) * 2008-12-31 2010-07-01 Lawrence Chung-Lai Lei Integrated facility and process chamber for substrate processing
US8367565B2 (en) * 2008-12-31 2013-02-05 Archers Inc. Methods and systems of transferring, docking and processing substrates
US20100162955A1 (en) * 2008-12-31 2010-07-01 Lawrence Chung-Lai Lei Systems and methods for substrate processing
US8101054B2 (en) * 2009-05-28 2012-01-24 Wd Media, Inc. Magnetic particle trapper for a disk sputtering system
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NL2003514C2 (en) 2009-09-18 2011-03-21 Otb Solar Bv Thin film deposition apparatus and method for the same.
US8865259B2 (en) * 2010-04-26 2014-10-21 Singulus Mocvd Gmbh I.Gr. Method and system for inline chemical vapor deposition
NL2006113C2 (en) 2011-02-01 2012-08-02 Otb Solar Bv Water inspection system.
CN103205725A (zh) * 2012-01-17 2013-07-17 上海北玻镀膜技术工业有限公司 单元式溅射抽气模块
EP2839052A4 (de) 2012-04-19 2015-06-10 Intevac Inc Doppelmaskenanordnung zur solarzellenherstellung
MY170824A (en) * 2012-04-26 2019-09-04 Intevac Inc System architecture for vacuum processing
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
EP2746880B1 (de) * 2012-12-21 2018-04-25 Robert Bosch Gmbh Ladungsträgersynchronisierung eines Fördersystems einer Maschine
EP2746200B2 (de) 2012-12-21 2018-09-12 Robert Bosch Gmbh Vorrichtung und Verfahren zur Steuerung von Trägern in einer Maschine
EP2746882B1 (de) 2012-12-21 2018-09-05 Robert Bosch Gmbh Fördersystem einer Maschine
EP2746201B1 (de) 2012-12-21 2015-09-30 Robert Bosch Gmbh Vorrichtung und Verfahren zur Förderung von Trägern in einer Maschine
TWI468544B (zh) * 2013-08-30 2015-01-11 Substrate transfer and processing system and its equipment
TWI468543B (zh) * 2013-08-30 2015-01-11 亞智科技股份有限公司 Substrate transfer and processing system and substrate transfer and processing methods
TWI662646B (zh) 2014-08-05 2019-06-11 美商因特瓦克公司 植入用遮罩及其對準
DE102015113962A1 (de) * 2015-08-24 2017-03-02 Meyer Burger (Germany) Ag Substratbehandlungsvorrichtung
US9862006B2 (en) 2015-12-29 2018-01-09 Solarcity Corporation Systems for levitating a metallic tray
JP7231721B2 (ja) 2018-10-04 2023-03-01 アプライド マテリアルズ インコーポレイテッド 搬送システム
US11521870B2 (en) * 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber
CN117242559A (zh) * 2021-03-11 2023-12-15 应用材料公司 用于制造微型led显示器的系统及方法
TWI883497B (zh) * 2023-08-02 2025-05-11 友威科技股份有限公司 雙效電漿蝕刻的連續式製程機構

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Also Published As

Publication number Publication date
DE60316624T2 (de) 2008-07-24
JP2004040089A (ja) 2004-02-05
ES2292901T3 (es) 2008-03-16
US20040049308A1 (en) 2004-03-11
NL1020633C2 (nl) 2003-11-24
KR20030091719A (ko) 2003-12-03
TWI248980B (en) 2006-02-11
EP1365040A1 (de) 2003-11-26
US7351292B2 (en) 2008-04-01
EP1365040B1 (de) 2007-10-03
TW200401046A (en) 2004-01-16
DE60316624D1 (de) 2007-11-15
JP4578784B2 (ja) 2010-11-10

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Legal Events

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