ATE375542T1 - Kühlung für elektrische oder elektronische bauelemente , insbesondere für rechnereinheiten - Google Patents

Kühlung für elektrische oder elektronische bauelemente , insbesondere für rechnereinheiten

Info

Publication number
ATE375542T1
ATE375542T1 AT03713084T AT03713084T ATE375542T1 AT E375542 T1 ATE375542 T1 AT E375542T1 AT 03713084 T AT03713084 T AT 03713084T AT 03713084 T AT03713084 T AT 03713084T AT E375542 T1 ATE375542 T1 AT E375542T1
Authority
AT
Austria
Prior art keywords
electrical
cooling
casing
electronic components
computer units
Prior art date
Application number
AT03713084T
Other languages
English (en)
Inventor
Der Werff Jan Van
Original Assignee
J Van Der Werff Holding B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by J Van Der Werff Holding B V filed Critical J Van Der Werff Holding B V
Application granted granted Critical
Publication of ATE375542T1 publication Critical patent/ATE375542T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
AT03713084T 2002-05-31 2003-03-11 Kühlung für elektrische oder elektronische bauelemente , insbesondere für rechnereinheiten ATE375542T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1020727 2002-05-31

Publications (1)

Publication Number Publication Date
ATE375542T1 true ATE375542T1 (de) 2007-10-15

Family

ID=29707799

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03713084T ATE375542T1 (de) 2002-05-31 2003-03-11 Kühlung für elektrische oder elektronische bauelemente , insbesondere für rechnereinheiten

Country Status (13)

Country Link
US (1) US7813129B2 (de)
EP (1) EP1512062B1 (de)
JP (1) JP2005536869A (de)
KR (1) KR100986948B1 (de)
AT (1) ATE375542T1 (de)
AU (1) AU2003221263A1 (de)
CY (1) CY1108858T1 (de)
DE (1) DE60316801T2 (de)
DK (1) DK1512062T3 (de)
ES (1) ES2295568T3 (de)
PT (1) PT1512062E (de)
WO (1) WO2003102746A2 (de)
ZA (1) ZA200409696B (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE527918C2 (sv) * 2004-12-22 2006-07-11 Dometic Sweden Ab Apparatlåda för dator samt dator innefattande en sådan apparatlåda
JP4493611B2 (ja) 2005-12-13 2010-06-30 富士通株式会社 電子機器
US7379299B2 (en) * 2006-03-17 2008-05-27 Kell Systems Noiseproofed and ventilated enclosure for electronics equipment
US7379298B2 (en) * 2006-03-17 2008-05-27 Kell Systems Noise proofed ventilated air intake chamber for electronics equipment enclosure
US8016927B2 (en) * 2007-04-11 2011-09-13 Hewlett-Packard Development Company, L.P. Computing device filter system
WO2009142644A1 (en) * 2008-05-23 2009-11-26 Hewlett-Packard Development Company, L.P. Computer chassis
US9426903B1 (en) * 2008-06-27 2016-08-23 Amazon Technologies, Inc. Cooling air stack for computer equipment
US20100175554A1 (en) * 2009-01-15 2010-07-15 Dell Products L.P. Cooling system with debris filtering
CN102135117A (zh) * 2010-01-23 2011-07-27 富准精密工业(深圳)有限公司 离心风扇
US7952857B1 (en) * 2010-02-22 2011-05-31 Motley Gregory O Arc-resistant switchgear enclosure with ambient air ventilation system
US8335081B2 (en) 2010-07-16 2012-12-18 Rockwell Automation Technologies, Inc. Heat sink cooling arrangement for multiple power electronic circuits
US8325478B2 (en) * 2010-07-16 2012-12-04 Rockwell Automation Technologies, Inc. Cooling duct attachment and sealing for a motor drive
US8325479B2 (en) * 2010-07-16 2012-12-04 Rockwell Automation Technologies, Inc. Motor drive cooling duct system and method
US8184434B2 (en) * 2010-08-19 2012-05-22 M & A Technology Inc. Video/audio computer display processor
JP5348623B2 (ja) 2010-09-10 2013-11-20 株式会社安川電機 電子機器装置
US8593760B2 (en) 2011-04-28 2013-11-26 Entrotech, Inc. Hard disk drives with electrical connectors comprising a flexible circuit extending through an opening in the base and related methods
US9466335B2 (en) 2011-04-28 2016-10-11 Entrotech, Inc. Hermetic hard disk drives comprising integrally molded filters and related methods
US8837080B2 (en) 2011-04-28 2014-09-16 Entrotech, Inc. Hard disk drives with composite housings and related methods
US8427787B2 (en) 2011-04-28 2013-04-23 Entrotech, Inc. Hard disk drives with improved exiting regions for electrical connectors and related methods
US8599514B2 (en) 2011-04-28 2013-12-03 Entrotech, Inc. Stabilization of components within hard disk drives and related methods
US8533934B2 (en) 2011-04-28 2013-09-17 Entrotech, Inc. Method of assembling a hard disk drive
US9190115B2 (en) 2011-04-28 2015-11-17 Entrotech, Inc. Method of assembling a disk drive
JP5861509B2 (ja) * 2012-03-13 2016-02-16 富士電機株式会社 半導体電力変換装置の排気ファン支持構造
US9125302B2 (en) * 2012-04-23 2015-09-01 Emerson Network Power, Energy Systems, North America, Inc. Electronic equipment enclosures and methods related thereto
DE102014101611A1 (de) * 2014-02-10 2015-08-13 Fujitsu Technology Solutions Intellectual Property Gmbh Kühlanordnung für eine partikelfreie Kühlung eines Computersystems
EP3134898A4 (de) 2014-04-22 2017-12-13 Entrotech, Inc. Nachbearbeitbare festplattenlaufwerke, gehäuseabdichtungen dafür und zugehörige verfahren
US10002645B2 (en) 2014-06-09 2018-06-19 Entrotech, Inc. Laminate-wrapped hard disk drives and related methods
US10993353B2 (en) * 2014-09-29 2021-04-27 Hewlett Packard Enterprise Development Lp Fan controlled ambient air cooling of equipment in a controlled airflow environment
CN105697396A (zh) * 2014-11-25 2016-06-22 台达电子工业股份有限公司 离心式风扇
US10718342B2 (en) 2014-11-25 2020-07-21 Delta Electronics, Inc. Centrifugal fan comprising a sidewall and plurality of air deflectors forming a plurality of airflow entry tunnels to sequentially expand a flow channel outwardly in a radial direction
CN105992486A (zh) * 2015-01-28 2016-10-05 鸿富锦精密工业(武汉)有限公司 散热模组
US9601161B2 (en) 2015-04-15 2017-03-21 entroteech, inc. Metallically sealed, wrapped hard disk drives and related methods
US9832912B2 (en) 2015-05-07 2017-11-28 Dhk Storage, Llc Computer server heat regulation utilizing integrated precision air flow
JP6538607B2 (ja) 2016-03-31 2019-07-03 株式会社ソニー・インタラクティブエンタテインメント 電子機器
US10433464B1 (en) * 2016-06-06 2019-10-01 ZT Group Int'l, Inc. Air duct for cooling a rear-mounted switch in a rack
US10388327B2 (en) * 2017-02-28 2019-08-20 Western Digital Technologies, Inc. Fan noise attenuation at hard disk drive in rack-mount
JP7181443B2 (ja) * 2018-02-14 2022-12-01 日本電産サンキョー株式会社 冷却装置
US11152283B2 (en) * 2018-11-15 2021-10-19 Hewlett Packard Enterprise Development Lp Rack and row-scale cooling
US11015608B2 (en) 2018-12-10 2021-05-25 Hewlett Packard Enterprise Development Lp Axial flow pump with reduced height dimension
CN111787719B (zh) * 2020-07-14 2021-06-29 湖北皓天智通科技有限公司 一种便于拆装的机房一体化机柜
TWI768882B (zh) * 2021-05-07 2022-06-21 緯穎科技服務股份有限公司 具有伸縮裝置的伺服器機箱、及具有伸縮裝置的伺服器
CN114321582B (zh) * 2021-11-30 2024-04-02 中建八局第一建设有限公司 一种节能环保的建筑机电设备安装固定装置
DE102022117314A1 (de) * 2022-07-12 2024-01-18 Andreas Seibold Vorrichtung zum austausch von wärmeenergie mit der umgebungsluft
CN117812903B (zh) * 2024-02-28 2024-05-17 英莱德科技股份公司 一种智慧政务自助服务终端装置

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1884898A (en) * 1930-05-07 1932-10-25 Joseph Porzel Air circulating and temperature changing unit
US3829250A (en) 1971-09-22 1974-08-13 Torin Corp Blower assembly
US4838762A (en) * 1988-04-11 1989-06-13 General Motors Corporation Fan body and rotor cup assembly
US4944654A (en) * 1989-05-15 1990-07-31 Carrier Corporation Split scroll for centrifugal blower
GB2241118A (en) * 1990-02-15 1991-08-21 Ibm Electrical apparatus with forced air cooling
US5107398A (en) * 1990-05-30 1992-04-21 Digital Equipment Corporation Cooling system for computers
JPH051829A (ja) * 1991-06-24 1993-01-08 Brother Ind Ltd 移動式空気調和装置
US5158741A (en) * 1991-08-16 1992-10-27 General Electric Company Passive cooling system for top entry liquid metal cooled nuclear reactors
JP3293104B2 (ja) * 1992-02-20 2002-06-17 株式会社デンソー 多翼送風機
JP3069819B2 (ja) 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
JPH0786779A (ja) * 1993-06-22 1995-03-31 Mitsubishi Cable Ind Ltd 密閉筐体の熱交換装置
JPH07269490A (ja) * 1994-03-31 1995-10-17 Nippon Densan Corp 送風機
US5409352A (en) 1994-04-18 1995-04-25 Lin; Mike CPU heat dissipating device
GB2293487B (en) * 1994-09-21 1998-08-12 Hewlett Packard Co Method and apparatus for attaching a heat sink and a fan to an intergrated circuit package
JP3784333B2 (ja) * 1995-05-31 2006-06-07 山洋電気株式会社 電子部品冷却装置
US5566377A (en) * 1995-07-10 1996-10-15 Lee; Richard Heat dissipating apparatus
US5588803A (en) * 1995-12-01 1996-12-31 General Motors Corporation Centrifugal impeller with simplified manufacture
JPH09172113A (ja) 1995-12-18 1997-06-30 Nec Corp 半導体装置用ヒートシンク
US6011299A (en) * 1996-07-24 2000-01-04 Digital Equipment Corporation Apparatus to minimize integrated circuit heatsink E.M.I. radiation
US5664624A (en) 1996-11-04 1997-09-09 Chin-Fu Tsai Sloped wall type heat radiating member for chip
GB2322962B (en) * 1997-03-03 2001-10-10 Motor One Electronics Inc Heat dissipating fan/integrated circuit assemblies
JP4269092B2 (ja) * 1997-05-21 2009-05-27 Ｔｏｔｏ株式会社 多翼遠心ファン
US5876278A (en) * 1997-05-29 1999-03-02 Cheng; Henry Cooling device
US6141213A (en) 1997-06-24 2000-10-31 Sun Microsystems, Inc. Computer with high airflow and low acoustic noise
US5927947A (en) * 1997-12-08 1999-07-27 Ford Motor Company Dynamically balanced centrifugal fan
JP2911441B1 (ja) * 1998-04-03 1999-06-23 伊藤 さとみ ヒートパイプ及びその製造方法とそれを用いた放熱構造
PL355228A1 (en) * 1999-06-01 2004-04-05 Volker Dalheimer Housing system for housing electronic components, especially a flat desktop pc or multimedia housing
US6695038B2 (en) * 1999-09-02 2004-02-24 Advanced Rotary Systems, Llc Heat exchanger type fan
JP2001111277A (ja) * 1999-10-05 2001-04-20 Toshiba Corp 遠心ファンとそれを用いた電子機器
JP2001153090A (ja) * 1999-12-01 2001-06-05 Toshiba Home Technology Corp 冷却ファンモータ
JP2002048085A (ja) * 2000-07-28 2002-02-15 Mitsubishi Electric Corp 多連型多翼送風機用羽根車、多連型多翼送風機および空気調和機
US20020062947A1 (en) * 2000-11-07 2002-05-30 O'connor John F. Centrifugal impeller
TW590169U (en) * 2000-12-27 2004-06-01 Delta Electronics Inc Embedded centrifugal cooling device
DE20107242U1 (de) * 2001-04-26 2001-07-12 Joker GmbH, 82256 Fürstenfeldbruck Filterlüfter
JP2003008272A (ja) * 2001-06-25 2003-01-10 Nec Corp 防塵用フイルタ搭載電子装置
US6664673B2 (en) * 2001-08-27 2003-12-16 Advanced Rotary Systems Llc Cooler for electronic devices
US7071587B2 (en) * 2001-09-07 2006-07-04 Rotys Inc. Integrated cooler for electronic devices
US6884033B2 (en) * 2003-09-29 2005-04-26 Cheng Home Electronics Co., Ltd. Volute inlet of fan
US6980434B2 (en) * 2003-10-22 2005-12-27 Chieh Ou Yang Computer fan assembly mechanism having filtering and sterilizing functions
US7108482B2 (en) * 2004-01-23 2006-09-19 Robert Bosch Gmbh Centrifugal blower
TWI257837B (en) * 2004-06-11 2006-07-01 Quanta Comp Inc Dissipation module with noise reduction function
TWM309846U (en) * 2006-10-12 2007-04-11 Quanta Comp Inc Heat dissipation device

Also Published As

Publication number Publication date
AU2003221263A1 (en) 2003-12-19
AU2003221263A8 (en) 2003-12-19
US7813129B2 (en) 2010-10-12
KR20050029125A (ko) 2005-03-24
WO2003102746A2 (en) 2003-12-11
KR100986948B1 (ko) 2010-10-12
WO2003102746A3 (en) 2004-04-29
EP1512062A2 (de) 2005-03-09
PT1512062E (pt) 2008-01-15
CY1108858T1 (el) 2014-07-02
ES2295568T3 (es) 2008-04-16
EP1512062B1 (de) 2007-10-10
DK1512062T3 (da) 2008-02-04
WO2003102746B1 (en) 2004-06-03
JP2005536869A (ja) 2005-12-02
DE60316801T2 (de) 2008-07-17
DE60316801D1 (de) 2007-11-22
ZA200409696B (en) 2005-09-29
US20060120045A1 (en) 2006-06-08

Similar Documents

Publication Publication Date Title
DE60316801D1 (de) Kühlung für elektrische oder elektronische bauelemente , insbesondere für rechnereinheiten
US8693184B2 (en) Electronic apparatus
ATE485452T1 (de) Lüfter mit einem sensor
US8248783B2 (en) Heat dissipation system
US8405987B2 (en) Cooling system for electronic device and electronic device having same
ATE488701T1 (de) Lüfter mit einer leiterplatte
US8659891B2 (en) Heat dissipation system
MXPA05000648A (es) Bomba de fluido electronica.
TWI263735B (en) Heat-dissipating device
CN102445960A (zh) 电脑机箱
JP2007102671A (ja) 電子機器
EP1703783A3 (de) Elektronisches Gerät, Gebläse-Einheit und Baugruppenträger
CN102480901A (zh) 气流引导结构及应用其的电子装置
US9410550B2 (en) Air-extracting type heat dissipating apparatus
CN1276697C (zh) 空气导管和采用这种空气导管的电子设备
US10975888B2 (en) Fan
US20140187141A1 (en) Heat dissipation apparatus for expansion base
CN218332452U (zh) 一种电力大数据服务器的散热机箱
CN2479549Y (zh) 降低系统噪声的改进型构件
KR910003338A (ko) 냉각장치
CN2514403Y (zh) 计算机散热风扇
US20070128019A1 (en) Blower
TW200505322A (en) Housing for a heat dissipating fan
CN101061768B (zh) 用于电子装置的通风机箱和刀片机箱
ATE241895T1 (de) Gehäuse mit einer lüftereinheit und lüftereinheit

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1512062

Country of ref document: EP