ATE384333T1 - Prozesskammer mit einer reflektierenden heizplatte - Google Patents

Prozesskammer mit einer reflektierenden heizplatte

Info

Publication number
ATE384333T1
ATE384333T1 AT00941486T AT00941486T ATE384333T1 AT E384333 T1 ATE384333 T1 AT E384333T1 AT 00941486 T AT00941486 T AT 00941486T AT 00941486 T AT00941486 T AT 00941486T AT E384333 T1 ATE384333 T1 AT E384333T1
Authority
AT
Austria
Prior art keywords
process chamber
base plate
heating plate
insulator
lid
Prior art date
Application number
AT00941486T
Other languages
English (en)
Inventor
Jae Lee
Lovell Chase
Original Assignee
Asml Holding Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Holding Nv filed Critical Asml Holding Nv
Application granted granted Critical
Publication of ATE384333T1 publication Critical patent/ATE384333T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection

Landscapes

  • Thermal Insulation (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
  • Baking, Grill, Roasting (AREA)
  • Resistance Heating (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Constitution Of High-Frequency Heating (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AT00941486T 1999-06-16 2000-06-16 Prozesskammer mit einer reflektierenden heizplatte ATE384333T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13956099P 1999-06-16 1999-06-16
US20361200P 2000-05-10 2000-05-10
US09/593,270 US6416318B1 (en) 1999-06-16 2000-06-13 Process chamber assembly with reflective hot plate and pivoting lid

Publications (1)

Publication Number Publication Date
ATE384333T1 true ATE384333T1 (de) 2008-02-15

Family

ID=27385360

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00941486T ATE384333T1 (de) 1999-06-16 2000-06-16 Prozesskammer mit einer reflektierenden heizplatte

Country Status (8)

Country Link
US (1) US6416318B1 (de)
EP (1) EP1186007B1 (de)
JP (1) JP4045098B2 (de)
KR (2) KR100537230B1 (de)
AT (1) ATE384333T1 (de)
AU (1) AU5619000A (de)
DE (1) DE60037806T2 (de)
WO (1) WO2000077833A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6838115B2 (en) * 2000-07-12 2005-01-04 Fsi International, Inc. Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices
US20030173346A1 (en) * 2002-03-18 2003-09-18 Renken Wayne Glenn System and method for heating and cooling wafer at accelerated rates
US6884066B2 (en) * 2002-09-10 2005-04-26 Fsi International, Inc. Thermal process station with heated lid
US6891134B2 (en) * 2003-02-10 2005-05-10 Asml Netherlands B.V. Integrally formed bake plate unit for use in wafer fabrication system
US6994544B2 (en) * 2004-01-30 2006-02-07 Texas Instruments Incorporated Wafer scale thermal stress fixture and method
KR100601979B1 (ko) * 2004-12-30 2006-07-18 삼성전자주식회사 반도체 웨이퍼의 베이킹 장치
JP4707593B2 (ja) * 2006-03-23 2011-06-22 大日本スクリーン製造株式会社 熱処理装置と基板吸着方法
US9581255B2 (en) 2012-07-23 2017-02-28 Henning, Inc. Multiple proportion delivery systems and methods

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60119711A (ja) 1983-12-02 1985-06-27 Hitachi Ltd 気相反応装置
JPH07114185B2 (ja) 1986-11-05 1995-12-06 日本電気株式会社 基板加熱装置
JPS63260146A (ja) 1987-04-17 1988-10-27 Nippon Maikuronikusu:Kk 半導体ウエハ測定装置
JPH01310555A (ja) * 1988-06-08 1989-12-14 Mitsubishi Electric Corp ウエハ収納ケース
US5011794A (en) * 1989-05-01 1991-04-30 At&T Bell Laboratories Procedure for rapid thermal annealing of implanted semiconductors
JP3044735B2 (ja) 1990-03-30 2000-05-22 ソニー株式会社 スパッタリング装置
US5223113A (en) 1990-07-20 1993-06-29 Tokyo Electron Limited Apparatus for forming reduced pressure and for processing object
JP2890087B2 (ja) * 1993-06-10 1999-05-10 東京エレクトロン株式会社 処理装置
TW444922U (en) 1994-09-29 2001-07-01 Tokyo Electron Ltd Heating device and the processing device using the same
DE19622322C2 (de) 1995-06-15 1999-02-25 Toshiba Ceramics Co Vorrichtung zum Züchten aus der Dampfphase
US5885353A (en) * 1996-06-21 1999-03-23 Micron Technology, Inc. Thermal conditioning apparatus
US5756157A (en) * 1996-10-02 1998-05-26 Silicon Valley Group Method for processing flat panel displays and large wafers
US6050446A (en) 1997-07-11 2000-04-18 Applied Materials, Inc. Pivoting lid assembly for a chamber
US6086362A (en) * 1998-05-20 2000-07-11 Applied Komatsu Technology, Inc. Multi-function chamber for a substrate processing system

Also Published As

Publication number Publication date
WO2000077833A2 (en) 2000-12-21
JP2003502838A (ja) 2003-01-21
KR20050053735A (ko) 2005-06-08
DE60037806D1 (de) 2008-03-06
DE60037806T2 (de) 2009-01-15
KR100537230B1 (ko) 2005-12-16
AU5619000A (en) 2001-01-02
US6416318B1 (en) 2002-07-09
JP4045098B2 (ja) 2008-02-13
KR100564889B1 (ko) 2006-03-30
KR20020019088A (ko) 2002-03-09
EP1186007B1 (de) 2008-01-16
WO2000077833A3 (en) 2001-07-12
EP1186007A2 (de) 2002-03-13

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Legal Events

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