ATE387987T1 - Vorrichtung zur hochgenauen bearbeitung der oberfläche eines objektes, insbesondere zum polieren und läppen von halbleitersubstraten - Google Patents

Vorrichtung zur hochgenauen bearbeitung der oberfläche eines objektes, insbesondere zum polieren und läppen von halbleitersubstraten

Info

Publication number
ATE387987T1
ATE387987T1 AT04704541T AT04704541T ATE387987T1 AT E387987 T1 ATE387987 T1 AT E387987T1 AT 04704541 T AT04704541 T AT 04704541T AT 04704541 T AT04704541 T AT 04704541T AT E387987 T1 ATE387987 T1 AT E387987T1
Authority
AT
Austria
Prior art keywords
accommodation
polishing
semiconductor substrates
rings
highly precise
Prior art date
Application number
AT04704541T
Other languages
English (en)
Inventor
Volker Herold
Christian-Toralf Weber
Juergen Weiser
Original Assignee
Igam Ingenieurgesellschaft Fue
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Igam Ingenieurgesellschaft Fue filed Critical Igam Ingenieurgesellschaft Fue
Application granted granted Critical
Publication of ATE387987T1 publication Critical patent/ATE387987T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT04704541T 2003-01-27 2004-01-23 Vorrichtung zur hochgenauen bearbeitung der oberfläche eines objektes, insbesondere zum polieren und läppen von halbleitersubstraten ATE387987T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10303407A DE10303407A1 (de) 2003-01-27 2003-01-27 Verfahren und Vorrichtung zur hochgenauen Bearbeitung der Oberfläche eines Objektes, insbesondere zum Polieren und Läppen von Halbleitersubstraten

Publications (1)

Publication Number Publication Date
ATE387987T1 true ATE387987T1 (de) 2008-03-15

Family

ID=32730595

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04704541T ATE387987T1 (de) 2003-01-27 2004-01-23 Vorrichtung zur hochgenauen bearbeitung der oberfläche eines objektes, insbesondere zum polieren und läppen von halbleitersubstraten

Country Status (6)

Country Link
US (1) US7160177B2 (de)
EP (1) EP1587649B1 (de)
JP (1) JP2006513050A (de)
AT (1) ATE387987T1 (de)
DE (3) DE10303407A1 (de)
WO (1) WO2004067228A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7131891B2 (en) 2003-04-28 2006-11-07 Micron Technology, Inc. Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
DE102005016411B4 (de) * 2005-04-08 2007-03-29 IGAM Ingenieurgesellschaft für angewandte Mechanik mbH Vorrichtung zur hochgenauen Oberflächenbearbeitung eines Werkstückes
KR101334012B1 (ko) * 2005-07-25 2013-12-02 호야 가부시키가이샤 마스크 블랭크용 기판의 제조방법, 마스크 블랭크의제조방법 및 마스크의 제조방법
JP2007054944A (ja) * 2005-07-25 2007-03-08 Hoya Corp マスクブランク用基板の製造方法、マスクブランクの製造方法及びマスクの製造方法
DE102006057075A1 (de) * 2006-11-30 2008-06-05 Friedrich-Schiller-Universität Jena Verfahren und Vorrichtung zur Messung der Form eines Wafer-Chucks
DE102008029931A1 (de) 2008-06-26 2009-12-31 Veikko Galazky Vorrichtung zur Oberflächenbearbeitung eines Werkstückes
US20120122373A1 (en) * 2010-11-15 2012-05-17 Stmicroelectronics, Inc. Precise real time and position low pressure control of chemical mechanical polish (cmp) head
JP6148532B2 (ja) * 2013-05-08 2017-06-14 東京応化工業株式会社 貼付装置及び貼付方法
JP2014223684A (ja) * 2013-05-15 2014-12-04 株式会社東芝 研磨装置および研磨方法
CN103398673B (zh) * 2013-08-06 2016-03-30 中国科学院光电技术研究所 一种基于fpga的能动磨盘动态面形采集系统及方法
DE102014109654B4 (de) 2014-07-10 2022-05-12 Carl Zeiss Jena Gmbh Vorrichtungen zum Bearbeiten von optischen Werkstücken
DE102016214568A1 (de) * 2016-08-05 2018-02-08 Weeke Bohrsysteme Gmbh Bearbeitungsvorrichtung und Bearbeitungsverfahren
CN108145586B (zh) * 2018-01-03 2019-10-11 京东方科技集团股份有限公司 抛光设备及抛光方法
US11731231B2 (en) * 2019-01-28 2023-08-22 Micron Technology, Inc. Polishing system, polishing pad, and related methods
FI130973B1 (en) * 2019-11-18 2024-06-25 Turun Yliopisto Device and method for polishing a specimen
JP7365282B2 (ja) * 2020-03-26 2023-10-19 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
US11890715B2 (en) 2020-06-24 2024-02-06 Applied Materials, Inc. Polishing carrier head with piezoelectric pressure control
CN112518500A (zh) * 2020-12-05 2021-03-19 江苏全真光学科技股份有限公司 一种变色镜片生产用抛光装置

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US4923302A (en) * 1989-02-02 1990-05-08 Litton Systems, Inc. Method and apparatus for calibrating deformable mirrors having replaceable actuators
US4934803A (en) * 1989-10-12 1990-06-19 Litton Systems, Inc. Differential pressure deformable mirror
US5094536A (en) * 1990-11-05 1992-03-10 Litel Instruments Deformable wafer chuck
JP2789153B2 (ja) 1992-01-27 1998-08-20 マイクロン テクノロジー インコーポレイテッド マイクロスクラッチのない平滑面を形成するための半導体ウェハの化学機械的平坦化方法
WO1993015878A1 (fr) 1992-02-12 1993-08-19 Sumitomo Metal Industries Limited Dispositif abrasif et procede d'abrasion utilisant ce dispositif
US5635083A (en) * 1993-08-06 1997-06-03 Intel Corporation Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
US5720845A (en) * 1996-01-17 1998-02-24 Liu; Keh-Shium Wafer polisher head used for chemical-mechanical polishing and endpoint detection
US5868896A (en) * 1996-11-06 1999-02-09 Micron Technology, Inc. Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
US5888120A (en) 1997-09-29 1999-03-30 Lsi Logic Corporation Method and apparatus for chemical mechanical polishing
DE19802302A1 (de) * 1998-01-22 1999-07-29 Bosch Gmbh Robert Piezoelektrischer Aktor
JPH11285966A (ja) * 1998-04-02 1999-10-19 Speedfam-Ipec Co Ltd キャリア及びｃｍｐ装置
US6325696B1 (en) * 1999-09-13 2001-12-04 International Business Machines Corporation Piezo-actuated CMP carrier
US6579151B2 (en) * 2001-08-02 2003-06-17 Taiwan Semiconductor Manufacturing Co., Ltd Retaining ring with active edge-profile control by piezoelectric actuator/sensors
US20030211811A1 (en) * 2002-05-10 2003-11-13 Berman Michael J. Adaptable multi zone carrier

Also Published As

Publication number Publication date
EP1587649B1 (de) 2008-03-05
DE502004006407D1 (de) 2008-04-17
DE112004000549D2 (de) 2005-12-08
EP1587649A1 (de) 2005-10-26
US20060135040A1 (en) 2006-06-22
US7160177B2 (en) 2007-01-09
JP2006513050A (ja) 2006-04-20
WO2004067228A1 (de) 2004-08-12
DE10303407A1 (de) 2004-08-19

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Legal Events

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REN Ceased due to non-payment of the annual fee