ATE388614T1 - Verfahren zur herstellung einer doppelseitigen leiterplatte - Google Patents

Verfahren zur herstellung einer doppelseitigen leiterplatte

Info

Publication number
ATE388614T1
ATE388614T1 AT05252805T AT05252805T ATE388614T1 AT E388614 T1 ATE388614 T1 AT E388614T1 AT 05252805 T AT05252805 T AT 05252805T AT 05252805 T AT05252805 T AT 05252805T AT E388614 T1 ATE388614 T1 AT E388614T1
Authority
AT
Austria
Prior art keywords
metal foils
double
producing
circuit board
hole
Prior art date
Application number
AT05252805T
Other languages
English (en)
Inventor
Yuichi Takayoshi
Mineyoshi Hasegawa
Yasushi Tsuda
Akinori Itokawa
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE388614T1 publication Critical patent/ATE388614T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
AT05252805T 2004-05-07 2005-05-06 Verfahren zur herstellung einer doppelseitigen leiterplatte ATE388614T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004138098A JP4330486B2 (ja) 2004-05-07 2004-05-07 両面プリント配線板の製造方法

Publications (1)

Publication Number Publication Date
ATE388614T1 true ATE388614T1 (de) 2008-03-15

Family

ID=34941182

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05252805T ATE388614T1 (de) 2004-05-07 2005-05-06 Verfahren zur herstellung einer doppelseitigen leiterplatte

Country Status (6)

Country Link
US (1) US7281327B2 (de)
EP (1) EP1594352B1 (de)
JP (1) JP4330486B2 (de)
CN (1) CN100505990C (de)
AT (1) ATE388614T1 (de)
DE (1) DE602005005105T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4330486B2 (ja) * 2004-05-07 2009-09-16 日東電工株式会社 両面プリント配線板の製造方法
CN101466207B (zh) * 2007-12-19 2011-11-16 富葵精密组件(深圳)有限公司 电路板及其制作方法
KR101102337B1 (ko) * 2008-05-28 2012-01-03 엘지전자 주식회사 연성필름
CN101600307B (zh) * 2008-06-05 2012-05-23 欣兴电子股份有限公司 线路板
US20100047535A1 (en) * 2008-08-22 2010-02-25 Lex Kosowsky Core layer structure having voltage switchable dielectric material
CN101677493B (zh) * 2008-09-19 2011-12-28 欣兴电子股份有限公司 线路板与线路结构的制作方法
US9930789B2 (en) 2010-04-12 2018-03-27 Seagate Technology Llc Flexible printed circuit cable with multi-layer interconnection and method of forming the same
WO2014033859A1 (ja) * 2012-08-29 2014-03-06 日立化成株式会社 コネクタ及びフレキシブル配線板
KR102119581B1 (ko) * 2013-07-15 2020-06-08 엘지이노텍 주식회사 기판 제조 방법 및 그 기판
US20170013715A1 (en) * 2015-07-10 2017-01-12 Rohde & Schwarz Gmbh & Co. Kg Printed circuit board and corresponding method for producing a printed circuit board
WO2019039237A1 (ja) * 2017-08-21 2019-02-28 住友電工プリントサーキット株式会社 プリント配線板
CN120314663A (zh) * 2025-04-17 2025-07-15 北京中科飞龙传感技术有限责任公司 空中电场测量装置、空中电场测量方法及探空设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819154B2 (ja) 1978-03-10 1983-04-16 安立電気株式会社 スル−ホ−ルプリント板の製造方法
US4211603A (en) * 1978-05-01 1980-07-08 Tektronix, Inc. Multilayer circuit board construction and method
US4720324A (en) * 1985-10-03 1988-01-19 Hayward John S Process for manufacturing printed circuit boards
JPH07120852B2 (ja) 1987-06-24 1995-12-20 株式会社フジクラ フレキシブル回路基板の製造方法
US5231751A (en) * 1991-10-29 1993-08-03 International Business Machines Corporation Process for thin film interconnect
US5421083A (en) * 1994-04-01 1995-06-06 Motorola, Inc. Method of manufacturing a circuit carrying substrate having coaxial via holes
JPH1187886A (ja) 1997-09-11 1999-03-30 Ngk Spark Plug Co Ltd プリント配線板の製造方法
JP2000151068A (ja) 1998-11-06 2000-05-30 Mitsui Mining & Smelting Co Ltd 新規なプリント配線板および多層プリント配線板の製造方法
JP3048360B1 (ja) 1999-04-06 2000-06-05 日東電工株式会社 両面プリント配線板およびその製造方法
JP2003008204A (ja) 2001-06-21 2003-01-10 Nitto Denko Corp 両面プリント配線板の製造方法
JP2003234572A (ja) * 2002-02-06 2003-08-22 Nitto Denko Corp 両面配線基板の製造方法
JP4330486B2 (ja) * 2004-05-07 2009-09-16 日東電工株式会社 両面プリント配線板の製造方法

Also Published As

Publication number Publication date
DE602005005105T2 (de) 2009-03-12
JP2005322706A (ja) 2005-11-17
EP1594352A1 (de) 2005-11-09
DE602005005105D1 (de) 2008-04-17
CN1694605A (zh) 2005-11-09
JP4330486B2 (ja) 2009-09-16
US7281327B2 (en) 2007-10-16
CN100505990C (zh) 2009-06-24
EP1594352B1 (de) 2008-03-05
US20060016072A1 (en) 2006-01-26

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