ATE391130T1 - Klebstoff auf wasserbasis zum kleben von substraten mit niedriger oberflächenenergie - Google Patents
Klebstoff auf wasserbasis zum kleben von substraten mit niedriger oberflächenenergieInfo
- Publication number
- ATE391130T1 ATE391130T1 AT05713201T AT05713201T ATE391130T1 AT E391130 T1 ATE391130 T1 AT E391130T1 AT 05713201 T AT05713201 T AT 05713201T AT 05713201 T AT05713201 T AT 05713201T AT E391130 T1 ATE391130 T1 AT E391130T1
- Authority
- AT
- Austria
- Prior art keywords
- water
- surface energy
- low surface
- based adhesive
- energy substrates
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 4
- 230000001070 adhesive effect Effects 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 abstract 4
- 238000009472 formulation Methods 0.000 abstract 3
- 239000000178 monomer Substances 0.000 abstract 2
- 239000004094 surface-active agent Substances 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/50—Phosphorus bound to carbon only
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US54689104P | 2004-02-23 | 2004-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE391130T1 true ATE391130T1 (de) | 2008-04-15 |
Family
ID=34910828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05713201T ATE391130T1 (de) | 2004-02-23 | 2005-02-10 | Klebstoff auf wasserbasis zum kleben von substraten mit niedriger oberflächenenergie |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20070141267A1 (de) |
| EP (1) | EP1720887B1 (de) |
| JP (1) | JP2007523248A (de) |
| CN (1) | CN100519567C (de) |
| AT (1) | ATE391130T1 (de) |
| DE (1) | DE602005005799T2 (de) |
| WO (1) | WO2005082912A1 (de) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4693434B2 (ja) * | 2005-02-15 | 2011-06-01 | 株式会社トクヤマ | 歯科用粘膜調整材 |
| EP1702605B1 (de) * | 2005-03-18 | 2009-11-04 | Tokuyama Corporation | Härtbare Zusammensetzung |
| BRPI0617591A2 (pt) * | 2005-10-07 | 2011-08-02 | Dow Global Technologies Inc | sistemas para iniciar polimerização via radical livre, composição polimerizável de duas partes, método de polimerização, método para ligar dois ou mais substratos entre si, método para modificar a superfìcie de um polìmero de baixa energia superficial, método para revestir um substrato, composição de revestimento e laminado |
| US8104609B2 (en) * | 2007-03-08 | 2012-01-31 | Tokuyama Dental Corporation | Container |
| US8377852B2 (en) * | 2007-10-26 | 2013-02-19 | Dow Corning Corporation | Method of preparing a substrate with a composition including an organoborane initiator |
| WO2010014537A1 (en) * | 2008-07-28 | 2010-02-04 | Dow Corning Corporation | Radical polymerizable composition |
| CN102137908B (zh) * | 2008-07-28 | 2013-10-30 | 陶氏康宁公司 | 复合制品 |
| BRPI0922480A2 (pt) * | 2008-12-19 | 2018-06-05 | 3M Innovative Properties Co | compósitos de nanocalcita |
| JP5663495B2 (ja) | 2009-02-04 | 2015-02-04 | ダウ コーニング コーポレーションDow Corning Corporation | 非ランダムコポリマーの形成方法 |
| CN107108833B (zh) | 2014-11-24 | 2022-06-14 | Ppg工业俄亥俄公司 | 通过挤出用于反应性三维打印的方法 |
| CN105176442B (zh) * | 2015-09-17 | 2017-10-31 | 菏泽海诺知识产权服务有限公司 | 一种环保胶黏剂 |
| WO2018110705A1 (ja) * | 2016-12-16 | 2018-06-21 | デンカ株式会社 | 組成物 |
| ES2883632T3 (es) | 2017-06-09 | 2021-12-09 | Prc Desoto Int Inc | Selladores de doble curado |
| US10434704B2 (en) | 2017-08-18 | 2019-10-08 | Ppg Industries Ohio, Inc. | Additive manufacturing using polyurea materials |
| US12384097B2 (en) | 2017-08-18 | 2025-08-12 | Ppg Industries Ohio, Inc. | Additive manufacturing using reactive compositions |
| CN113710481A (zh) | 2019-02-11 | 2021-11-26 | Ppg工业俄亥俄公司 | 多层系统和制造多层系统的方法 |
| KR102763793B1 (ko) | 2019-02-11 | 2025-02-05 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 엘라스토머성 조성물 및 사용 방법 |
| EP3924167B1 (de) | 2019-02-11 | 2024-07-24 | PPG Industries Ohio Inc. | 3d-drucken von verschlusskappen |
| CN118082177A (zh) | 2019-02-11 | 2024-05-28 | Ppg工业俄亥俄公司 | 制作耐化学性密封组件的方法 |
| US11015057B2 (en) | 2019-04-03 | 2021-05-25 | Prc-Desoto International, Inc. | Dual-cure compositions |
| US11173692B2 (en) | 2019-12-19 | 2021-11-16 | Prc-Desoto International, Inc. | Free radical polymerizable adhesion-promoting interlayer compositions and methods of use |
| KR102601003B1 (ko) | 2020-05-28 | 2023-11-13 | 아사히 가세이 가부시키가이샤 | 축전 디바이스용 세퍼레이터 및 그의 제조 방법 |
| CN112851186B (zh) * | 2021-01-25 | 2022-05-10 | 山东江泰建材科技有限公司 | 一种煤矸石机制砂砂浆的专用助剂及其制备方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19602538A1 (de) * | 1996-01-25 | 1997-07-31 | Basf Ag | Verfahren zur Herstellung einer wäßrigen Polymerisatdispersion nach der Methode der radikalischen wäßrigen Emulsionspolymerisation |
| ATE295369T1 (de) * | 1998-03-31 | 2005-05-15 | Bristol Myers Squibb Pharma Co | Pharmazeutika zur bildgebung der angiogenischen krankheiten |
| KR100679874B1 (ko) * | 1998-10-02 | 2007-02-07 | 다우 글로벌 테크놀로지스 인크. | 에폭시 수지의 안정성 수성 분산액을 포함하는 조성물 및 당해 분산액의 제조방법 |
| US7348300B2 (en) * | 1999-05-04 | 2008-03-25 | Air Products And Chemicals, Inc. | Acetylenic diol ethylene oxide/propylene oxide adducts and processes for their manufacture |
| US6806330B1 (en) * | 1999-12-17 | 2004-10-19 | Dow Global Technologies Inc. | Amine organoborane complex polymerization initiators and polymerizable compositions |
| US6656448B1 (en) * | 2000-02-15 | 2003-12-02 | Bristol-Myers Squibb Pharma Company | Matrix metalloproteinase inhibitors |
| US7138436B2 (en) * | 2001-06-13 | 2006-11-21 | 3M Innovative Properties Company | Uncrosslinked foams made from emulsions |
| WO2005000980A2 (en) * | 2003-06-18 | 2005-01-06 | Dow Global Technologies Inc. | Paint formulation for a low surface energy substrate |
| AP2007003959A0 (en) * | 2004-10-07 | 2007-04-30 | Ananda Chakrabarty | Cupredoxin derived transport agents and methods ofuse thereof |
-
2005
- 2005-02-10 WO PCT/US2005/004097 patent/WO2005082912A1/en not_active Ceased
- 2005-02-10 AT AT05713201T patent/ATE391130T1/de not_active IP Right Cessation
- 2005-02-10 EP EP05713201A patent/EP1720887B1/de not_active Expired - Lifetime
- 2005-02-10 CN CNB200580005473XA patent/CN100519567C/zh not_active Expired - Fee Related
- 2005-02-10 JP JP2006554128A patent/JP2007523248A/ja active Pending
- 2005-02-10 DE DE602005005799T patent/DE602005005799T2/de not_active Expired - Lifetime
- 2005-02-10 US US10/588,622 patent/US20070141267A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| DE602005005799T2 (de) | 2009-04-16 |
| JP2007523248A (ja) | 2007-08-16 |
| EP1720887B1 (de) | 2008-04-02 |
| US20070141267A1 (en) | 2007-06-21 |
| CN100519567C (zh) | 2009-07-29 |
| CN1922194A (zh) | 2007-02-28 |
| EP1720887A1 (de) | 2006-11-15 |
| WO2005082912A1 (en) | 2005-09-09 |
| DE602005005799D1 (de) | 2008-05-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |