ATE391406T1 - Kühlsystem und -verfahren - Google Patents

Kühlsystem und -verfahren

Info

Publication number
ATE391406T1
ATE391406T1 AT05817223T AT05817223T ATE391406T1 AT E391406 T1 ATE391406 T1 AT E391406T1 AT 05817223 T AT05817223 T AT 05817223T AT 05817223 T AT05817223 T AT 05817223T AT E391406 T1 ATE391406 T1 AT E391406T1
Authority
AT
Austria
Prior art keywords
cooling loop
coolant
heat exchanger
cooling
subsystem
Prior art date
Application number
AT05817223T
Other languages
English (en)
Inventor
Levi Campbell
Richard Chu
Michael Ellsworth
Madhusudan Iyengar
Roger Schmidt
Robert Simons
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of ATE391406T1 publication Critical patent/ATE391406T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H10W40/475—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Cooling System (AREA)
AT05817223T 2004-12-09 2005-12-07 Kühlsystem und -verfahren ATE391406T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/008,711 US6973801B1 (en) 2004-12-09 2004-12-09 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack

Publications (1)

Publication Number Publication Date
ATE391406T1 true ATE391406T1 (de) 2008-04-15

Family

ID=35452409

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05817223T ATE391406T1 (de) 2004-12-09 2005-12-07 Kühlsystem und -verfahren

Country Status (7)

Country Link
US (1) US6973801B1 (de)
EP (1) EP1829441B1 (de)
JP (1) JP4511601B2 (de)
CN (1) CN100556260C (de)
AT (1) ATE391406T1 (de)
DE (1) DE602005005859T2 (de)
WO (1) WO2006061404A1 (de)

Families Citing this family (125)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7508672B2 (en) * 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
US20070051126A1 (en) * 2004-11-29 2007-03-08 Seiichi Okuda Air refrigerant type freezing and heating apparatus
US8424885B2 (en) 2005-12-22 2013-04-23 Elliptical Mobile Solutions, LLC Method and apparatus for an environmentally-protected electronic equipment enclosure
US7578337B2 (en) * 2005-04-14 2009-08-25 United States Thermoelectric Consortium Heat dissipating device
US7298618B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
US7298617B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
US7992625B1 (en) 2006-08-18 2011-08-09 United States Thermoelectric Consortium Fluid-operated heat transfer device
US7814965B1 (en) 2005-10-27 2010-10-19 United States Thermoelectric Consortium Airflow heat dissipation device
US8672732B2 (en) 2006-01-19 2014-03-18 Schneider Electric It Corporation Cooling system and method
US7365973B2 (en) 2006-01-19 2008-04-29 American Power Conversion Corporation Cooling system and method
US8157001B2 (en) * 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
CN101523119B (zh) 2006-06-01 2012-12-19 埃克弗洛普公司 用于向电子设备提供冷却的空气的系统及方法
US9568206B2 (en) 2006-08-15 2017-02-14 Schneider Electric It Corporation Method and apparatus for cooling
US8327656B2 (en) 2006-08-15 2012-12-11 American Power Conversion Corporation Method and apparatus for cooling
US8322155B2 (en) 2006-08-15 2012-12-04 American Power Conversion Corporation Method and apparatus for cooling
US20080043442A1 (en) * 2006-08-16 2008-02-21 Strickland Travis C Computer system with thermal conduction
US7665325B2 (en) * 2006-09-12 2010-02-23 International Business Machines Corporation Multi-fluid cooling system and method with freeze protection for cooling an electronic device
US7681404B2 (en) 2006-12-18 2010-03-23 American Power Conversion Corporation Modular ice storage for uninterruptible chilled water
US8425287B2 (en) 2007-01-23 2013-04-23 Schneider Electric It Corporation In-row air containment and cooling system and method
US8141620B1 (en) 2007-02-26 2012-03-27 United States Thermoelectric Consortium (USTC) Method for conditioning a cooling loop of a heat exchange system
US7511959B2 (en) * 2007-04-25 2009-03-31 Hewlett-Packard Development Company, L.P. Scalable computing apparatus
US7477514B2 (en) * 2007-05-04 2009-01-13 International Business Machines Corporation Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations
JP5559040B2 (ja) 2007-05-15 2014-07-23 シュナイダー エレクトリック アイティー コーポレーション 設備の電力及び冷却を管理するための方法及びシステム
US7602609B2 (en) * 2007-05-31 2009-10-13 Liebert Corporation Cooling system and method of use
TW200924625A (en) * 2007-08-07 2009-06-01 Cooligy Inc Deformable duct guides that accommodate electronic connection lines
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9496200B2 (en) * 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US20090229283A1 (en) * 2007-08-24 2009-09-17 Joseph Marsala Method and apparatus for isothermal cooling of hard disk drive arrays using a pumped refrigerant loop
US7963119B2 (en) * 2007-11-26 2011-06-21 International Business Machines Corporation Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center
US8553416B1 (en) * 2007-12-21 2013-10-08 Exaflop Llc Electronic device cooling system with storage
US8437881B2 (en) * 2008-02-15 2013-05-07 The Pnc Financial Services Group, Inc. Systems and methods for computer equipment management
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US8254422B2 (en) 2008-08-05 2012-08-28 Cooligy Inc. Microheat exchanger for laser diode cooling
US20100085708A1 (en) * 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
US7916483B2 (en) 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7983040B2 (en) 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7961475B2 (en) 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7944694B2 (en) 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7903404B2 (en) * 2009-04-29 2011-03-08 Hewlett-Packard Development Company, L.P. Data centers
US8219362B2 (en) 2009-05-08 2012-07-10 American Power Conversion Corporation System and method for arranging equipment in a data center
WO2010130993A2 (en) * 2009-05-12 2010-11-18 Iceotope Limited Cooled electronic system
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US8081461B2 (en) * 2009-06-25 2011-12-20 International Business Machines Corporation Cooling apparatus with thermally conductive porous material and jet impingement nozzle(s) extending therein
US8490419B2 (en) * 2009-08-20 2013-07-23 United States Thermoelectric Consortium Interlocked jets cooling method and apparatus
US8522569B2 (en) 2009-10-27 2013-09-03 Industrial Idea Partners, Inc. Utilization of data center waste heat for heat driven engine
US8189334B2 (en) 2010-05-26 2012-05-29 International Business Machines Corporation Dehumidifying and re-humidifying cooling apparatus and method for an electronics rack
US9038406B2 (en) 2010-05-26 2015-05-26 International Business Machines Corporation Dehumidifying cooling apparatus and method for an electronics rack
US7905096B1 (en) * 2010-05-26 2011-03-15 International Business Machines Corporation Dehumidifying and re-humidifying air cooling for an electronics rack
US8144467B2 (en) 2010-05-26 2012-03-27 International Business Machines Corporation Dehumidifying and re-humidifying apparatus and method for an electronics rack
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8514575B2 (en) 2010-11-16 2013-08-20 International Business Machines Corporation Multimodal cooling apparatus for an electronic system
US8274790B2 (en) 2010-11-16 2012-09-25 International Business Machines Corporation Automatically reconfigurable liquid-cooling apparatus for an electronics rack
US8688413B2 (en) 2010-12-30 2014-04-01 Christopher M. Healey System and method for sequential placement of cooling resources within data center layouts
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US8817474B2 (en) 2011-10-31 2014-08-26 International Business Machines Corporation Multi-rack assembly with shared cooling unit
US8760863B2 (en) 2011-10-31 2014-06-24 International Business Machines Corporation Multi-rack assembly with shared cooling apparatus
US20130112378A1 (en) * 2011-11-04 2013-05-09 Dell Products L.P. System and Method for Cooling Information Handling Resources
EP2796025A4 (de) 2011-12-22 2016-06-29 Schneider Electric It Corp System und verfahren zur vorhersage der temperaturwerte in einem elektronischen system
AU2011384046A1 (en) 2011-12-22 2014-07-17 Schneider Electric It Corporation Analysis of effect of transient events on temperature in a data center
US9167728B2 (en) * 2012-07-18 2015-10-20 International Business Machines Corporation Information technology equipment cooling method
US8964384B2 (en) * 2012-07-27 2015-02-24 Hewlett-Packard Development Company, L.P. Component cooling
US20140048993A1 (en) * 2012-08-17 2014-02-20 Apple Inc. Selective placement of coolant to undercut areas
US8925333B2 (en) 2012-09-13 2015-01-06 International Business Machines Corporation Thermoelectric-enhanced air and liquid cooling of an electronic system
US9351431B2 (en) 2012-10-11 2016-05-24 International Business Machines Corporation Cooling system with automated seasonal freeze protection
US9648784B2 (en) 2013-03-15 2017-05-09 Inertech Ip Llc Systems and assemblies for cooling server racks
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
CN105144861B (zh) * 2013-03-29 2018-04-17 慧与发展有限责任合伙企业 具有冷却装置的电子装置
TW201515563A (zh) * 2013-10-08 2015-04-16 Hon Hai Prec Ind Co Ltd 散熱系統
EP3158271B1 (de) 2014-06-20 2021-09-22 Nortek Air Solutions Canada, Inc. Systeme und verfahren zur verwaltung von bedingungen in geschlossenen räumen
US10168061B2 (en) * 2014-11-11 2019-01-01 Emerson Network Power S.R.L. Conditioning system of the free cooling type for environments, method of operation of a said conditioning system, and apparatus for carrying out such method
US10638641B2 (en) 2014-11-14 2020-04-28 Hewlett Packard Enterprise Development Lp Cooling rack
EP3295088B1 (de) 2015-05-15 2022-01-12 Nortek Air Solutions Canada, Inc. Verwendung eines flüssigkeit-zu-luft-membranenergieaustauschers zur flüssigkeitskühlung
US11092349B2 (en) 2015-05-15 2021-08-17 Nortek Air Solutions Canada, Inc. Systems and methods for providing cooling to a heat load
US11026351B2 (en) * 2015-09-25 2021-06-01 Intel Corporation Computing apparatus with closed cooling loop
EP3400407A4 (de) 2016-01-08 2019-08-07 Nortek Air Solutions Canada, Inc. Integrierte aussenluftanlage in einem 100%-igen luftumwälzungssystem
SG11201807975UA (en) 2016-03-16 2018-10-30 Inertech Ip Llc System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling
EP3236725B8 (de) * 2016-04-18 2020-03-11 Rolls-Royce plc Leistungselektronisches modul
JP6907592B2 (ja) 2017-02-28 2021-07-21 富士通株式会社 冷却装置及び電子機器システム
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
DE202018102582U1 (de) 2018-01-23 2018-05-22 MEGWARE Computer Vertrieb und Service GmbH Hochtemperatur-direktflüssigkeitsgekühltes Hochleistungsrechnersystem
US10681846B2 (en) 2018-04-19 2020-06-09 Google Llc Cooling electronic devices in a data center
US10645847B2 (en) 2018-04-20 2020-05-05 Google Llc Cooling electronic devices in a data center
US10966352B2 (en) 2018-09-24 2021-03-30 Google Llc Cooling electronic devices in a data center
US10548239B1 (en) * 2018-10-23 2020-01-28 Google Llc Cooling electronic devices in a data center
GB201916771D0 (en) * 2019-11-18 2020-01-01 Iceotope Group Ltd Heat sink for liquid cooling
US10548240B1 (en) 2019-01-11 2020-01-28 Google Llc Cooling electronic devices in a data center
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
WO2020210587A1 (en) 2019-04-10 2020-10-15 Jetcool Technologies, Inc. Thermal management of electronics using co-located microjet nozzles and electronic elements
EP3977832B1 (de) 2019-04-14 2025-06-04 Jetcool Technologies, Inc. Flüssigkeitsbasiertes kühlmodul mit direktem kontakt
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
CA3140764C (en) 2019-06-27 2025-06-10 Hypertechnologie Ciara Inc. MICRO-SLOT SYSTEM FOR DIRECT CONTACT COOLING ELECTRONICS
US11801733B2 (en) * 2019-09-25 2023-10-31 Baidu Usa Llc Liquid cooling loop design for high performance processors in harsh vehicle environment
GB201916763D0 (en) * 2019-11-18 2020-01-01 Iceotope Group Ltd Nozzle arrangement and cooling module
US10959352B1 (en) * 2020-01-03 2021-03-23 Quanta Computer Inc. Cooling system with floating cold plate with single pipes
US11212943B2 (en) 2020-02-21 2021-12-28 Nvidia Corporation Universal pluggable datacenter cooling system
EP4150216A4 (de) 2020-05-11 2023-11-01 Coolit Systems, Inc. Flüssigkeitspumpeinheiten sowie zugehörige systeme und verfahren
US11963341B2 (en) 2020-09-15 2024-04-16 Jetcool Technologies Inc. High temperature electronic device thermal management system
US12289871B2 (en) 2020-09-15 2025-04-29 Jetcool Technologies Inc. High temperature electronic device thermal management system
US11211538B1 (en) 2020-12-23 2021-12-28 Joseph L. Pikulski Thermal management system for electrically-powered devices
US11950396B2 (en) * 2020-12-30 2024-04-02 Nvidia Corporation Intelligent swappable modular unit for local cooling loops in a datacenter cooling system
WO2022159447A1 (en) 2021-01-20 2022-07-28 Jetcool Technologies Inc. Conformal cooling assembly with substrate fluid-proofing for multi-die electronic assemblies
US11903166B2 (en) * 2021-02-01 2024-02-13 Microsoft Technology Licensing, Llc Systems and methods for immersion cooling with subcooled spray
US12082382B2 (en) * 2021-04-23 2024-09-03 Nvidia Corporation Intelligent in-rack pump or compressor unit for datacenter cooling systems
US11812589B2 (en) * 2021-05-12 2023-11-07 Nvidia Corporation Intelligent refrigerant distribution unit for datacenter cooling systems
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US11627687B2 (en) * 2021-06-22 2023-04-11 Baidu Usa Llc Multiple phase multiple system architecture
US12048118B2 (en) * 2021-08-13 2024-07-23 Jetcool Technologies Inc. Flow-through, hot-spot-targeting immersion cooling assembly
US12225688B2 (en) 2021-11-09 2025-02-11 Hoffman Enclosures Inc. Coolant distribution unit and control methods
WO2023086451A1 (en) 2021-11-12 2023-05-19 Jetcool Technologies Inc. Liquid-in-liquid cooling system for electronic components
US20230180436A1 (en) * 2021-12-08 2023-06-08 Treis Blockchain, Llc System for cooling electrical components and recycling heat
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
TW202407925A (zh) 2022-03-04 2024-02-16 美商捷控技術有限公司 用於電腦處理器及處理器組件之主動冷卻散熱蓋
US12520452B2 (en) 2022-05-04 2026-01-06 Hoffman Enclosures Inc. Replaceable pump unit for cooling systems
US12563707B2 (en) 2022-10-24 2026-02-24 Jetcool Technologies Inc. Cooling module with integrated pump for immersion cooling in electronics
US12369282B2 (en) 2023-07-26 2025-07-22 Quanta Computer Inc. Liquid cooling rack assembly for computing system and telecommunication system including the same

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3032590A1 (de) * 1980-08-27 1982-04-01 Siemens AG, 1000 Berlin und 8000 München Anordnung zur kuehlung einer gas- oder fluessigkeitsgekuehlten elektrischen maschine
JPS62119620A (ja) * 1985-11-20 1987-05-30 Fujitsu Ltd 冷却水供給装置
US5131233A (en) 1991-03-08 1992-07-21 Cray Computer Corporation Gas-liquid forced turbulence cooling
SE505272C2 (sv) * 1994-12-14 1997-07-28 Ericsson Telefon Ab L M Kylsystem för telekommunikationsutrustning
JP2874684B2 (ja) * 1997-03-27 1999-03-24 日本電気株式会社 プラグインユニットの放熱構造
US5924482A (en) 1997-10-29 1999-07-20 Motorola, Inc. Multi-mode, two-phase cooling module
US6019165A (en) 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US20020134544A1 (en) * 2000-09-07 2002-09-26 Thermotek, Inc. Passive cooling system and method
US6408937B1 (en) 2000-11-15 2002-06-25 Sanjay K. Roy Active cold plate/heat sink
US7225864B2 (en) * 2001-02-08 2007-06-05 Oriol Inc. Multi-channel temperature control system for semiconductor processing facilities
US6604370B2 (en) 2001-02-22 2003-08-12 Hewlett-Packard Development Company, L.P. Variably configured sprayjet cooling system
US6498725B2 (en) 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus
US6808371B2 (en) 2001-09-25 2004-10-26 Matsushita Electric Industrial Co., Ltd. Ultra-thin pump and cooling system including the pump
US6587345B2 (en) 2001-11-09 2003-07-01 International Business Machines Corporation Electronic device substrate assembly with impermeable barrier and method of making
US6628520B2 (en) * 2002-02-06 2003-09-30 Hewlett-Packard Development Company, L.P. Method, apparatus, and system for cooling electronic components
US6625023B1 (en) 2002-04-11 2003-09-23 General Dynamics Land Systems, Inc. Modular spray cooling system for electronic components
US6604571B1 (en) 2002-04-11 2003-08-12 General Dynamics Land Systems, Inc. Evaporative cooling of electrical components
US6940712B2 (en) 2002-07-17 2005-09-06 International Business Machines Corporation Electronic device substrate assembly with multilayer impermeable barrier and method of making
US6807056B2 (en) * 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
US7146822B2 (en) 2002-12-30 2006-12-12 Intel Corporation Centrifugal liquid pump with perimeter magnetic drive
CN100338983C (zh) * 2003-12-03 2007-09-19 国际商业机器公司 确保冷却多个电子设备子系统的冷却系统和方法
US7106590B2 (en) * 2003-12-03 2006-09-12 International Business Machines Corporation Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems

Also Published As

Publication number Publication date
EP1829441A1 (de) 2007-09-05
CN101091424A (zh) 2007-12-19
US6973801B1 (en) 2005-12-13
JP4511601B2 (ja) 2010-07-28
WO2006061404A1 (en) 2006-06-15
DE602005005859D1 (de) 2008-05-15
EP1829441B1 (de) 2008-04-02
JP2008523599A (ja) 2008-07-03
CN100556260C (zh) 2009-10-28
DE602005005859T2 (de) 2009-05-20

Similar Documents

Publication Publication Date Title
ATE391406T1 (de) Kühlsystem und -verfahren
Herrlin Rack cooling effectiveness in data centers and telecom central offices: the rack cooling index (RCI)
US10912229B1 (en) Cooling system for high density racks with multi-function heat exchangers
MY163596A (en) Warm floor data center
EP1448040A3 (de) FlüssigkeitsKühlsystem für ein, in einem Baugruppenträger montierte Serversystem
DE60323668D1 (de) Verfahren und vorrichtung zur kombinierten luft- und flü ssigkeitskühlung gestapelter elektronischer module
WO2009143330A3 (en) Graphics card thermal interposer
GB2518763A (en) Provisioning cooling elements for chillerless data centers
EP1665916A4 (de) Flüssigkeits-kühlsystem
DE502004012290D1 (de) Kühlvorrichtung für ein elektronisches bauelement, insbesondere für einen mikroprozessor
AU2003293073A8 (en) Method, system and apparatus for cooling high power density devices
WO2005117917A3 (en) Thermal management system and computer arrangement
TW200513169A (en) Liquid cooling module
ATE407874T1 (de) Kühlsystem zum kühlen von wärmeerzeugenden vorrichtungen in einem flugzeug
GB2431777B (en) Impingement cooling of components in an electronic system
TW200627134A (en) Method for high-density packaging and cooling of high-powered electronics (iceblade architecture)
TW200601954A (en) Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit
WO2007001317A3 (en) Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
DE602007013709D1 (de) Nem brennstoffzellensystem
EP1621970A3 (de) Elektronisches Gerät mit Kühlungsvorrichtung
Bilgen et al. Natural convection on discrete heaters in a square enclosure with ventilation ports
DK1592322T3 (da) Köleenhed
Gui et al. Advanced cold plate liquid cooling solution for hyper-scale data center application
WO2005093551A3 (de) Kühlsystem für elektronische geräte, insbesondere ein computer
EP1772246A3 (de) Vorrichtung zur Temperaturregelung eines Formwerkzeugs

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties