ATE391576T1 - Fokussierung eines optischen strahles auf zwei fokusse - Google Patents

Fokussierung eines optischen strahles auf zwei fokusse

Info

Publication number
ATE391576T1
ATE391576T1 AT04739406T AT04739406T ATE391576T1 AT E391576 T1 ATE391576 T1 AT E391576T1 AT 04739406 T AT04739406 T AT 04739406T AT 04739406 T AT04739406 T AT 04739406T AT E391576 T1 ATE391576 T1 AT E391576T1
Authority
AT
Austria
Prior art keywords
laser beam
focuses
focusing
optical beam
focussed
Prior art date
Application number
AT04739406T
Other languages
English (en)
Inventor
Venkatakrishnan Krishnan
Tan Bo
Original Assignee
Xsil Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xsil Technology Ltd filed Critical Xsil Technology Ltd
Application granted granted Critical
Publication of ATE391576T1 publication Critical patent/ATE391576T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B23K26/0617—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis and with spots spaced along the common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Surgery Devices (AREA)
  • Optical Head (AREA)
  • Optical Communication System (AREA)
AT04739406T 2003-05-30 2004-05-27 Fokussierung eines optischen strahles auf zwei fokusse ATE391576T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0312469A GB2402230B (en) 2003-05-30 2003-05-30 Focusing an optical beam to two foci

Publications (1)

Publication Number Publication Date
ATE391576T1 true ATE391576T1 (de) 2008-04-15

Family

ID=9959064

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04739406T ATE391576T1 (de) 2003-05-30 2004-05-27 Fokussierung eines optischen strahles auf zwei fokusse

Country Status (11)

Country Link
US (1) US7858901B2 (de)
EP (1) EP1631415B1 (de)
JP (1) JP4751319B2 (de)
KR (1) KR101167140B1 (de)
CN (1) CN1826206B (de)
AT (1) ATE391576T1 (de)
DE (1) DE602004012999T2 (de)
GB (1) GB2402230B (de)
MY (1) MY149114A (de)
TW (1) TWI260843B (de)
WO (1) WO2004105995A1 (de)

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9150342B2 (en) 2003-04-16 2015-10-06 Intercontinental Great Brands Llc Resealable tray container
JP2005138143A (ja) * 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
US7800014B2 (en) 2004-01-09 2010-09-21 General Lasertronics Corporation Color sensing for laser decoating
US7633033B2 (en) 2004-01-09 2009-12-15 General Lasertronics Corporation Color sensing for laser decoating
JP4716663B2 (ja) * 2004-03-19 2011-07-06 株式会社リコー レーザ加工装置、レーザ加工方法、及び該加工装置又は加工方法により作製された構造体
KR101074408B1 (ko) 2004-11-05 2011-10-17 엘지디스플레이 주식회사 펨토초 레이저 발생장치 및 이를 이용한 기판의 절단방법
JP2006150385A (ja) * 2004-11-26 2006-06-15 Canon Inc レーザ割断方法
JP4800661B2 (ja) * 2005-05-09 2011-10-26 株式会社ディスコ レーザ光線を利用する加工装置
JP4845592B2 (ja) * 2005-05-30 2011-12-28 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8153511B2 (en) 2005-05-30 2012-04-10 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP4749799B2 (ja) 2005-08-12 2011-08-17 浜松ホトニクス株式会社 レーザ加工方法
EP1919651B1 (de) * 2005-09-02 2013-05-01 General Lasertronics Corporation Farbfühlung zur laser-entschichtung
US7626138B2 (en) * 2005-09-08 2009-12-01 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
JP2007142001A (ja) 2005-11-16 2007-06-07 Denso Corp レーザ加工装置およびレーザ加工方法
JP4900655B2 (ja) * 2006-01-13 2012-03-21 独立行政法人産業技術総合研究所 レーザー加工装置
US7963413B2 (en) 2006-05-23 2011-06-21 Kraft Foods Global Brands Llc Tamper evident resealable closure
US8308363B2 (en) 2006-05-23 2012-11-13 Kraft Foods Global Brands Llc Package integrity indicator for container closure
KR20080028559A (ko) * 2006-09-27 2008-04-01 주식회사 이오테크닉스 폴리곤 미러를 이용한 대상물 다중 가공 방법
US8114451B2 (en) 2006-12-27 2012-02-14 Kraft Foods Global Brands Llc Resealable closure with package integrity feature
US8536483B2 (en) 2007-03-22 2013-09-17 General Lasertronics Corporation Methods for stripping and modifying surfaces with laser-induced ablation
US8408792B2 (en) 2007-03-30 2013-04-02 Kraft Foods Global Brands Llc Package integrity indicating closure
KR100843411B1 (ko) * 2007-04-16 2008-07-03 삼성전기주식회사 레이저가공 장치 및 기판 절단 방법
DE102007024700A1 (de) * 2007-05-25 2008-12-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Materialbearbeitung mit Laserstrahlung sowie Vorrichtung zur Durchführung des Verfahrens
US20090057282A1 (en) * 2007-08-15 2009-03-05 Chunfu Huang Laser machining method utilizing variable inclination angle
JP5342772B2 (ja) * 2007-10-12 2013-11-13 浜松ホトニクス株式会社 加工対象物切断方法
US20100018974A1 (en) 2008-07-24 2010-01-28 Deborah Lyzenga Package integrity indicating closure
DE102008037042A1 (de) * 2008-08-08 2010-02-11 Limo Patentverwaltung Gmbh & Co. Kg Vorrichtung und Verfahren zur Formung eines Laserstrahls
GB0819200D0 (en) 2008-10-20 2008-11-26 Cadbury Holdings Ltd Packaging
JP2010114190A (ja) * 2008-11-05 2010-05-20 Mitsubishi Heavy Ind Ltd 光電変換装置の製造方法および光電変換装置
WO2010093857A1 (en) * 2009-02-13 2010-08-19 Videojet Technologies Inc. Laser parameter adjustment
JP2010251428A (ja) * 2009-04-13 2010-11-04 Mitsubishi Heavy Ind Ltd 光電変換装置の製造方法、光電変換装置の製造装置、及び光電変換装置
DE102009026410A1 (de) * 2009-05-20 2011-03-17 Carl Baasel Lasertechnik Gmbh & Co. Kg Verfahren zum Vereinzeln von Silizium-Solarzellen
JP4611431B1 (ja) 2009-06-29 2011-01-12 西進商事株式会社 レーザー照射装置及びレーザー加工方法
JP5410250B2 (ja) 2009-11-25 2014-02-05 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
PL2347971T3 (pl) 2010-01-26 2012-11-30 Biscuit Gle Opakowanie na produkty żywnościowe z możliwością wielokrotnego szczelnego zamykania i sposób wytwarzania
US8814430B2 (en) * 2010-02-23 2014-08-26 Kraft Foods R&D, Inc. Food package having opening feature
PL2368811T3 (pl) 2010-03-23 2012-11-30 Biscuit Gle Opakowanie na produkty żywnościowe z możliwością wielokrotnego szczelnego zamykania i sposób wytwarzania
US8519298B2 (en) * 2010-03-25 2013-08-27 Veeco Instruments, Inc. Split laser scribe
US9656783B2 (en) 2010-05-18 2017-05-23 Intercontinental Great Brands Llc Reclosable flexible packaging and methods for manufacturing same
BR112012029073A2 (pt) 2010-05-18 2016-08-16 Kraft Foods Global Brands Llc embalagem flexível refechável e métodos para a fabricação da mesma
US10112257B1 (en) 2010-07-09 2018-10-30 General Lasertronics Corporation Coating ablating apparatus with coating removal detection
EP2629920A1 (de) * 2010-10-22 2013-08-28 Highcon Ltd Laserschneideverfahren und -vorrichtung
CN103517855B (zh) 2011-03-17 2016-03-16 洲际大品牌有限责任公司 可再闭合的柔性膜包装产品及制造方法
US8557683B2 (en) * 2011-06-15 2013-10-15 Applied Materials, Inc. Multi-step and asymmetrically shaped laser beam scribing
US8969220B2 (en) 2012-01-13 2015-03-03 Imra America, Inc. Methods and systems for laser processing of coated substrates
US9895771B2 (en) 2012-02-28 2018-02-20 General Lasertronics Corporation Laser ablation for the environmentally beneficial removal of surface coatings
JP2013188785A (ja) * 2012-03-15 2013-09-26 Mitsuboshi Diamond Industrial Co Ltd 被加工物の加工方法および分割方法
US9266192B2 (en) * 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
CN103111757A (zh) * 2013-02-01 2013-05-22 武汉帝尔激光科技有限公司 一种多焦点激光加工系统
CN103111755A (zh) * 2013-02-01 2013-05-22 武汉帝尔激光科技有限公司 一种双焦点激光加工系统
CN103240524B (zh) * 2013-05-23 2015-07-08 广东工业大学 一种基于扫描振镜的分时分焦装置及方法
DE102013212685A1 (de) * 2013-06-28 2014-12-31 Trumpf Laser- Und Systemtechnik Gmbh Strahlbeeinflussungsoptik und Strahlformungssystem
US9460966B2 (en) * 2013-10-10 2016-10-04 Applied Materials, Inc. Method and apparatus for dicing wafers having thick passivation polymer layer
KR102128968B1 (ko) * 2013-10-15 2020-07-02 삼성디스플레이 주식회사 금속 마스크 및 금속 마스크 제조 방법
US9041198B2 (en) * 2013-10-22 2015-05-26 Applied Materials, Inc. Maskless hybrid laser scribing and plasma etching wafer dicing process
US10086597B2 (en) 2014-01-21 2018-10-02 General Lasertronics Corporation Laser film debonding method
JP5965454B2 (ja) * 2014-10-14 2016-08-03 株式会社アマダホールディングス ダイレクトダイオードレーザ加工装置及びこれを用いた板金の加工方法
CN104526892A (zh) * 2014-12-23 2015-04-22 苏州凯锝微电子有限公司 晶圆切割装置
KR101667792B1 (ko) * 2015-03-24 2016-10-20 주식회사 필옵틱스 간섭 빔을 이용한 절단용 광학기기
US9786562B2 (en) 2015-04-21 2017-10-10 Asm Technology Singapore Pte Ltd Method and device for cutting wafers
JP6482389B2 (ja) * 2015-06-02 2019-03-13 株式会社ディスコ ウエーハの生成方法
CN105728954B (zh) * 2016-04-27 2017-04-19 桂林电子科技大学 一种双激光加工水浸工件的方法和系统
CN106216856B (zh) * 2016-08-22 2019-04-16 大族激光科技产业集团股份有限公司 双焦点激光加工系统及其加工方法
CN106695113B (zh) * 2016-12-08 2018-11-06 华中科技大学 一种轴向的双焦点镜头
CN106493474B (zh) * 2016-12-19 2019-06-18 北京中科镭特电子有限公司 一种激光双面切划装置
CN106950706A (zh) * 2017-04-26 2017-07-14 深圳迈进自动化科技有限公司 一种用于产生多个焦深的光路装置
FR3070387A1 (fr) * 2017-08-30 2019-03-01 Saint-Gobain Glass France Dispositif de traitement thermique ameliore
TWI648524B (zh) * 2017-10-03 2019-01-21 財團法人工業技術研究院 多層材料加工裝置及其方法
KR102428750B1 (ko) 2017-10-19 2022-08-02 사이머 엘엘씨 단일의 리소그래피 노광 패스로 복수의 에어리얼 이미지를 형성하는 방법
EP3723645A4 (de) * 2017-12-14 2021-08-25 Avava, Inc. System und verfahren für elektromagnetische strahlungsbündelabtastung
US11287743B2 (en) 2018-03-12 2022-03-29 Asml Netherlands B.V. Control system and method
WO2019190700A1 (en) 2018-03-30 2019-10-03 Cymer, Llc Spectral feature selection and pulse timing control of a pulsed light beam
DE102018111227A1 (de) * 2018-05-09 2019-11-14 Osram Opto Semiconductors Gmbh Verfahren zum Durchtrennen eines epitaktisch gewachsenen Halbleiterkörpers und Halbleiterchip
WO2020091065A1 (ja) * 2018-11-02 2020-05-07 日東電工株式会社 偏光性光学機能フィルム積層体のレーザー切断加工方法
DE102019201033A1 (de) * 2019-01-28 2020-07-30 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum automatisierten Ermitteln des Einflusses eines Schneidparameters beim Laserschneiden sowie Laserbearbeitungsmaschine und Computerprogrammprodukt
DE102019103814B3 (de) * 2019-02-14 2020-07-02 Hochschule Trier - Trier University of Applied Sciences Vorrichtung zum optischen Messen einer Oberfläche
TWI749546B (zh) 2019-05-14 2021-12-11 美商希瑪有限責任公司 用於調變光源波長的裝置及方法
WO2020236648A1 (en) 2019-05-22 2020-11-26 Cymer, Llc Control system for a plurality of deep ultraviolet optical oscillators
US12586978B2 (en) 2019-05-22 2026-03-24 Cymer, Llc Apparatus for and method of generating multiple laser beams
KR102628796B1 (ko) 2019-07-23 2024-01-23 사이머 엘엘씨 반복률 편차에 의해 유도된 파장 오차를 보상하는 방법
CN110510887A (zh) * 2019-08-21 2019-11-29 吉林大学 多焦点光学曲面的制造方法和光学装置
JP7276661B2 (ja) * 2019-09-03 2023-05-18 王子ホールディングス株式会社 シート状物の欠陥検査装置及び製造方法
CN112750716B (zh) * 2019-10-29 2022-12-30 成都辰显光电有限公司 微元件的剥离装置以及剥离方法
CN112824003B (zh) * 2019-11-21 2023-11-03 深圳市大族半导体装备科技有限公司 激光切割方法、装置、计算机设备及存储介质
CN111822886B (zh) * 2020-06-11 2022-11-22 华东师范大学重庆研究院 一种微流控芯片微通道的多焦点超快激光制备装置及方法
JP7592486B2 (ja) * 2020-12-25 2024-12-02 株式会社タムロン レーザ加工装置の光学系、レーザ加工装置
CN113009704A (zh) * 2021-02-25 2021-06-22 中国科学院理化技术研究所 一种一体式偏振激光分光装置及其系统
CN115041814B (zh) * 2021-02-26 2024-11-12 深圳市大族半导体装备科技有限公司 一种脆性材料的激光加工装置及加工方法
JP7844124B2 (ja) 2021-09-24 2026-04-13 株式会社ディスコ 板状物の加工方法
JP7847960B2 (ja) * 2021-09-27 2026-04-20 株式会社ディスコ 板状物の加工方法
CN115673558A (zh) * 2022-11-11 2023-02-03 五邑大学 一种复合激光器系统及用复合激光器系统除漆的方法与应用
CN116604191A (zh) * 2023-07-11 2023-08-18 山东理工大学 一种双光束超快激光高效微纳加工方法及装置
CN120038444B (zh) * 2023-11-24 2026-02-27 中国科学院微电子研究所 激光复合加工晶圆的系统和方法
GB2637171A (en) * 2024-01-12 2025-07-16 Aqualase Ltd Laser drilling and cutting method and apparatus

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3710798A (en) * 1971-08-30 1973-01-16 American Optical Corp Laser system for microsurgery
GB1553582A (en) * 1977-04-14 1979-09-26 Boc Ltd Laser beam splitting apparatus
JPS60108802A (ja) * 1983-11-18 1985-06-14 Fuji Photo Film Co Ltd 光ビ−ム合成方法及び装置
US4644160A (en) * 1983-12-14 1987-02-17 Hitachi, Ltd. System for holding plural light beams in predetermined relative positions
US4780616A (en) * 1986-09-25 1988-10-25 Nippon Kogaku K. K. Projection optical apparatus for mask to substrate alignment
JPH0767633B2 (ja) * 1987-11-30 1995-07-26 三菱重工業株式会社 同軸多焦点式レーザビーム集光装置
US5349592A (en) * 1992-02-27 1994-09-20 Kabushiki Kaisha Toshiba Super-resolution optical element for use in image forming apparatus
US5251198A (en) * 1992-05-29 1993-10-05 Strickler James H Reading device for multi-layered optical information carrier
US5383024A (en) * 1992-08-12 1995-01-17 Martin Marietta Energy Systems, Inc. Optical wet steam monitor
US5815293A (en) * 1993-02-01 1998-09-29 Matsushita Electric Industrial Co., Ltd. Compound objective lens having two focal points
JP2664625B2 (ja) * 1993-09-10 1997-10-15 川崎重工業株式会社 レーザ切断方法および装置
US5508992A (en) * 1993-09-29 1996-04-16 Tdk Corporation Magneto-optical recording/reproducing pickup head with a diffraction grating and a wollaston prism
JPH08108289A (ja) * 1994-10-07 1996-04-30 Sumitomo Electric Ind Ltd レーザ加工用光学装置
US5671207A (en) * 1995-02-23 1997-09-23 Lg Electronics, Inc. Optical pickup apparatus for performing multi-focusing
EP1109164B1 (de) * 1995-06-05 2005-12-07 Nec Corporation Optische Wiedergabekopfvorrichtung für verschiedene Plattentypen
JPH0943537A (ja) * 1995-07-31 1997-02-14 Nec Corp レーザビーム合成装置
GB9516099D0 (en) * 1995-08-05 1995-10-04 Boc Group Plc Laser cutting of materials
JPH09159966A (ja) * 1995-12-06 1997-06-20 Nec Corp レーザ光学装置
KR970063064A (ko) * 1995-12-22 1997-09-12 배순훈 듀얼 포커스 광 픽-업장치
DK109197A (da) * 1996-09-30 1998-03-31 Force Instituttet Fremgangsmåde til bearbejdning af et materiale ved hjælp af en laserstråle
JP3319310B2 (ja) 1996-11-08 2002-08-26 松下電器産業株式会社 故障診断回路
JP3812051B2 (ja) * 1997-04-30 2006-08-23 株式会社ニコン 反射屈折投影光学系
JP2001030089A (ja) * 1999-07-19 2001-02-06 Sumitomo Electric Ind Ltd レーザ溶接方法
FR2803549B1 (fr) * 2000-01-10 2002-03-29 Air Liquide Procede et installation de coupage laser d'acier doux ou de construction avec optique multifocale
JP4627893B2 (ja) * 2000-03-07 2011-02-09 株式会社アマダエンジニアリングセンター レーザ加工方法およびその装置
JP2001287069A (ja) * 2000-04-05 2001-10-16 Hitachi Via Mechanics Ltd レーザビームの合成方法およびレーザビーム合成装置並びにレーザ加工装置
KR100500343B1 (ko) * 2000-08-29 2005-07-12 미쓰비시덴키 가부시키가이샤 레이저 가공 장치
WO2002052305A2 (en) * 2000-12-27 2002-07-04 Technion Research And Development Foundation Ltd. Space-variant subwavelength polarization grating and applications thereof
US6770544B2 (en) * 2001-02-21 2004-08-03 Nec Machinery Corporation Substrate cutting method
SG108262A1 (en) 2001-07-06 2005-01-28 Inst Data Storage Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
FR2828825B1 (fr) * 2001-08-22 2003-12-26 Air Liquide Procede et installation de coupage par faisceau laser utilisant un objectif a multifocales et une tuyere convergente/divergente
WO2003041904A1 (en) * 2001-11-15 2003-05-22 Mitsubishi Denki Kabushiki Kaisha Laser beam machining device

Also Published As

Publication number Publication date
EP1631415A1 (de) 2006-03-08
JP2006525874A (ja) 2006-11-16
KR20060009019A (ko) 2006-01-27
KR101167140B1 (ko) 2012-07-20
EP1631415B1 (de) 2008-04-09
JP4751319B2 (ja) 2011-08-17
CN1826206A (zh) 2006-08-30
WO2004105995A1 (en) 2004-12-09
DE602004012999D1 (en) 2008-05-21
GB2402230A (en) 2004-12-01
TW200428729A (en) 2004-12-16
CN1826206B (zh) 2010-10-27
GB2402230B (en) 2006-05-03
GB0312469D0 (en) 2003-07-09
TWI260843B (en) 2006-08-21
US7858901B2 (en) 2010-12-28
MY149114A (en) 2013-07-15
DE602004012999T2 (de) 2009-05-28
US20060261050A1 (en) 2006-11-23

Similar Documents

Publication Publication Date Title
ATE391576T1 (de) Fokussierung eines optischen strahles auf zwei fokusse
CN112904526B (zh) 基于差动共焦探测具有抗噪能力的高精度自动对焦方法及装置
ATE343148T1 (de) Vorrichtung zur fokussierung eines laserstrahls
CN112748510A (zh) 一种兼具自动调平功能的扫描式自动对焦方法及装置
PT988580E (pt) Holografia directa a digital interferometria holografica e holovisao
DE60116268D1 (de) Hochdurchsatzscreening-mikroskop mit autofokus-einrichtung
EP1313095A3 (de) Kompatibles optisches Abstastgerät
ES2184445T3 (es) Dispositivo de medicion de los defectos de la vision en el hombre y metodo correspondiente.
CN112684572B (zh) 一种兼具自动调平功能的自动对焦方法及装置
DE502005007296D1 (de) Scannerkopf und bearbeitungsmaschine damit
WO2005081372A3 (en) Laser multiplexing
CN107765426A (zh) 基于对称离焦双探测器的自聚焦激光扫描投影装置
WO2006090248A3 (en) Method and apparatus for laser processing
TW200634789A (en) Optical pick-up, method of generating aberration for compensation and optical information processing apparatus using the same
ATE365092T1 (de) Laserschneidgerät
EP1898404A3 (de) Optische Lesekopfvorrichtung
JP2005316069A (ja) レーザ集光光学系及びレーザ加工装置
DE60315983D1 (de) Vorrichtung zum abtasten und zum reinigen eines informationsträgers
EP1755116A3 (de) Optische Lesekopfvorrichtung mit Funktion für Erkennung und Korrektur sphärischer Aberration aufgrund von Dickevariationen bei der Aufzeichnungsschicht
Zhu et al. System for measurement of CCD parameters
CN100412969C (zh) 光学系统及使用所述光学系统的光学记录/再现装置
EP1708184A3 (de) Optischer Lesekopf, optische Aufzeichnungs- und/oder Wiedergabevorrichtung damit und Verfahren zur Detektion von Spurfolgefehlersignalen
Shi et al. Numerical Analysis of Tightly Focused Spot for Confocal Microscopy Illumination by a Real Lens System
RU2002105594A (ru) Способ записи информации на криволинейных поверхностях
JP2719421B2 (ja) 光学式ピックアップ装置

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1631415

Country of ref document: EP

REN Ceased due to non-payment of the annual fee