ATE392007T1 - Endblock für eine sputter-vorrichtung mit drehbarem target - Google Patents

Endblock für eine sputter-vorrichtung mit drehbarem target

Info

Publication number
ATE392007T1
ATE392007T1 AT05797244T AT05797244T ATE392007T1 AT E392007 T1 ATE392007 T1 AT E392007T1 AT 05797244 T AT05797244 T AT 05797244T AT 05797244 T AT05797244 T AT 05797244T AT E392007 T1 ATE392007 T1 AT E392007T1
Authority
AT
Austria
Prior art keywords
block
end block
contacting
rotating target
shoes
Prior art date
Application number
AT05797244T
Other languages
English (en)
Inventor
Krist Dellaert
Bosscher Wilmert De
Boever Joannes De
Stijn Porteman
Original Assignee
Bekaert Advanced Coatings
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bekaert Advanced Coatings filed Critical Bekaert Advanced Coatings
Application granted granted Critical
Publication of ATE392007T1 publication Critical patent/ATE392007T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Motor Or Generator Current Collectors (AREA)
  • Pens And Brushes (AREA)
  • Medicines Containing Antibodies Or Antigens For Use As Internal Diagnostic Agents (AREA)
AT05797244T 2004-10-18 2005-10-11 Endblock für eine sputter-vorrichtung mit drehbarem target ATE392007T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04105116 2004-10-18

Publications (1)

Publication Number Publication Date
ATE392007T1 true ATE392007T1 (de) 2008-04-15

Family

ID=34929716

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05797244T ATE392007T1 (de) 2004-10-18 2005-10-11 Endblock für eine sputter-vorrichtung mit drehbarem target

Country Status (7)

Country Link
US (1) US7824528B2 (de)
EP (1) EP1803144B1 (de)
JP (1) JP4836956B2 (de)
CN (2) CN100564580C (de)
AT (1) ATE392007T1 (de)
DE (1) DE602005006008T2 (de)
WO (1) WO2006042808A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9349576B2 (en) * 2006-03-17 2016-05-24 Angstrom Sciences, Inc. Magnetron for cylindrical targets
JP5080573B2 (ja) * 2006-06-19 2012-11-21 ソレラス・アドヴァンスト・コーティングス・ナムローゼ・フェンノートシャップ スパッタリング設備のエンドブロック用のインサート部品
DE102007049735B4 (de) * 2006-10-17 2012-03-29 Von Ardenne Anlagentechnik Gmbh Versorgungsendblock für ein Rohrmagnetron
US8061975B2 (en) * 2007-08-31 2011-11-22 General Electric Company Slipring bushing assembly for moveable turbine vane
US8197196B2 (en) * 2007-08-31 2012-06-12 General Electric Company Bushing and clock spring assembly for moveable turbine vane
US8182662B2 (en) * 2009-03-27 2012-05-22 Sputtering Components, Inc. Rotary cathode for magnetron sputtering apparatus
US8951394B2 (en) 2010-01-29 2015-02-10 Angstrom Sciences, Inc. Cylindrical magnetron having a shunt
EP2371992B1 (de) * 2010-04-01 2013-06-05 Applied Materials, Inc. Endblock und Zerstäubungsvorrichtung
JP5491258B2 (ja) * 2010-04-02 2014-05-14 出光興産株式会社 酸化物半導体の成膜方法
EP2387063B1 (de) * 2010-05-11 2014-04-30 Applied Materials, Inc. Kammer zur physikalischen Dampfabscheidung
KR101988391B1 (ko) 2011-06-27 2019-06-12 솔레라스 리미티드 스퍼터링 타겟
CN102251223A (zh) * 2011-06-28 2011-11-23 黄峰 用于旋转靶的配电装置
CN104937135B (zh) * 2013-01-28 2018-01-19 应用材料公司 基板载体配置与夹持基板的方法
US9809876B2 (en) 2014-01-13 2017-11-07 Centre Luxembourgeois De Recherches Pour Le Verre Et La Ceramique (C.R.V.C.) Sarl Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure
DE102014115280B4 (de) * 2014-10-20 2023-02-02 VON ARDENNE Asset GmbH & Co. KG Magnetronanordnung
GB201505528D0 (en) 2015-03-31 2015-05-13 Gencoa Ltd Rotational device-III
BE1023876B1 (nl) 2016-07-13 2017-08-31 Soleras Advanced Coatings Bvba Elektrische overdracht in een eindblok
BE1024754B9 (nl) * 2016-11-29 2018-07-24 Soleras Advanced Coatings Bvba Een universeel monteerbaar eindblok
DE102021129524A1 (de) * 2021-11-12 2023-05-17 VON ARDENNE Asset GmbH & Co. KG Magnetsystem und Sputtervorrichtung
CN114107929A (zh) * 2021-11-29 2022-03-01 青岛科技大学 一种可预热溅射靶材的旋靶管装置
CN115466930B (zh) * 2022-09-13 2023-05-23 安徽其芒光电科技有限公司 镀膜设备及其靶材承载装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356073A (en) 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
US5200049A (en) * 1990-08-10 1993-04-06 Viratec Thin Films, Inc. Cantilever mount for rotating cylindrical magnetrons
DE4106770C2 (de) 1991-03-04 1996-10-17 Leybold Ag Verrichtung zum reaktiven Beschichten eines Substrats
US5171411A (en) * 1991-05-21 1992-12-15 The Boc Group, Inc. Rotating cylindrical magnetron structure with self supporting zinc alloy target
US5445721A (en) * 1994-08-25 1995-08-29 The Boc Group, Inc. Rotatable magnetron including a replacement target structure
CN1053712C (zh) * 1997-04-30 2000-06-21 浙江大学 旋转靶柱型磁控溅射靶源
WO2000028104A1 (en) * 1998-11-06 2000-05-18 Scivac Sputtering apparatus and process for high rate coatings
US7399385B2 (en) * 2001-06-14 2008-07-15 Tru Vue, Inc. Alternating current rotatable sputter cathode
US6736948B2 (en) 2002-01-18 2004-05-18 Von Ardenne Anlagentechnik Gmbh Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation
US20030173217A1 (en) * 2002-03-14 2003-09-18 Sputtering Components, Inc. High-power ion sputtering magnetron

Also Published As

Publication number Publication date
CN101044586B (zh) 2010-06-16
CN101044586A (zh) 2007-09-26
JP2008517151A (ja) 2008-05-22
WO2006042808A1 (en) 2006-04-27
CN100564580C (zh) 2009-12-02
EP1803144B1 (de) 2008-04-09
US7824528B2 (en) 2010-11-02
CN101044257A (zh) 2007-09-26
JP4836956B2 (ja) 2011-12-14
US20080087541A1 (en) 2008-04-17
EP1803144A1 (de) 2007-07-04
DE602005006008D1 (de) 2008-05-21
DE602005006008T2 (de) 2009-06-18

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