ATE396606T1 - System und verfahren für die montage von bauelementen in einer elektronischen vorrichtung - Google Patents

System und verfahren für die montage von bauelementen in einer elektronischen vorrichtung

Info

Publication number
ATE396606T1
ATE396606T1 AT06110874T AT06110874T ATE396606T1 AT E396606 T1 ATE396606 T1 AT E396606T1 AT 06110874 T AT06110874 T AT 06110874T AT 06110874 T AT06110874 T AT 06110874T AT E396606 T1 ATE396606 T1 AT E396606T1
Authority
AT
Austria
Prior art keywords
electronic device
component
mounting components
platform
cap
Prior art date
Application number
AT06110874T
Other languages
English (en)
Inventor
Jason Everette Hamilton
Tim Kyowski
Original Assignee
Research In Motion Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Research In Motion Ltd filed Critical Research In Motion Ltd
Application granted granted Critical
Publication of ATE396606T1 publication Critical patent/ATE396606T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Telephone Set Structure (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Photoreceptors In Electrophotography (AREA)
AT06110874T 2006-03-08 2006-03-08 System und verfahren für die montage von bauelementen in einer elektronischen vorrichtung ATE396606T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06110874A EP1833284B1 (de) 2006-03-08 2006-03-08 System und Verfahren für die Montage von Bauelementen in einer elektronischen Vorrichtung

Publications (1)

Publication Number Publication Date
ATE396606T1 true ATE396606T1 (de) 2008-06-15

Family

ID=36501867

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06110874T ATE396606T1 (de) 2006-03-08 2006-03-08 System und verfahren für die montage von bauelementen in einer elektronischen vorrichtung

Country Status (4)

Country Link
EP (1) EP1833284B1 (de)
AT (1) ATE396606T1 (de)
CA (1) CA2580031C (de)
DE (1) DE602006001292D1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2416544B1 (de) * 2010-08-06 2015-04-29 BlackBerry Limited Elektromagnetische Abschirmung und akustische Kammer eines Mikrofons in einer mobilen elektronischen Vorrichtung
US8340735B2 (en) 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
US9391378B2 (en) 2011-12-23 2016-07-12 Intel Corporation High bandwidth connector for internal and external IO interfaces

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4073682B2 (ja) * 2002-02-22 2008-04-09 日本特殊陶業株式会社 シールドキャップ付電子部品
JP2004022711A (ja) * 2002-06-14 2004-01-22 Ngk Spark Plug Co Ltd シールドキャップ付電子部品
JP4037810B2 (ja) * 2003-09-05 2008-01-23 Ｎｅｃアクセステクニカ株式会社 小型無線装置及びその実装方法

Also Published As

Publication number Publication date
CA2580031C (en) 2011-05-03
EP1833284A1 (de) 2007-09-12
EP1833284B1 (de) 2008-05-21
DE602006001292D1 (de) 2008-07-03
CA2580031A1 (en) 2007-09-08

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Legal Events

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