ATE398661T1 - Nanoröhrchen-basiertes, direktional leitendes haftmittel - Google Patents

Nanoröhrchen-basiertes, direktional leitendes haftmittel

Info

Publication number
ATE398661T1
ATE398661T1 AT05819759T AT05819759T ATE398661T1 AT E398661 T1 ATE398661 T1 AT E398661T1 AT 05819759 T AT05819759 T AT 05819759T AT 05819759 T AT05819759 T AT 05819759T AT E398661 T1 ATE398661 T1 AT E398661T1
Authority
AT
Austria
Prior art keywords
carbon nanotubes
type material
tape base
conductive adhesive
integrated circuit
Prior art date
Application number
AT05819759T
Other languages
English (en)
Inventor
Chris Wyland
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE398661T1 publication Critical patent/ATE398661T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Composite Materials (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
AT05819759T 2004-11-04 2005-11-04 Nanoröhrchen-basiertes, direktional leitendes haftmittel ATE398661T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62542704P 2004-11-04 2004-11-04

Publications (1)

Publication Number Publication Date
ATE398661T1 true ATE398661T1 (de) 2008-07-15

Family

ID=35892377

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05819759T ATE398661T1 (de) 2004-11-04 2005-11-04 Nanoröhrchen-basiertes, direktional leitendes haftmittel

Country Status (9)

Country Link
US (1) US8399982B2 (de)
EP (1) EP1809716B1 (de)
JP (1) JP4763707B2 (de)
KR (1) KR101148687B1 (de)
CN (1) CN101094901B (de)
AT (1) ATE398661T1 (de)
DE (1) DE602005007626D1 (de)
TW (1) TWI463615B (de)
WO (1) WO2006048847A1 (de)

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DE102007007617A1 (de) * 2007-02-13 2008-08-14 Tesa Ag Intrinsisch erwärmbare heißschmelzklebrige Flächengebilde
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US8647922B2 (en) 2007-11-08 2014-02-11 Nanyang Technological University Method of forming an interconnect on a semiconductor substrate
WO2009091882A2 (en) * 2008-01-15 2009-07-23 Georgia Tech Research Corporation Systems and methods for fabrication & transfer of carbon nanotubes
CN102007571B (zh) 2008-02-25 2016-01-20 斯莫特克有限公司 纳米结构制造过程中的导电助层的沉积和选择性移除
US7881785B2 (en) 2008-03-26 2011-02-01 Cardiac Science Corporation Method and apparatus for defrosting a defibrillation electrode
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JP4528359B2 (ja) * 2008-04-16 2010-08-18 日東電工株式会社 繊維状柱状構造体集合体およびそれを用いた粘着部材
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EP2637868A4 (de) * 2010-11-12 2015-04-22 Nanocomp Technologies Inc Systeme und verfahren für das wärmemanagement elektronischer komponenten
US9102851B2 (en) * 2011-09-15 2015-08-11 Trillion Science, Inc. Microcavity carrier belt and method of manufacture
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US8753924B2 (en) 2012-03-08 2014-06-17 Texas Instruments Incorporated Grown carbon nanotube die attach structures, articles, devices, and processes for making them
WO2014204561A1 (en) 2013-06-17 2014-12-24 Nanocomp Technologies, Inc. Exfoliating-dispersing agents for nanotubes, bundles and fibers
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US9871014B2 (en) * 2015-09-08 2018-01-16 Invensas Corporation 3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
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Also Published As

Publication number Publication date
CN101094901B (zh) 2010-10-13
TW200629510A (en) 2006-08-16
EP1809716B1 (de) 2008-06-18
KR20070083948A (ko) 2007-08-24
DE602005007626D1 (de) 2008-07-31
EP1809716A1 (de) 2007-07-25
JP4763707B2 (ja) 2011-08-31
KR101148687B1 (ko) 2012-05-23
JP2008519122A (ja) 2008-06-05
US20090127712A1 (en) 2009-05-21
TWI463615B (zh) 2014-12-01
US8399982B2 (en) 2013-03-19
WO2006048847A1 (en) 2006-05-11
CN101094901A (zh) 2007-12-26

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