ATE399328T1 - Elektrische testsonden und verfahren zu ihrer herstellung - Google Patents

Elektrische testsonden und verfahren zu ihrer herstellung

Info

Publication number
ATE399328T1
ATE399328T1 AT02761808T AT02761808T ATE399328T1 AT E399328 T1 ATE399328 T1 AT E399328T1 AT 02761808 T AT02761808 T AT 02761808T AT 02761808 T AT02761808 T AT 02761808T AT E399328 T1 ATE399328 T1 AT E399328T1
Authority
AT
Austria
Prior art keywords
production
test probe
electrical test
probe plunger
probe
Prior art date
Application number
AT02761808T
Other languages
English (en)
Inventor
Theresa Souza
Larre Nelson
Original Assignee
Rika Denshi America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rika Denshi America Inc filed Critical Rika Denshi America Inc
Application granted granted Critical
Publication of ATE399328T1 publication Critical patent/ATE399328T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
AT02761808T 2001-09-24 2002-09-24 Elektrische testsonden und verfahren zu ihrer herstellung ATE399328T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US32425201P 2001-09-24 2001-09-24

Publications (1)

Publication Number Publication Date
ATE399328T1 true ATE399328T1 (de) 2008-07-15

Family

ID=23262772

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02761808T ATE399328T1 (de) 2001-09-24 2002-09-24 Elektrische testsonden und verfahren zu ihrer herstellung

Country Status (8)

Country Link
US (1) US6667629B2 (de)
EP (1) EP1444528B1 (de)
JP (1) JP3833216B2 (de)
KR (1) KR20040045452A (de)
AT (1) ATE399328T1 (de)
DE (1) DE60227277D1 (de)
TW (1) TWI239402B (de)
WO (1) WO2003027689A1 (de)

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US6807734B2 (en) * 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
ATE371196T1 (de) * 2002-03-05 2007-09-15 Rika Denshi America Inc Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten
WO2006007440A1 (en) * 2004-06-16 2006-01-19 Rika Denshi America, Inc. Electrical test probes, methods of making, and methods of using
US7667471B2 (en) * 2004-12-14 2010-02-23 Advantest Corporation Contact pin probe card and electronic device test apparatus using same
WO2007034921A1 (ja) 2005-09-22 2007-03-29 Enplas Corporation 電気接触子及び電気部品用ソケット
US7589545B2 (en) 2006-03-01 2009-09-15 Atmel Germany Gmbh Device for final inspection
US7545159B2 (en) * 2006-06-01 2009-06-09 Rika Denshi America, Inc. Electrical test probes with a contact element, methods of making and using the same
JP5318375B2 (ja) * 2007-06-25 2013-10-16 株式会社サンユー パラジウム−コバルト合金めっき液、パラジウム−コバルト合金被膜の形成方法及びパラジウム−コバルト合金硬質被膜の製造方法
US7847191B2 (en) * 2007-11-06 2010-12-07 Xerox Corporation Electrical component, manufacturing system and method
US8907226B2 (en) * 2008-03-11 2014-12-09 Hitachi Metals, Ltd. Conductor for flexible substrate and fabrication method of same, and flexible substrate using same
JP4808794B2 (ja) * 2008-03-28 2011-11-02 パナソニック株式会社 半導体検査装置
KR101235228B1 (ko) * 2008-08-08 2013-02-20 니혼 하츠쵸 가부시키가이샤 워크 부재, 전기 접점 부재, 콘택트 프로브 및 전기 접점 부재의 제조방법
JP5597385B2 (ja) 2009-11-19 2014-10-01 株式会社日本マイクロニクス 電気的試験用プローブ、それを用いた電気的接続装置、及びプローブの製造方法
NO3181243T3 (de) 2010-10-04 2018-08-11
JP5798315B2 (ja) 2010-11-19 2015-10-21 株式会社神戸製鋼所 コンタクトプローブピン
JP2013088389A (ja) * 2011-10-21 2013-05-13 Tokyo Electron Ltd プローブカード用接触端子及びプローブカード
JP2013101043A (ja) * 2011-11-08 2013-05-23 Renesas Electronics Corp 半導体装置の製造方法
US9698511B2 (en) * 2012-03-21 2017-07-04 Enplas Corporation Electric contact and socket for electrical part
WO2015067312A1 (de) * 2013-11-07 2015-05-14 Heraeus Deutschland GmbH & Co. KG Prüfnadel und verfahren zur herstellung einer prüfnadel
JP2014145772A (ja) * 2014-03-28 2014-08-14 Kobe Steel Ltd コンタクトプローブピン
CN107257928B (zh) * 2014-12-30 2020-12-01 泰克诺探头公司 用于测试头的接触探针
JP7005939B2 (ja) * 2017-05-25 2022-01-24 日本電産リード株式会社 コンタクトプローブ
CN109752574A (zh) * 2017-11-07 2019-05-14 特克特朗尼克公司 探头末端和探头组件
WO2020158575A1 (ja) 2019-01-29 2020-08-06 株式会社ヨコオ プランジャーおよびコンタクトプローブ
JP6855149B1 (ja) * 2020-03-25 2021-04-07 松田産業株式会社 パラジウム−コバルト合金皮膜
KR102235724B1 (ko) * 2020-04-10 2021-04-02 주식회사 메가터치 전자 부품 제조용 금속 자재 제조 방법, 그 금속 자재 및 그 금속 자재를 이용하여 제조된 포고핀
KR102877116B1 (ko) * 2021-03-30 2025-10-27 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이의 제조방법
KR102763456B1 (ko) * 2022-05-11 2025-02-07 (주)티에스이 프로브 팁의 제조 방법 및 이에 의해 제조된 프로브 팁
EP4325227B1 (de) * 2022-08-16 2025-10-01 Heraeus Precious Metals GmbH & Co. KG Bandförmiger verbundwerkstoff für prüfnadeln
KR102861545B1 (ko) * 2024-02-26 2025-09-18 전민수 반도체 테스트용 프로브핀

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CH659137A5 (en) * 1983-03-25 1986-12-31 Alusuisse Test probe for determining the voltage drop across bottom carbon elements of aluminium fusion electrolysis cells
DE3533227A1 (de) * 1984-09-27 1986-04-03 Feinmetall Gmbh, 7033 Herrenberg Federkontaktstift
US4659987A (en) * 1985-03-25 1987-04-21 Qa Technology Company Electrical circuit test probe and connector
EP0250146A1 (de) 1986-06-16 1987-12-23 Texas Instruments Incorporated Leiterrahmen, plattiert mit Palladium, für integrierte Schaltung
DE68923024T2 (de) 1988-03-28 1995-11-02 Texas Instruments Inc Leiterrahmen mit verminderter Korrosion.
US5276351A (en) 1988-10-17 1994-01-04 Semiconductor Energy Laboratory Co., Ltd. Electronic device and a manufacturing method for the same
US5015803A (en) 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
KR920000127A (ko) 1990-02-26 1992-01-10 미다 가쓰시게 반도체 패키지와 그것을 위한 리드프레임
US5236789A (en) 1991-07-01 1993-08-17 Olin Corporation Palladium alloys having utility in electrical applications
EP0537982A2 (de) 1991-10-14 1993-04-21 Fujitsu Limited Halbleiteranordnung mit verbesserten Leitern
US5343073A (en) 1992-01-17 1994-08-30 Olin Corporation Lead frames having a chromium and zinc alloy coating
KR940001341A (ko) * 1992-06-29 1994-01-11 디. 아이. 캐플란 전자 장치로의 빠른 전기 접근을 위한 순간 접속법
US5360991A (en) 1993-07-29 1994-11-01 At&T Bell Laboratories Integrated circuit devices with solderable lead frame
JP3693300B2 (ja) 1993-09-03 2005-09-07 日本特殊陶業株式会社 半導体パッケージの外部接続端子及びその製造方法
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US5713744A (en) 1994-09-28 1998-02-03 The Whitaker Corporation Integrated circuit socket for ball grid array and land grid array lead styles
US5744977A (en) * 1994-12-21 1998-04-28 Delaware Capital Formation, Inc. High-force spring probe with improved axial alignment
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JP3259894B2 (ja) 1996-04-30 2002-02-25 ソニー株式会社 リードフレーム、その製造方法及びそのリードフレームを用いた半導体装置
DE19617488C2 (de) * 1996-05-02 2002-03-07 Gustav Krueger Kontaktelement für lösbare elektrische Verbindungen
US5994762A (en) 1996-07-26 1999-11-30 Hitachi, Ltd. Semiconductor integrated circuit device including boron-doped phospho silicate glass layer and manufacturing method thereof
US6037653A (en) 1997-03-25 2000-03-14 Samsung Aerospace Industries, Ltd. Semiconductor lead frame having multi-layered plating layer including copper-nickel plating layer
TW401634B (en) 1997-04-09 2000-08-11 Sitron Prec Co Ltd Lead frame and its manufacture method
US5910644A (en) 1997-06-11 1999-06-08 International Business Machines Corporation Universal surface finish for DCA, SMT and pad on pad interconnections
US6083633A (en) 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
US5892223A (en) * 1997-06-30 1999-04-06 Harris Corporation Multilayer microtip probe and method
US5935719A (en) 1997-08-29 1999-08-10 Texas Instruments Incorporated Lead-free, nickel-free and cyanide-free plating finish for semiconductor leadframes
KR20010033843A (ko) 1998-01-05 2001-04-25 리카 일렉트로닉스 인터내셔널, 인크. 동축 전기 접점 조립체
JP2003526874A (ja) 1998-11-25 2003-09-09 リカ エレクトロニクス インターナショナル インコーポレイテッド 電気接触装置
US6335107B1 (en) * 1999-09-23 2002-01-01 Lucent Technologies Inc. Metal article coated with multilayer surface finish for porosity reduction
JP3551411B2 (ja) 1999-10-27 2004-08-04 常木鍍金工業株式会社 接点部材及びその製造方法

Also Published As

Publication number Publication date
TWI239402B (en) 2005-09-11
WO2003027689A1 (en) 2003-04-03
JP2005504962A (ja) 2005-02-17
KR20040045452A (ko) 2004-06-01
DE60227277D1 (de) 2008-08-07
EP1444528B1 (de) 2008-06-25
TW200405012A (en) 2004-04-01
US6667629B2 (en) 2003-12-23
JP3833216B2 (ja) 2006-10-11
EP1444528A1 (de) 2004-08-11
EP1444528A4 (de) 2005-12-28
US20030102877A1 (en) 2003-06-05

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