ATE399889T1 - Verfahren und vorrichtung zum beschichten eines substrats - Google Patents

Verfahren und vorrichtung zum beschichten eines substrats

Info

Publication number
ATE399889T1
ATE399889T1 AT03710534T AT03710534T ATE399889T1 AT E399889 T1 ATE399889 T1 AT E399889T1 AT 03710534 T AT03710534 T AT 03710534T AT 03710534 T AT03710534 T AT 03710534T AT E399889 T1 ATE399889 T1 AT E399889T1
Authority
AT
Austria
Prior art keywords
substrate
vaporized
coating
space
electromagnetic field
Prior art date
Application number
AT03710534T
Other languages
English (en)
Inventor
Van Westrum Johannes A Schade
Gerardus Gleijm
Original Assignee
Corus Technology Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corus Technology Bv filed Critical Corus Technology Bv
Application granted granted Critical
Publication of ATE399889T1 publication Critical patent/ATE399889T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AT03710534T 2002-02-21 2003-02-21 Verfahren und vorrichtung zum beschichten eines substrats ATE399889T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1020059A NL1020059C2 (nl) 2002-02-21 2002-02-21 Werkwijze en inrichting voor het bekleden van een substraat.

Publications (1)

Publication Number Publication Date
ATE399889T1 true ATE399889T1 (de) 2008-07-15

Family

ID=27752086

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03710534T ATE399889T1 (de) 2002-02-21 2003-02-21 Verfahren und vorrichtung zum beschichten eines substrats

Country Status (14)

Country Link
US (1) US7323229B2 (de)
EP (1) EP1483425B1 (de)
JP (1) JP4522709B2 (de)
KR (1) KR100956491B1 (de)
CN (1) CN100545299C (de)
AT (1) ATE399889T1 (de)
AU (1) AU2003221458A1 (de)
BR (1) BR0307800B1 (de)
CA (1) CA2476855C (de)
DE (1) DE60321893D1 (de)
ES (1) ES2309305T3 (de)
NL (1) NL1020059C2 (de)
RU (1) RU2316611C2 (de)
WO (1) WO2003071000A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004080640A1 (en) * 2003-03-14 2004-09-23 Hille & Müller GMBH Aluminium layered brazing product and method of its manufacture
ZA200701534B (en) 2004-08-23 2008-10-29 Corus Technology Bv Apparatus and method for levitation of an amount of conductive material
PL1785010T3 (pl) * 2004-08-23 2009-08-31 Corus Tech Bv Urządzenie i sposób lewitowania porcji materiału przewodzącego
ZA200709026B (en) * 2005-05-31 2009-01-28 Corus Technology Bv Apparatus and method for coating a substrate
US7524385B2 (en) * 2006-10-03 2009-04-28 Elemetric, Llc Controlled phase transition of metals
KR100961371B1 (ko) 2007-12-28 2010-06-07 주식회사 포스코 실러 접착성 및 내식성이 우수한 아연계 합금도금강판과 그제조방법
KR101639813B1 (ko) * 2009-10-08 2016-07-15 주식회사 포스코 연속 코팅 장치
CN103249860B (zh) * 2010-12-13 2016-03-16 Posco公司 连续涂布设备
KR101207719B1 (ko) * 2010-12-27 2012-12-03 주식회사 포스코 건식 코팅 장치
RU2522666C2 (ru) * 2012-06-27 2014-07-20 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Юго-Западный государственный университет" (ЮЗГУ) Устройство для левитации некоторого количества материала
KR101355817B1 (ko) * 2012-07-09 2014-02-05 한국표준과학연구원 전자기 부양 금속 박막 증착 장치
RU2693852C2 (ru) * 2017-11-07 2019-07-05 Федеральное государственное бюджетное образовательное учреждение высшего образования " Юго-Западный государственный университет" (ЮЗГУ) Устройство для левитации некоторого количества материала
KR102098455B1 (ko) * 2017-12-26 2020-04-07 주식회사 포스코 연속 증착 장치 및 연속 증착 방법
CN109518133A (zh) * 2018-10-23 2019-03-26 集美大学 一种电磁加热的pvd设备及其生产工艺
CN112760608A (zh) * 2020-12-14 2021-05-07 兰州空间技术物理研究所 碳纤维复合材料表面薄膜沉积过程防止层间放气的方法

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
US2664852A (en) * 1950-04-27 1954-01-05 Nat Res Corp Vapor coating apparatus
US2957064A (en) * 1958-09-30 1960-10-18 Westinghouse Electric Corp Stabilizing of levitation melting
GB1206586A (en) * 1966-09-07 1970-09-23 Mini Of Technology Vacuum deposition process of forming alloys
BE713308A (de) * 1968-04-05 1968-10-07
DE2934011A1 (de) * 1979-08-22 1981-03-26 André Etienne de Dr. Lausanne Rudnay Vorrichtung zum aufdampfen von elektrisch leitenden stoffen (metallen) im hochvakuum
JPS621863A (ja) * 1985-06-28 1987-01-07 Ishikawajima Harima Heavy Ind Co Ltd 金属蒸発装置
SU1529765A1 (ru) * 1987-11-16 1996-01-20 Ленинградский электротехнический институт им.В.И.Ульянова (Ленина) Устройство для нанесения покрытий на внутреннюю поверхность длинномерных цилиндрических изделий
RU2023745C1 (ru) * 1991-06-09 1994-11-30 Михаил Константинович Марахтанов Способ нанесения покрытия на подложку и устройство для его осуществления
JP3563083B2 (ja) * 1992-09-11 2004-09-08 真空冶金株式会社 超微粒子のガスデポジション方法及び装置
JPH07252639A (ja) * 1994-03-15 1995-10-03 Kao Corp 金属薄膜体の製造方法
US5534314A (en) * 1994-08-31 1996-07-09 University Of Virginia Patent Foundation Directed vapor deposition of electron beam evaporant
JPH08104981A (ja) * 1994-10-05 1996-04-23 Sumitomo Electric Ind Ltd Ｐｖｄ装置
JP2783193B2 (ja) 1995-06-26 1998-08-06 大同特殊鋼株式会社 レビテーション溶解法及びレビテーション溶解・鋳造装置
US5736073A (en) * 1996-07-08 1998-04-07 University Of Virginia Patent Foundation Production of nanometer particles by directed vapor deposition of electron beam evaporant
DE19811816A1 (de) * 1997-03-24 1998-10-01 Fuji Electric Co Ltd Verfahren zur Herstellung eines Elektrodenmaterials für Vakuum-Leistungsschalter
WO1999010935A1 (fr) * 1997-08-27 1999-03-04 Josuke Nakata Dispositif semi-conducteur spherique, procede de fabrication associe et materiau pour dispositif semi-conducteur spherique
JPH1171605A (ja) * 1997-08-29 1999-03-16 Ishikawajima Harima Heavy Ind Co Ltd 微粒子製造方法及び装置
EP1321545A1 (de) * 2001-12-20 2003-06-25 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Verfahren zur Herstellung von Teilchen mit Diamantstruktur

Also Published As

Publication number Publication date
RU2004128083A (ru) 2005-06-10
EP1483425B1 (de) 2008-07-02
EP1483425A1 (de) 2004-12-08
JP2005523381A (ja) 2005-08-04
NL1020059C2 (nl) 2003-08-25
RU2316611C2 (ru) 2008-02-10
BR0307800A (pt) 2004-12-14
CN100545299C (zh) 2009-09-30
WO2003071000A1 (en) 2003-08-28
DE60321893D1 (de) 2008-08-14
JP4522709B2 (ja) 2010-08-11
HK1078616A1 (zh) 2006-03-17
US20050064110A1 (en) 2005-03-24
US7323229B2 (en) 2008-01-29
CN1636077A (zh) 2005-07-06
KR20040085192A (ko) 2004-10-07
CA2476855A1 (en) 2003-08-28
AU2003221458A1 (en) 2003-09-09
BR0307800B1 (pt) 2012-09-04
CA2476855C (en) 2009-12-22
ES2309305T3 (es) 2008-12-16
KR100956491B1 (ko) 2010-05-07

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