ATE400894T1 - Gekühlte elektronische anordnung und methode zum kühlen einer leiterplatte - Google Patents
Gekühlte elektronische anordnung und methode zum kühlen einer leiterplatteInfo
- Publication number
- ATE400894T1 ATE400894T1 AT06076155T AT06076155T ATE400894T1 AT E400894 T1 ATE400894 T1 AT E400894T1 AT 06076155 T AT06076155 T AT 06076155T AT 06076155 T AT06076155 T AT 06076155T AT E400894 T1 ATE400894 T1 AT E400894T1
- Authority
- AT
- Austria
- Prior art keywords
- circuit board
- liquid pump
- coolant
- circuit
- cooling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/155,371 US7230832B2 (en) | 2005-06-17 | 2005-06-17 | Cooled electronic assembly and method for cooling a printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE400894T1 true ATE400894T1 (de) | 2008-07-15 |
Family
ID=36608617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06076155T ATE400894T1 (de) | 2005-06-17 | 2006-06-02 | Gekühlte elektronische anordnung und methode zum kühlen einer leiterplatte |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7230832B2 (de) |
| EP (1) | EP1734578B1 (de) |
| AT (1) | ATE400894T1 (de) |
| DE (1) | DE602006001691D1 (de) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7365981B2 (en) * | 2005-06-28 | 2008-04-29 | Delphi Technologies, Inc. | Fluid-cooled electronic system |
| US20080135216A1 (en) * | 2006-12-07 | 2008-06-12 | Chunbo Zhang | Miniature actuator integration for liquid cooling |
| JP2008210007A (ja) * | 2007-02-23 | 2008-09-11 | Alps Electric Co Ltd | 液冷システム |
| US20090207568A1 (en) * | 2008-02-18 | 2009-08-20 | Haveri Heikki Antti Mikael | Method and apparatus for cooling in miniaturized electronics |
| US9560737B2 (en) | 2015-03-04 | 2017-01-31 | International Business Machines Corporation | Electronic package with heat transfer element(s) |
| CA2978795A1 (en) | 2015-03-16 | 2016-09-22 | Dana Canada Corporation | Heat exchangers with plates having surface patterns for enhancing flatness and methods for manufacturing same |
| US10426037B2 (en) | 2015-07-15 | 2019-09-24 | International Business Machines Corporation | Circuitized structure with 3-dimensional configuration |
| US9591776B1 (en) | 2015-09-25 | 2017-03-07 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) |
| US10172239B2 (en) | 2015-09-25 | 2019-01-01 | International Business Machines Corporation | Tamper-respondent sensors with formed flexible layer(s) |
| US10098235B2 (en) | 2015-09-25 | 2018-10-09 | International Business Machines Corporation | Tamper-respondent assemblies with region(s) of increased susceptibility to damage |
| US9911012B2 (en) | 2015-09-25 | 2018-03-06 | International Business Machines Corporation | Overlapping, discrete tamper-respondent sensors |
| US10175064B2 (en) | 2015-09-25 | 2019-01-08 | International Business Machines Corporation | Circuit boards and electronic packages with embedded tamper-respondent sensor |
| US9578764B1 (en) | 2015-09-25 | 2017-02-21 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) and physical security element(s) |
| US9894749B2 (en) | 2015-09-25 | 2018-02-13 | International Business Machines Corporation | Tamper-respondent assemblies with bond protection |
| US9924591B2 (en) | 2015-09-25 | 2018-03-20 | International Business Machines Corporation | Tamper-respondent assemblies |
| US10143090B2 (en) | 2015-10-19 | 2018-11-27 | International Business Machines Corporation | Circuit layouts of tamper-respondent sensors |
| US9978231B2 (en) | 2015-10-21 | 2018-05-22 | International Business Machines Corporation | Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s) |
| US9913389B2 (en) | 2015-12-01 | 2018-03-06 | International Business Corporation Corporation | Tamper-respondent assembly with vent structure |
| US9555606B1 (en) | 2015-12-09 | 2017-01-31 | International Business Machines Corporation | Applying pressure to adhesive using CTE mismatch between components |
| US10327343B2 (en) | 2015-12-09 | 2019-06-18 | International Business Machines Corporation | Applying pressure to adhesive using CTE mismatch between components |
| US9554477B1 (en) | 2015-12-18 | 2017-01-24 | International Business Machines Corporation | Tamper-respondent assemblies with enclosure-to-board protection |
| US9781867B2 (en) | 2016-02-19 | 2017-10-03 | Ford Global Technologies, Llc | Power module assembly for a vehicle power inverter |
| US9916744B2 (en) | 2016-02-25 | 2018-03-13 | International Business Machines Corporation | Multi-layer stack with embedded tamper-detect protection |
| US20170325327A1 (en) * | 2016-04-07 | 2017-11-09 | Massachusetts Institute Of Technology | Printed circuit board for high power components |
| US9904811B2 (en) | 2016-04-27 | 2018-02-27 | International Business Machines Corporation | Tamper-proof electronic packages with two-phase dielectric fluid |
| US9913370B2 (en) | 2016-05-13 | 2018-03-06 | International Business Machines Corporation | Tamper-proof electronic packages formed with stressed glass |
| US9881880B2 (en) | 2016-05-13 | 2018-01-30 | International Business Machines Corporation | Tamper-proof electronic packages with stressed glass component substrate(s) |
| US9858776B1 (en) | 2016-06-28 | 2018-01-02 | International Business Machines Corporation | Tamper-respondent assembly with nonlinearity monitoring |
| US10321589B2 (en) | 2016-09-19 | 2019-06-11 | International Business Machines Corporation | Tamper-respondent assembly with sensor connection adapter |
| US10299372B2 (en) | 2016-09-26 | 2019-05-21 | International Business Machines Corporation | Vented tamper-respondent assemblies |
| US10271424B2 (en) | 2016-09-26 | 2019-04-23 | International Business Machines Corporation | Tamper-respondent assemblies with in situ vent structure(s) |
| US9999124B2 (en) | 2016-11-02 | 2018-06-12 | International Business Machines Corporation | Tamper-respondent assemblies with trace regions of increased susceptibility to breaking |
| US10327329B2 (en) | 2017-02-13 | 2019-06-18 | International Business Machines Corporation | Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor |
| US10306753B1 (en) | 2018-02-22 | 2019-05-28 | International Business Machines Corporation | Enclosure-to-board interface with tamper-detect circuit(s) |
| US11122682B2 (en) | 2018-04-04 | 2021-09-14 | International Business Machines Corporation | Tamper-respondent sensors with liquid crystal polymer layers |
| US10964625B2 (en) | 2019-02-26 | 2021-03-30 | Google Llc | Device and method for direct liquid cooling via metal channels |
| US11735495B2 (en) * | 2019-02-27 | 2023-08-22 | Intel Corporation | Active package cooling structures using molded substrate packaging technology |
| US11121058B2 (en) | 2019-07-24 | 2021-09-14 | Aptiv Technologies Limited | Liquid cooled module with device heat spreader |
| US11315852B2 (en) | 2019-10-11 | 2022-04-26 | Aptiv Technologies Limited | Thermal interface layer for electronic device |
| US10679770B1 (en) | 2019-10-11 | 2020-06-09 | Aptiv Technologies Limited | Interface layer with mesh and sinter paste |
| US11095014B2 (en) | 2020-01-07 | 2021-08-17 | Aptiv Technologies Limited | Waveguide antenna with integrated temperature management |
| US11382205B2 (en) | 2020-09-16 | 2022-07-05 | Aptiv Technologies Limited | Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5241450A (en) * | 1992-03-13 | 1993-08-31 | The United States Of America As Represented By The United States Department Of Energy | Three dimensional, multi-chip module |
| US5801442A (en) * | 1996-07-22 | 1998-09-01 | Northrop Grumman Corporation | Microchannel cooling of high power semiconductor devices |
| US6413801B1 (en) * | 2000-05-02 | 2002-07-02 | Advanced Semiconductor Engineering, Inc. | Method of molding semiconductor device and molding die for use therein |
| US6490159B1 (en) * | 2000-09-06 | 2002-12-03 | Visteon Global Tech., Inc. | Electrical circuit board and method for making the same |
| US6976527B2 (en) * | 2001-07-17 | 2005-12-20 | The Regents Of The University Of California | MEMS microcapillary pumped loop for chip-level temperature control |
| US6529377B1 (en) * | 2001-09-05 | 2003-03-04 | Microelectronic & Computer Technology Corporation | Integrated cooling system |
| US6591625B1 (en) * | 2002-04-17 | 2003-07-15 | Agilent Technologies, Inc. | Cooling of substrate-supported heat-generating components |
| US6785134B2 (en) * | 2003-01-06 | 2004-08-31 | Intel Corporation | Embedded liquid pump and microchannel cooling system |
| US6903929B2 (en) * | 2003-03-31 | 2005-06-07 | Intel Corporation | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink |
| US7029951B2 (en) * | 2003-09-12 | 2006-04-18 | International Business Machines Corporation | Cooling system for a semiconductor device and method of fabricating same |
| US7351380B2 (en) * | 2004-01-08 | 2008-04-01 | Sandia Corporation | Microfluidic structures and methods for integrating a functional component into a microfluidic device |
-
2005
- 2005-06-17 US US11/155,371 patent/US7230832B2/en not_active Expired - Lifetime
-
2006
- 2006-06-02 DE DE602006001691T patent/DE602006001691D1/de active Active
- 2006-06-02 EP EP06076155A patent/EP1734578B1/de active Active
- 2006-06-02 AT AT06076155T patent/ATE400894T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1734578A1 (de) | 2006-12-20 |
| EP1734578B1 (de) | 2008-07-09 |
| US7230832B2 (en) | 2007-06-12 |
| DE602006001691D1 (de) | 2008-08-21 |
| US20060285300A1 (en) | 2006-12-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |