ATE515180T1 - Elektronische anordnung mit einer kühlung auf mehreren seiten, sowie verfahren - Google Patents

Elektronische anordnung mit einer kühlung auf mehreren seiten, sowie verfahren

Info

Publication number
ATE515180T1
ATE515180T1 AT06076881T AT06076881T ATE515180T1 AT E515180 T1 ATE515180 T1 AT E515180T1 AT 06076881 T AT06076881 T AT 06076881T AT 06076881 T AT06076881 T AT 06076881T AT E515180 T1 ATE515180 T1 AT E515180T1
Authority
AT
Austria
Prior art keywords
cooling
multiple sides
electronic arrangement
electronics package
substrate
Prior art date
Application number
AT06076881T
Other languages
English (en)
Inventor
Ralph S Taylor
Michael A Jeter
Erich W Gerbsch
Jeffrey J Ronning
Original Assignee
Delphi Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Tech Inc filed Critical Delphi Tech Inc
Application granted granted Critical
Publication of ATE515180T1 publication Critical patent/ATE515180T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20872—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT06076881T 2005-10-28 2006-10-13 Elektronische anordnung mit einer kühlung auf mehreren seiten, sowie verfahren ATE515180T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/262,400 US7295433B2 (en) 2005-10-28 2005-10-28 Electronics assembly having multiple side cooling and method

Publications (1)

Publication Number Publication Date
ATE515180T1 true ATE515180T1 (de) 2011-07-15

Family

ID=37684424

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06076881T ATE515180T1 (de) 2005-10-28 2006-10-13 Elektronische anordnung mit einer kühlung auf mehreren seiten, sowie verfahren

Country Status (3)

Country Link
US (1) US7295433B2 (de)
EP (1) EP1781076B1 (de)
AT (1) ATE515180T1 (de)

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US8004841B2 (en) * 2008-05-06 2011-08-23 International Business Machines Corporation Method and apparatus of water cooling several parallel circuit cards each containing several chip packages
US8081473B2 (en) * 2008-08-04 2011-12-20 International Business Machines Corporation Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages
US9342121B2 (en) * 2008-05-06 2016-05-17 International Business Machines Corporatoin Cooling system for electronic components
US8248809B2 (en) * 2008-08-26 2012-08-21 GM Global Technology Operations LLC Inverter power module with distributed support for direct substrate cooling
US8081478B1 (en) * 2008-12-09 2011-12-20 Lockheed Martin Corporation Fluid cooled electronics module cover
DE102008061488A1 (de) * 2008-12-10 2010-06-17 Siemens Aktiengesellschaft Stromrichtermodul mit gekühlter Verschienung
US8757077B2 (en) * 2009-04-30 2014-06-24 Technip France Spar mooring line sharing method and system
US8488315B2 (en) * 2009-08-18 2013-07-16 GM Global Technology Operations LLC Power module assemblies with staggered coolant channels
US8169779B2 (en) * 2009-12-15 2012-05-01 GM Global Technology Operations LLC Power electronics substrate for direct substrate cooling
WO2012051704A1 (en) 2010-10-19 2012-04-26 Electronic Motion Systems Holdings Limited A power module for converting dc to ac
TWI487923B (zh) * 2013-06-18 2015-06-11 致茂電子股份有限公司 Test the temperature control module
CN104684338B (zh) * 2013-11-26 2018-01-30 台达电子企业管理（上海）有限公司 散热基座与电子装置
CN104716113B (zh) * 2013-12-13 2017-10-10 华为技术有限公司 散热器及散热系统
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TW201625754A (zh) * 2014-11-21 2016-07-16 艾倫塔斯有限公司 單一成份、儲存穩定、可硬化之聚矽氧組成物
JP6409556B2 (ja) * 2014-12-19 2018-10-24 富士通株式会社 冷却機構付き基板及び電子機器
US9674990B2 (en) * 2015-01-23 2017-06-06 Rockwell Automation Technoloies, Inc. Devices and methods for cooling bus capacitors
WO2016145526A1 (en) 2015-03-16 2016-09-22 Dana Canada Corporation Heat exchangers with plates having surface patterns for enhancing flatness and methods for manufacturing same
WO2016201250A1 (en) * 2015-06-11 2016-12-15 Microvention, Inc. Expansile device for implantation
CN108351173B (zh) 2015-08-27 2020-06-30 达纳加拿大公司 用于双面冷却的热交换器
DE102017222350A1 (de) 2016-12-14 2018-06-14 Dana Canada Corporation Wärmetauscher für eine doppelseitige kühlung von elektronikmodulen
JP7045912B2 (ja) * 2018-04-11 2022-04-01 昭和電工株式会社 半導体装置およびその製造方法
DE102019110870A1 (de) * 2019-04-26 2020-10-29 Liebherr-Components Biberach Gmbh Kühlvorrichtung zum Kühlen einer Energiespeicher- und/oder Elektronikbaugruppe sowie Verfahren zu deren Herstellung
US20210400815A1 (en) * 2020-06-19 2021-12-23 Abb Schweiz Ag Solid state switching device including heat sinks and control electronics construction
WO2023202760A1 (en) * 2022-04-19 2023-10-26 Hitachi Energy Switzerland Ag Semiconductor power device, semiconductor power system and method for cooling a semiconductor power device
KR20230168522A (ko) * 2022-06-07 2023-12-14 현대모비스 주식회사 파워모듈 팩
US12122251B2 (en) 2022-09-28 2024-10-22 BorgWarner US Technologies LLC Systems and methods for bidirectional message architecture for inverter for electric vehicle
US12526961B2 (en) 2023-06-07 2026-01-13 BorgWarner US Technologies LLC Systems for cooling module assembly for inverter for electric vehicle
US12528329B2 (en) 2023-06-07 2026-01-20 BorgWarner US Technologies LLC Systems for cooling module assembly for inverter for electric vehicle
US12461129B2 (en) 2023-08-28 2025-11-04 BorgWarner US Technologies LLC Systems and methods for galvanic interface bond detection for inverter for electric vehicle
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Also Published As

Publication number Publication date
US7295433B2 (en) 2007-11-13
EP1781076A3 (de) 2009-03-04
US20070097627A1 (en) 2007-05-03
EP1781076B1 (de) 2011-06-29
EP1781076A2 (de) 2007-05-02

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