|
JP2006528694A
(ja)
*
|
2003-05-13 |
2006-12-21 |
スミスクライン ビーチャム コーポレーション |
ナフチリジンインテグラーゼインヒビター
|
|
FR2880568B1
(fr)
*
|
2005-01-12 |
2007-03-30 |
Air Liquide |
Coupage laser avec lentille a double focale de pieces metalliques de forte epaisseur
|
|
FR2880566A1
(fr)
*
|
2005-01-12 |
2006-07-14 |
Air Liquide |
Coupage laser avec une lentille revetue de baf2
|
|
FR2880567B1
(fr)
*
|
2005-01-12 |
2007-02-23 |
Air Liquide |
Coupage laser avec lentille a double focale de pieces metalliques de faible epaisseur
|
|
RU2307726C2
(ru)
*
|
2005-06-15 |
2007-10-10 |
Институт проблем лазерных и информационных технологий РАН |
Способ газолазерной резки титана и его сплавов
|
|
EP1900470B1
(de)
*
|
2005-06-27 |
2012-06-13 |
Nitto Denko Corporation |
Oberflächenschutzfolie für lasermaterialbearbeitung
|
|
FR2893873B1
(fr)
|
2005-11-25 |
2008-12-12 |
Air Liquide |
Procede de coupage avec un laser a fibre d'acier inoxydable
|
|
EP1815937A1
(de)
*
|
2006-02-07 |
2007-08-08 |
Air Liquide Espana SA |
Laserstrahlschneidverfahren eines Werkstückes aus Titanium unter Verwendung eines Gasmischung Ar/He
|
|
DE102007024700A1
(de)
*
|
2007-05-25 |
2008-12-04 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Verfahren zur Materialbearbeitung mit Laserstrahlung sowie Vorrichtung zur Durchführung des Verfahrens
|
|
DE102007024701A1
(de)
|
2007-05-25 |
2008-11-27 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Verfahren zur Materialabtragung sowie Vorrichtung zur Durchführung des Verfahrens
|
|
US9664012B2
(en)
|
2008-08-20 |
2017-05-30 |
Foro Energy, Inc. |
High power laser decomissioning of multistring and damaged wells
|
|
US9669492B2
(en)
|
2008-08-20 |
2017-06-06 |
Foro Energy, Inc. |
High power laser offshore decommissioning tool, system and methods of use
|
|
US9719302B2
(en)
|
2008-08-20 |
2017-08-01 |
Foro Energy, Inc. |
High power laser perforating and laser fracturing tools and methods of use
|
|
US8624155B1
(en)
*
|
2009-05-12 |
2014-01-07 |
Vinyl Technologies, Inc. |
Apparatus for scribing thin films in photovoltaic cells
|
|
US9845652B2
(en)
|
2011-02-24 |
2017-12-19 |
Foro Energy, Inc. |
Reduced mechanical energy well control systems and methods of use
|
|
US20130256286A1
(en)
*
|
2009-12-07 |
2013-10-03 |
Ipg Microsystems Llc |
Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths
|
|
US8000212B2
(en)
*
|
2009-12-15 |
2011-08-16 |
Cymer, Inc. |
Metrology for extreme ultraviolet light source
|
|
JP5737900B2
(ja)
*
|
2010-10-15 |
2015-06-17 |
三菱重工業株式会社 |
レーザ加工装置及びレーザ加工方法
|
|
RU2459690C1
(ru)
*
|
2011-01-17 |
2012-08-27 |
Открытое акционерное общество "Машиностроительный завод" |
Способ лазерного раскроя металлического листового материала
|
|
CN102230983A
(zh)
*
|
2011-06-17 |
2011-11-02 |
山西飞虹激光科技有限公司 |
用于激光加工的光学元件及激光加工设备
|
|
TW201343296A
(zh)
*
|
2012-03-16 |
2013-11-01 |
Ipg Microsystems Llc |
使一工件中具有延伸深度虛飾之雷射切割系統及方法
|
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
EP2754524B1
(de)
*
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
|
US9701564B2
(en)
|
2013-01-15 |
2017-07-11 |
Corning Incorporated |
Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
|
|
WO2014204535A1
(en)
*
|
2013-03-15 |
2014-12-24 |
Foro Energy, Inc. |
High power laser fluid jets and beam paths using deuterium oxide
|
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US9687936B2
(en)
*
|
2013-12-17 |
2017-06-27 |
Corning Incorporated |
Transparent material cutting with ultrafast laser and beam optics
|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
|
US20150165563A1
(en)
*
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers
|
|
TWI673128B
(zh)
*
|
2014-01-27 |
2019-10-01 |
美商康寧公司 |
藉由機械處理雷射切割玻璃的邊緣去角及/或切斜之玻璃物件及方法
|
|
TWI730945B
(zh)
|
2014-07-08 |
2021-06-21 |
美商康寧公司 |
用於雷射處理材料的方法與設備
|
|
CN107074611A
(zh)
*
|
2014-07-11 |
2017-08-18 |
康宁股份有限公司 |
通过将脉冲激光穿孔诱导到玻璃制品中进行玻璃切割的系统以及方法
|
|
WO2016010991A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
|
US10611667B2
(en)
|
2014-07-14 |
2020-04-07 |
Corning Incorporated |
Method and system for forming perforations
|
|
US20160009066A1
(en)
*
|
2014-07-14 |
2016-01-14 |
Corning Incorporated |
System and method for cutting laminated structures
|
|
US10335902B2
(en)
|
2014-07-14 |
2019-07-02 |
Corning Incorporated |
Method and system for arresting crack propagation
|
|
US9617180B2
(en)
|
2014-07-14 |
2017-04-11 |
Corning Incorporated |
Methods and apparatuses for fabricating glass articles
|
|
JP2017530867A
(ja)
*
|
2014-07-14 |
2017-10-19 |
コーニング インコーポレイテッド |
長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法
|
|
DE102014213775B4
(de)
*
|
2014-07-15 |
2018-02-15 |
Innolas Solutions Gmbh |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
|
WO2016115017A1
(en)
|
2015-01-12 |
2016-07-21 |
Corning Incorporated |
Laser cutting of thermally tempered substrates using the multi photon absorption method
|
|
WO2016154284A1
(en)
|
2015-03-24 |
2016-09-29 |
Corning Incorporated |
Laser cutting and processing of display glass compositions
|
|
JP2018516215A
(ja)
|
2015-03-27 |
2018-06-21 |
コーニング インコーポレイテッド |
気体透過性窓、および、その製造方法
|
|
KR102499697B1
(ko)
|
2015-07-10 |
2023-02-14 |
코닝 인코포레이티드 |
유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품
|
|
LT6428B
(lt)
|
2015-10-02 |
2017-07-25 |
Uab "Altechna R&D" |
Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys
|
|
JP6938543B2
(ja)
|
2016-05-06 |
2021-09-22 |
コーニング インコーポレイテッド |
透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
|
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
|
WO2017216603A1
(en)
*
|
2016-06-14 |
2017-12-21 |
Evana Technologies, Uab |
Laser processing method and a system for wafer dicing or cutting by use of a multi-segment focusing lens
|
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
|
WO2018022476A1
(en)
|
2016-07-29 |
2018-02-01 |
Corning Incorporated |
Apparatuses and methods for laser processing
|
|
US10522963B2
(en)
|
2016-08-30 |
2019-12-31 |
Corning Incorporated |
Laser cutting of materials with intensity mapping optical system
|
|
US10730783B2
(en)
|
2016-09-30 |
2020-08-04 |
Corning Incorporated |
Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
|
|
EP3848333B1
(de)
|
2016-10-24 |
2025-12-03 |
Corning Incorporated |
Substratverarbeitungsstation zur laserbasierten verarbeitung von flächigen glassubstraten
|
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
|
CN106695117A
(zh)
*
|
2017-02-13 |
2017-05-24 |
武汉澳谱激光科技有限公司 |
一种实现轴向均匀线焦斑的光学器件
|
|
US20180257170A1
(en)
|
2017-03-13 |
2018-09-13 |
Coherent Lasersystems Gmbh & Co. Kg |
Controlled separation of laser processed brittle material
|
|
DE102017208290A1
(de)
|
2017-05-17 |
2018-11-22 |
Schott Ag |
Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks entlang einer vorbestimmten Bearbeitungslinie
|
|
EP3624983B1
(de)
|
2017-05-19 |
2024-11-27 |
Schott Ag |
Bauteil, umfassend glas oder glaskeramik, mit entlang einer vorgegebenen trennlinie angeordneten vorschädigungen und verfahren zur herstellung des bauteils
|
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
|
CN107695544B
(zh)
*
|
2017-10-24 |
2025-01-28 |
袁卉 |
激光打孔方法及装置
|
|
US12180108B2
(en)
|
2017-12-19 |
2024-12-31 |
Corning Incorporated |
Methods for etching vias in glass-based articles employing positive charge organic molecules
|
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|
|
TW202023735A
(zh)
*
|
2018-11-13 |
2020-07-01 |
香港商準晶科技有限公司 |
用於切割透明和半透明基板的基於激光的系統
|
|
CN110435160A
(zh)
*
|
2019-09-09 |
2019-11-12 |
广东利元亨智能装备股份有限公司 |
一种激光焊接头及激光焊接方法
|
|
CN113634930B
(zh)
*
|
2021-09-23 |
2023-01-31 |
山东理工大学 |
水导激光水光耦合变曲率聚焦光柱透镜
|
|
CN113634874B
(zh)
*
|
2021-09-23 |
2023-03-14 |
山东理工大学 |
多聚焦点透镜大功率水导激光水光耦合装置
|
|
CN113634921B
(zh)
*
|
2021-09-23 |
2023-01-03 |
山东理工大学 |
多焦点聚焦透镜大功率无气爆水导激光水光耦合对准切割头
|
|
CN114670288B
(zh)
*
|
2022-03-08 |
2023-08-15 |
海目星激光科技集团股份有限公司 |
超声波裂片方法及裂片装置
|