ATE403702T1 - Wärmeleitfähige silikonzusammensetzung - Google Patents

Wärmeleitfähige silikonzusammensetzung

Info

Publication number
ATE403702T1
ATE403702T1 AT03810584T AT03810584T ATE403702T1 AT E403702 T1 ATE403702 T1 AT E403702T1 AT 03810584 T AT03810584 T AT 03810584T AT 03810584 T AT03810584 T AT 03810584T AT E403702 T1 ATE403702 T1 AT E403702T1
Authority
AT
Austria
Prior art keywords
silicone composition
thermally conductive
conductive silicone
component
heat conductive
Prior art date
Application number
AT03810584T
Other languages
English (en)
Inventor
Hiroshi Fukui
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE403702T1 publication Critical patent/ATE403702T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lubricants (AREA)
AT03810584T 2002-11-08 2003-10-28 Wärmeleitfähige silikonzusammensetzung ATE403702T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002325895A JP4587636B2 (ja) 2002-11-08 2002-11-08 熱伝導性シリコーン組成物

Publications (1)

Publication Number Publication Date
ATE403702T1 true ATE403702T1 (de) 2008-08-15

Family

ID=32310488

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03810584T ATE403702T1 (de) 2002-11-08 2003-10-28 Wärmeleitfähige silikonzusammensetzung

Country Status (9)

Country Link
US (1) US7592383B2 (de)
EP (1) EP1558679B1 (de)
JP (1) JP4587636B2 (de)
KR (1) KR100997371B1 (de)
AT (1) ATE403702T1 (de)
AU (1) AU2003276704A1 (de)
DE (1) DE60322734D1 (de)
TW (1) TWI302929B (de)
WO (1) WO2004041938A1 (de)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4828429B2 (ja) * 2003-11-05 2011-11-30 ダウ・コーニング・コーポレイション 熱伝導性グリース、並びに前記グリースを用いる方法及びデバイス
JP4557137B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP4557136B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP4687887B2 (ja) * 2004-10-14 2011-05-25 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US8940265B2 (en) 2009-02-17 2015-01-27 Mcalister Technologies, Llc Sustainable economic development through integrated production of renewable energy, materials resources, and nutrient regimes
JP4828145B2 (ja) 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP5004433B2 (ja) 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
WO2007025565A1 (en) 2005-09-01 2007-03-08 Freescale Semiconductor, Inc. Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device
WO2007106209A2 (en) * 2006-02-23 2007-09-20 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
US7803719B2 (en) 2006-02-24 2010-09-28 Freescale Semiconductor, Inc. Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and passivating coupling material comprising multiple organic components for use in a semiconductor device
US7834083B2 (en) * 2006-10-11 2010-11-16 Samsung Electro-Mechanics Co., Ltd. Nanocomposite composition comprising transparent nanoparticles
US7977758B2 (en) * 2007-06-20 2011-07-12 Georgia Tech Research Corporation Ferroelectrics and ferromagnetics for noise isolation in integrated circuits, packaging, and system architectures
JP2009096961A (ja) * 2007-10-19 2009-05-07 Shin Etsu Chem Co Ltd リワーク性に優れた熱伝導性シリコーングリース組成物
WO2009088242A2 (ko) * 2008-01-08 2009-07-16 Lg Chem, Ltd. 다기능 점착 필름, 이를 포함하는 플라즈마 디스플레이 패널 필터 및 이를 포함하는 플라즈마 디스플레이 패널
JP5372388B2 (ja) * 2008-01-30 2013-12-18 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
US9231267B2 (en) * 2009-02-17 2016-01-05 Mcalister Technologies, Llc Systems and methods for sustainable economic development through integrated full spectrum production of renewable energy
US8814983B2 (en) 2009-02-17 2014-08-26 Mcalister Technologies, Llc Delivery systems with in-line selective extraction devices and associated methods of operation
US9097152B2 (en) * 2009-02-17 2015-08-04 Mcalister Technologies, Llc Energy system for dwelling support
US8808529B2 (en) * 2009-02-17 2014-08-19 Mcalister Technologies, Llc Systems and methods for sustainable economic development through integrated full spectrum production of renewable material resources using solar thermal
JP5154519B2 (ja) * 2009-07-24 2013-02-27 日東電工株式会社 光半導体素子封止材料
WO2010107516A1 (en) 2009-03-16 2010-09-23 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
US8115369B2 (en) * 2009-11-09 2012-02-14 Lg Innotek Co., Ltd. Lighting device
US8829771B2 (en) 2009-11-09 2014-09-09 Lg Innotek Co., Ltd. Lighting device
JP2011140566A (ja) * 2010-01-07 2011-07-21 Dow Corning Toray Co Ltd 熱伝導性シリコーングリース組成物
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5755977B2 (ja) * 2011-09-08 2015-07-29 電気化学工業株式会社 高熱伝導性樹脂組成物
JP7025612B2 (ja) * 2015-01-29 2022-02-25 積水ポリマテック株式会社 熱伝導性組成物
JP6223590B2 (ja) * 2015-05-22 2017-11-01 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性組成物
JP2019077843A (ja) * 2017-10-27 2019-05-23 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物およびその硬化物
CN107964245A (zh) * 2017-12-18 2018-04-27 深圳德邦界面材料有限公司 一种点胶式凝胶导热垫片及其制备方法
CN108753265A (zh) * 2018-05-29 2018-11-06 苏州天脉导热科技股份有限公司 低热阻散热膏及其制备方法
CN111669956B (zh) 2019-03-06 2024-04-02 天津莱尔德电子材料有限公司 热管理和/或电磁干扰减轻材料以及相关装置和方法
JP7422742B2 (ja) 2019-03-29 2024-01-26 ダウ・東レ株式会社 多成分型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
US12378363B2 (en) 2019-06-21 2025-08-05 Dow Silicones Corporation Thermal conductive silicone composition
CN113950511B (zh) 2019-06-21 2024-01-16 美国陶氏有机硅公司 用于制备触变可固化有机硅组合物的方法
KR102264954B1 (ko) * 2019-08-09 2021-06-15 정해영 봉지형 발열체 및 이를 포함하는 전기전열 매체
US11277545B2 (en) 2020-02-27 2022-03-15 Gopro, Inc. Heatsink of an image capture device
US11146711B1 (en) 2020-04-10 2021-10-12 Gopro, Inc. Heatsinks for an image capture device
EP4217422B1 (de) 2020-09-23 2025-10-29 Dow Global Technologies LLC Thermisches zwischenmaterial mit niedriger abgabeviskosität, niedrigem vertikalem fluss nach der abgabe und niedriger thermischer impedanz nach der härtung
US11655369B2 (en) * 2020-10-28 2023-05-23 Dow Silicones Corporation Trialkoxy functional branched siloxane compositions
US12692426B2 (en) 2020-11-10 2026-07-28 Dow Silicones Corporation Aluminum nitride filled thermally conductive silicone composition
CN114539780A (zh) * 2020-11-24 2022-05-27 深圳先进电子材料国际创新研究院 一种单组份热界面材料及其制备方法
US12703818B2 (en) 2021-01-25 2026-08-11 Fuji Polymer Industries Co., Ltd. Thermally conductive silicone grease composition and method for producing the same
CN113105744A (zh) * 2021-04-14 2021-07-13 中兴通讯股份有限公司 导热硅脂及其制备方法、芯片组件
EP4388045B1 (de) 2021-08-19 2025-07-16 Dow Silicones Corporation Wärmeleitfähige silikonzusammensetzung
EP4476288A1 (de) 2022-02-07 2024-12-18 Dow Silicones Corporation Härtbare wärmeleitende zusammensetzung
JP2023146705A (ja) * 2022-03-29 2023-10-12 日鉄ケミカル＆マテリアル株式会社 含油アルミナ粒子粉末及びその製造方法並びに含油アルミナ粒子粉末を用いる樹脂複合組成物
TW202409154A (zh) 2022-08-08 2024-03-01 美商陶氏全球科技公司 聚矽氧烷填料處理劑及由其製備之組成物
TW202406994A (zh) * 2022-08-08 2024-02-16 美商陶氏全球科技公司 聚矽氧烷填料處理劑及由其製備之組成物
TW202407064A (zh) 2022-08-08 2024-02-16 美商陶氏全球科技公司 聚矽氧烷填料處理劑及用其製備之組成物
TW202407058A (zh) 2022-08-08 2024-02-16 美商陶氏全球科技公司 聚矽氧烷填料處理劑及用其製備之組成物
US12389102B2 (en) 2022-08-23 2025-08-12 Gopro, Inc. Bucket architecture for an image capture device including a reconfigurable PCB module
US12081848B2 (en) 2022-08-23 2024-09-03 Gopro, Inc. Multifunctional heatsink
US12075141B2 (en) 2022-08-23 2024-08-27 Gopro, Inc. Heatsinks and thermal architecture of an image capture device
US12604107B2 (en) 2022-11-04 2026-04-14 Gopro, Inc. Image capture devices with reduced stitch distances
KR20250129024A (ko) 2022-12-23 2025-08-28 다우 실리콘즈 코포레이션 경화성 열전도성 조성물의 제조 방법
JP2026508499A (ja) 2023-02-28 2026-03-11 ダウ シリコーンズ コーポレーション サーマルグリース組成物
TW202436588A (zh) 2023-03-13 2024-09-16 美商陶氏有機矽公司 導熱膏組成物
KR20260007221A (ko) 2023-04-27 2026-01-13 다우 실리콘즈 코포레이션 경화성 열전도성 조성물
US12316932B2 (en) 2023-08-11 2025-05-27 Gopro, Inc. Adjustable thermal solution
KR20260072587A (ko) 2023-09-27 2026-05-20 다우 실리콘즈 코포레이션 경화성 실리콘 조성물
KR20260072586A (ko) 2023-09-27 2026-05-20 다우 실리콘즈 코포레이션 열 전도성 실리콘 조성물
WO2026044447A1 (en) 2024-08-26 2026-03-05 Dow Silicones Corporation Liquid silicone composition with reduced yellowing
WO2026142959A1 (en) 2024-12-23 2026-07-02 Dow Silicones Corporation Thermally conductive silicone composition
WO2026142958A1 (en) 2024-12-23 2026-07-02 Dow Silicones Corporation Thermally conductive silicone composition
CN119708861B (zh) * 2024-12-30 2025-07-11 合烯电子科技(江苏)有限公司 一种高导热、低粘度、高触变性的双组份导热凝胶

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3045132A (en) * 1958-07-31 1962-07-17 Westinghouse Electric Corp Thermally conductive potting compositions
US3885984A (en) 1973-12-18 1975-05-27 Gen Electric Methyl alkyl silicone thermoconducting compositions
JPS55120658A (en) * 1979-03-13 1980-09-17 Toray Silicone Co Ltd Silicone composition forming ceramic at high temperature
JPS61157587A (ja) 1984-12-28 1986-07-17 Toshiba Silicone Co Ltd 耐酸性放熱グリ−ス
US5011870A (en) * 1989-02-08 1991-04-30 Dow Corning Corporation Thermally conductive organosiloxane compositions
JPH0619027B2 (ja) * 1989-02-13 1994-03-16 信越化学工業株式会社 熱伝導性シリコーンオイルコンパウンド
JP2580348B2 (ja) * 1989-11-20 1997-02-12 信越化学工業 株式会社 放熱用グリ―ス組成物
JPH0767784B2 (ja) * 1990-10-11 1995-07-26 信越化学工業株式会社 シリコーンゴム積層体及びその製造方法
JPH07207160A (ja) * 1994-01-11 1995-08-08 Toshiba Silicone Co Ltd シリコーン組成物およびその製造方法
JP3576639B2 (ja) * 1995-05-29 2004-10-13 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーンゴム組成物
JP3950493B2 (ja) * 1996-04-26 2007-08-01 東レ・ダウコーニング株式会社 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置
JP3436464B2 (ja) * 1996-10-31 2003-08-11 東レ・ダウコーニング・シリコーン株式会社 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法
FI101980B1 (fi) 1997-05-05 1998-09-30 Xyrofin Oy Kiteytysmenetelmä
JP4015722B2 (ja) * 1997-06-20 2007-11-28 東レ・ダウコーニング株式会社 熱伝導性ポリマー組成物
JP3948642B2 (ja) * 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP3543663B2 (ja) * 1999-03-11 2004-07-14 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
JP4727017B2 (ja) * 1999-11-15 2011-07-20 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
US6433057B1 (en) * 2000-03-28 2002-08-13 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
US6361716B1 (en) * 2000-07-20 2002-03-26 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
JP3719382B2 (ja) * 2000-10-25 2005-11-24 信越化学工業株式会社 電磁波吸収性シリコーンゴム組成物
US7060747B2 (en) * 2001-03-30 2006-06-13 Intel Corporation Chain extension for thermal materials
US7329706B2 (en) * 2001-05-14 2008-02-12 Dow Corning Toray Silicone Co., Ltd. Heat-conductive silicone composition
DE10126563A1 (de) * 2001-05-31 2002-12-12 Wacker Chemie Gmbh Selbsthaftende durch Erwärmen vernetzbare 1-Komponenten Siliconzusammensetzungen
JP4588285B2 (ja) * 2002-01-25 2010-11-24 信越化学工業株式会社 熱伝導性シリコーンゴム組成物

Also Published As

Publication number Publication date
TW200418929A (en) 2004-10-01
WO2004041938A1 (en) 2004-05-21
TWI302929B (en) 2008-11-11
DE60322734D1 (de) 2008-09-18
US20060100336A1 (en) 2006-05-11
EP1558679B1 (de) 2008-08-06
AU2003276704A1 (en) 2004-06-07
KR100997371B1 (ko) 2010-11-30
EP1558679A1 (de) 2005-08-03
JP4587636B2 (ja) 2010-11-24
US7592383B2 (en) 2009-09-22
KR20050074987A (ko) 2005-07-19
JP2004161797A (ja) 2004-06-10

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