ATE403702T1 - Wärmeleitfähige silikonzusammensetzung - Google Patents

Wärmeleitfähige silikonzusammensetzung

Info

Publication number
ATE403702T1
ATE403702T1 AT03810584T AT03810584T ATE403702T1 AT E403702 T1 ATE403702 T1 AT E403702T1 AT 03810584 T AT03810584 T AT 03810584T AT 03810584 T AT03810584 T AT 03810584T AT E403702 T1 ATE403702 T1 AT E403702T1
Authority
AT
Austria
Prior art keywords
silicone composition
thermally conductive
conductive silicone
component
heat conductive
Prior art date
Application number
AT03810584T
Other languages
English (en)
Inventor
Hiroshi Fukui
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE403702T1 publication Critical patent/ATE403702T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT03810584T 2002-11-08 2003-10-28 Wärmeleitfähige silikonzusammensetzung ATE403702T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002325895A JP4587636B2 (ja) 2002-11-08 2002-11-08 熱伝導性シリコーン組成物

Publications (1)

Publication Number Publication Date
ATE403702T1 true ATE403702T1 (de) 2008-08-15

Family

ID=32310488

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03810584T ATE403702T1 (de) 2002-11-08 2003-10-28 Wärmeleitfähige silikonzusammensetzung

Country Status (9)

Country Link
US (1) US7592383B2 (de)
EP (1) EP1558679B1 (de)
JP (1) JP4587636B2 (de)
KR (1) KR100997371B1 (de)
AT (1) ATE403702T1 (de)
AU (1) AU2003276704A1 (de)
DE (1) DE60322734D1 (de)
TW (1) TWI302929B (de)
WO (1) WO2004041938A1 (de)

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CN114539780A (zh) * 2020-11-24 2022-05-27 深圳先进电子材料国际创新研究院 一种单组份热界面材料及其制备方法
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TW202406994A (zh) * 2022-08-08 2024-02-16 美商陶氏全球科技公司 聚矽氧烷填料處理劑及由其製備之組成物
TW202407064A (zh) 2022-08-08 2024-02-16 美商陶氏全球科技公司 聚矽氧烷填料處理劑及用其製備之組成物
TW202407058A (zh) 2022-08-08 2024-02-16 美商陶氏全球科技公司 聚矽氧烷填料處理劑及用其製備之組成物
TW202409154A (zh) 2022-08-08 2024-03-01 美商陶氏全球科技公司 聚矽氧烷填料處理劑及由其製備之組成物
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Also Published As

Publication number Publication date
KR20050074987A (ko) 2005-07-19
US20060100336A1 (en) 2006-05-11
EP1558679A1 (de) 2005-08-03
TW200418929A (en) 2004-10-01
DE60322734D1 (de) 2008-09-18
KR100997371B1 (ko) 2010-11-30
US7592383B2 (en) 2009-09-22
WO2004041938A1 (en) 2004-05-21
JP4587636B2 (ja) 2010-11-24
AU2003276704A1 (en) 2004-06-07
EP1558679B1 (de) 2008-08-06
JP2004161797A (ja) 2004-06-10
TWI302929B (en) 2008-11-11

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