ATE404631T1 - Benzoxazin und epoxidharz enthaltende zusammensetzung - Google Patents

Benzoxazin und epoxidharz enthaltende zusammensetzung

Info

Publication number
ATE404631T1
ATE404631T1 AT06725196T AT06725196T ATE404631T1 AT E404631 T1 ATE404631 T1 AT E404631T1 AT 06725196 T AT06725196 T AT 06725196T AT 06725196 T AT06725196 T AT 06725196T AT E404631 T1 ATE404631 T1 AT E404631T1
Authority
AT
Austria
Prior art keywords
epoxy resin
compositions
composition containing
containing benzoxazine
bisphenol
Prior art date
Application number
AT06725196T
Other languages
English (en)
Inventor
Dave Tsuei
Original Assignee
Huntsman Adv Mat Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Adv Mat Switzerland filed Critical Huntsman Adv Mat Switzerland
Application granted granted Critical
Publication of ATE404631T1 publication Critical patent/ATE404631T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
AT06725196T 2005-04-01 2006-03-21 Benzoxazin und epoxidharz enthaltende zusammensetzung ATE404631T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05102604A EP1647576A1 (de) 2005-04-01 2005-04-01 Zusammensetzung beinhaltend Benzoxazin- und Epoxyharz

Publications (1)

Publication Number Publication Date
ATE404631T1 true ATE404631T1 (de) 2008-08-15

Family

ID=34939108

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06725196T ATE404631T1 (de) 2005-04-01 2006-03-21 Benzoxazin und epoxidharz enthaltende zusammensetzung

Country Status (9)

Country Link
US (1) US8062455B2 (de)
EP (2) EP1647576A1 (de)
JP (1) JP5161067B2 (de)
KR (1) KR101246943B1 (de)
AT (1) ATE404631T1 (de)
DE (1) DE602006002273D1 (de)
ES (1) ES2310404T3 (de)
TW (1) TWI385208B (de)
WO (1) WO2006103185A1 (de)

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US8029889B1 (en) 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
US7649060B2 (en) 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
WO2007097305A1 (ja) * 2006-02-20 2007-08-30 Sekisui Chemical Co., Ltd. 熱硬化性樹脂の製造方法、熱硬化性樹脂、それを含む熱硬化性組成物、成形体、硬化体、並びにそれらを含む電子機器
CN101516961B (zh) * 2006-09-21 2012-09-05 汉高两合股份公司 催化低温聚合
US7537827B1 (en) 2006-12-13 2009-05-26 Henkel Corporation Prepreg laminates
US8975318B2 (en) * 2008-02-21 2015-03-10 Huntsman Advanced Materials Americas Llc Halogen-free benzoxazine based curable compositions for high TG applications
WO2009115488A1 (en) * 2008-03-19 2009-09-24 Henkel Ag & Co. Kgaa Copolymerization method
KR101627598B1 (ko) * 2008-08-12 2016-06-07 훈츠만 어드밴스트 머티리얼스(스위처랜드) 게엠베하 열경화성 조성물
DE102009028099A1 (de) * 2009-07-29 2011-02-03 Henkel Ag & Co. Kgaa Schlagzähmodifizierte Zusammensetzungen
EP2542618B1 (de) * 2010-03-05 2020-01-01 Huntsman Advanced Materials Americas LLC System mit wärmehärtendem harz und geringem dielektrischem verlust zur verwendung in elektrischen komponenten bei hohen frequenzen
WO2012027119A1 (en) * 2010-08-25 2012-03-01 Huntsman Advanced Materials Americas Llc Formulated benzoxazine based system for transportation applications
US20120095132A1 (en) * 2010-10-19 2012-04-19 Chung-Hao Chang Halogen- and phosphorus-free thermosetting resin composition
KR101907713B1 (ko) * 2011-03-14 2018-10-12 스미토모 베이클리트 컴퍼니 리미티드 빌드업용 프리프레그
EP2691466B1 (de) * 2011-03-28 2017-12-27 3M Innovative Properties Company Härtbare zusammensetzung, artikel, härtungsverfahren, und reaktionsprodukt
CN102351909B (zh) * 2011-07-18 2014-04-09 南京大学 含二茂铁基苯并噁嗪单体或前驱体的制备及其热固化树脂
TWI450913B (zh) * 2011-11-04 2014-09-01 Elite Material Co Ltd Thermosetting resin composition and application board and circuit board
KR102338982B1 (ko) * 2016-06-27 2021-12-14 코오롱인더스트리 주식회사 열경화성 수지 조성물, 이를 이용한 프리프레그 및 기판
CN109694553B (zh) * 2018-12-26 2021-06-04 广东生益科技股份有限公司 一种无卤无磷阻燃树脂组合物、包含其的粘结材料及覆金属箔层压板
CN116724027B (zh) * 2021-01-29 2026-03-06 本州化学工业株式会社 新型苯并噁嗪化合物、含有该化合物的树脂原料组合物、固化性树脂组合物及其固化物
CN113413918A (zh) * 2021-06-10 2021-09-21 南京理工大学 具有吸附与催化芬顿反应功能的二茂铁树脂及其制备方法

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JPH06263842A (ja) * 1993-03-12 1994-09-20 Nippon Kayaku Co Ltd エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JPH06306142A (ja) * 1993-04-27 1994-11-01 Toshiba Corp エポキシ樹脂組成物及びそれを用いた複合材料
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Also Published As

Publication number Publication date
JP5161067B2 (ja) 2013-03-13
KR101246943B1 (ko) 2013-03-25
KR20080000633A (ko) 2008-01-02
ES2310404T3 (es) 2009-01-01
TWI385208B (zh) 2013-02-11
US8062455B2 (en) 2011-11-22
TW200641034A (en) 2006-12-01
US20080302471A1 (en) 2008-12-11
EP1871835B1 (de) 2008-08-13
WO2006103185A1 (en) 2006-10-05
EP1871835A1 (de) 2008-01-02
EP1647576A1 (de) 2006-04-19
DE602006002273D1 (de) 2008-09-25
JP2008534725A (ja) 2008-08-28

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