ATE408584T1 - Dünnschichtverkapselung von mems-bauelementen - Google Patents

Dünnschichtverkapselung von mems-bauelementen

Info

Publication number
ATE408584T1
ATE408584T1 AT03717894T AT03717894T ATE408584T1 AT E408584 T1 ATE408584 T1 AT E408584T1 AT 03717894 T AT03717894 T AT 03717894T AT 03717894 T AT03717894 T AT 03717894T AT E408584 T1 ATE408584 T1 AT E408584T1
Authority
AT
Austria
Prior art keywords
thin film
film encapsulation
sacrificial layer
mems components
substrate
Prior art date
Application number
AT03717894T
Other languages
English (en)
Inventor
Carl Freidhoff
Original Assignee
Northrop Grumman Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northrop Grumman Corp filed Critical Northrop Grumman Corp
Application granted granted Critical
Publication of ATE408584T1 publication Critical patent/ATE408584T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT03717894T 2002-02-19 2003-02-19 Dünnschichtverkapselung von mems-bauelementen ATE408584T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/076,559 US7045459B2 (en) 2002-02-19 2002-02-19 Thin film encapsulation of MEMS devices

Publications (1)

Publication Number Publication Date
ATE408584T1 true ATE408584T1 (de) 2008-10-15

Family

ID=27732514

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03717894T ATE408584T1 (de) 2002-02-19 2003-02-19 Dünnschichtverkapselung von mems-bauelementen

Country Status (7)

Country Link
US (3) US7045459B2 (de)
EP (1) EP1476394B1 (de)
JP (1) JP2005517546A (de)
AT (1) ATE408584T1 (de)
AU (1) AU2003222215A1 (de)
DE (1) DE60323606D1 (de)
WO (1) WO2003070625A2 (de)

Families Citing this family (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030183916A1 (en) * 2002-03-27 2003-10-02 John Heck Packaging microelectromechanical systems
US6877209B1 (en) * 2002-08-28 2005-04-12 Silicon Light Machines, Inc. Method for sealing an active area of a surface acoustic wave device on a wafer
US6846423B1 (en) * 2002-08-28 2005-01-25 Silicon Light Machines Corporation Wafer-level seal for non-silicon-based devices
US7317232B2 (en) * 2002-10-22 2008-01-08 Cabot Microelectronics Corporation MEM switching device
AU2003286572A1 (en) * 2002-10-23 2004-05-13 Rutgers, The State University Of New Jersey Processes for hermetically packaging wafer level microscopic structures
US20040118621A1 (en) * 2002-12-18 2004-06-24 Curtis Marc D. Live hydraulics for utility vehicles
WO2004061983A1 (ja) * 2002-12-27 2004-07-22 Matsushita Electric Industrial Co., Ltd. 電子デバイスおよびその製造方法
US20040166606A1 (en) * 2003-02-26 2004-08-26 David Forehand Low temperature wafer-level micro-encapsulation
US7514283B2 (en) * 2003-03-20 2009-04-07 Robert Bosch Gmbh Method of fabricating electromechanical device having a controlled atmosphere
US6951769B2 (en) * 2003-06-04 2005-10-04 Texas Instruments Incorporated Method for stripping sacrificial layer in MEMS assembly
US6952041B2 (en) * 2003-07-25 2005-10-04 Robert Bosch Gmbh Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
TW593127B (en) 2003-08-18 2004-06-21 Prime View Int Co Ltd Interference display plate and manufacturing method thereof
US6930367B2 (en) * 2003-10-31 2005-08-16 Robert Bosch Gmbh Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems
DE10353767B4 (de) * 2003-11-17 2005-09-29 Infineon Technologies Ag Vorrichtung zur Häusung einer mikromechanischen Struktur und Verfahren zur Herstellung derselben
JP4464125B2 (ja) * 2003-12-22 2010-05-19 ソニー株式会社 構造体の作製方法及びシリコン酸化膜エッチング剤
EP1758814A4 (de) * 2004-03-15 2010-12-15 Georgia Tech Res Inst Verkapselung für elektro-mechanische-mikrosysteme und herstellungsverfahren dafür
WO2005099088A1 (en) * 2004-03-26 2005-10-20 Cypress Semiconductor Corp. Integrated circuit having one or more conductive devices formed over a saw and/or mems device
US7365405B2 (en) 2004-04-27 2008-04-29 Potochnik Stephen J Metrology structure and methods
US7381583B1 (en) * 2004-05-24 2008-06-03 The United States Of America As Represented By The Secretary Of The Air Force MEMS RF switch integrated process
US7145213B1 (en) * 2004-05-24 2006-12-05 The United States Of America As Represented By The Secretary Of The Air Force MEMS RF switch integrated process
US7573547B2 (en) 2004-09-27 2009-08-11 Idc, Llc System and method for protecting micro-structure of display array using spacers in gap within display device
US7446926B2 (en) * 2004-09-27 2008-11-04 Idc, Llc System and method of providing a regenerating protective coating in a MEMS device
US20060076634A1 (en) 2004-09-27 2006-04-13 Lauren Palmateer Method and system for packaging MEMS devices with incorporated getter
US7259449B2 (en) 2004-09-27 2007-08-21 Idc, Llc Method and system for sealing a substrate
US20060076631A1 (en) * 2004-09-27 2006-04-13 Lauren Palmateer Method and system for providing MEMS device package with secondary seal
US8124434B2 (en) * 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display
US7184202B2 (en) 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
FR2875948B1 (fr) 2004-09-28 2006-12-08 Commissariat Energie Atomique Composant d'encapsulation de micro-systeme electromecaniques integres et procede de realisation du composant
US7037746B1 (en) * 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
US20080145976A1 (en) * 2005-01-24 2008-06-19 O'mahony Conor Packaging of Micro Devices
US7601554B1 (en) 2005-01-31 2009-10-13 The United States Of America As Represented By The Secretary Of The Air Force Shaped MEMS contact
US20060211233A1 (en) * 2005-03-21 2006-09-21 Skyworks Solutions, Inc. Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure
US7576426B2 (en) * 2005-04-01 2009-08-18 Skyworks Solutions, Inc. Wafer level package including a device wafer integrated with a passive component
US7449355B2 (en) * 2005-04-27 2008-11-11 Robert Bosch Gmbh Anti-stiction technique for electromechanical systems and electromechanical device employing same
US7820470B2 (en) * 2005-07-15 2010-10-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of micro-electro-mechanical device
JP4995503B2 (ja) * 2005-07-15 2012-08-08 株式会社半導体エネルギー研究所 微小電気機械式装置の作製方法
US20070048887A1 (en) * 2005-08-26 2007-03-01 Innovative Micro Technology Wafer level hermetic bond using metal alloy
US7541209B2 (en) * 2005-10-14 2009-06-02 Hewlett-Packard Development Company, L.P. Method of forming a device package having edge interconnect pad
US7561334B2 (en) * 2005-12-20 2009-07-14 Qualcomm Mems Technologies, Inc. Method and apparatus for reducing back-glass deflection in an interferometric modulator display device
DE102006001493B4 (de) * 2006-01-11 2007-10-18 Austriamicrosystems Ag MEMS-Sensor und Verfahren zur Herstellung
US20070170528A1 (en) 2006-01-20 2007-07-26 Aaron Partridge Wafer encapsulated microelectromechanical structure and method of manufacturing same
JP2007216308A (ja) * 2006-02-14 2007-08-30 Seiko Epson Corp 電子装置及びその製造方法
JP2007222956A (ja) * 2006-02-21 2007-09-06 Seiko Epson Corp Ｍｅｍｓデバイスおよびｍｅｍｓデバイスの製造方法
JP5268082B2 (ja) * 2006-02-22 2013-08-21 シチズン電子株式会社 光半導体装置
JP2007276089A (ja) * 2006-04-11 2007-10-25 Sony Corp 電気機械素子とその製造方法、並びに共振器とその製造方法
US7746537B2 (en) * 2006-04-13 2010-06-29 Qualcomm Mems Technologies, Inc. MEMS devices and processes for packaging such devices
US20070275502A1 (en) * 2006-05-26 2007-11-29 Stephen George Air cavity wafer level packaging assembly and method
US7468327B2 (en) * 2006-06-13 2008-12-23 Taiwan Semiconductor Manufacturing Co., Ltd. Methods of fabricating a micromechanical structure
EP2029473A2 (de) * 2006-06-21 2009-03-04 Qualcomm Incorporated Mems-vorrichtung mit ausgespartem hohlraum und verfahren dafür
US7635606B2 (en) * 2006-08-02 2009-12-22 Skyworks Solutions, Inc. Wafer level package with cavities for active devices
US20080042223A1 (en) * 2006-08-17 2008-02-21 Lu-Lee Liao Microelectromechanical system package and method for making the same
US20080075308A1 (en) * 2006-08-30 2008-03-27 Wen-Chieh Wei Silicon condenser microphone
US20080083957A1 (en) * 2006-10-05 2008-04-10 Wen-Chieh Wei Micro-electromechanical system package
US7894622B2 (en) 2006-10-13 2011-02-22 Merry Electronics Co., Ltd. Microphone
US20080090320A1 (en) * 2006-10-17 2008-04-17 John Heck Self sealed MEMS device
US7671515B2 (en) * 2006-11-07 2010-03-02 Robert Bosch, Gmbh Microelectromechanical devices and fabrication methods
JP2008213061A (ja) * 2007-03-01 2008-09-18 Toshiba Corp 半導体装置及びその製造方法
US20080217708A1 (en) * 2007-03-09 2008-09-11 Skyworks Solutions, Inc. Integrated passive cap in a system-in-package
DE102007020656B4 (de) 2007-04-30 2009-05-07 Infineon Technologies Ag Werkstück mit Halbleiterchips, Halbleiterbauteil und Verfahren zur Herstellung eines Werkstücks mit Halbleiterchips
US7687895B2 (en) * 2007-04-30 2010-03-30 Infineon Technologies Ag Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips
US7737376B2 (en) * 2007-05-09 2010-06-15 Alcatel-Lucent Usa Inc. Mechanical switch
US8324728B2 (en) * 2007-11-30 2012-12-04 Skyworks Solutions, Inc. Wafer level packaging using flip chip mounting
US8900931B2 (en) 2007-12-26 2014-12-02 Skyworks Solutions, Inc. In-situ cavity integrated circuit package
US20100020382A1 (en) * 2008-07-22 2010-01-28 Qualcomm Mems Technologies, Inc. Spacer for mems device
WO2010049813A1 (en) * 2008-10-29 2010-05-06 Uti Limited Partnership Integrated encapsulation for mems devices
US8430255B2 (en) * 2009-03-19 2013-04-30 Robert Bosch Gmbh Method of accurately spacing Z-axis electrode
US7875482B2 (en) * 2009-03-19 2011-01-25 Robert Bosch Gmbh Substrate with multiple encapsulated pressures
US8237235B2 (en) * 2009-04-14 2012-08-07 Taiwan Semiconductor Manufacturing Company, Ltd. Metal-ceramic multilayer structure
JP2010280035A (ja) * 2009-06-04 2010-12-16 Toshiba Corp Ｍｅｍｓデバイスとその製造方法
FR2947812B1 (fr) * 2009-07-07 2012-02-10 Commissariat Energie Atomique Cavite etanche et procede de realisation d'une telle cavite etanche
US8379392B2 (en) 2009-10-23 2013-02-19 Qualcomm Mems Technologies, Inc. Light-based sealing and device packaging
CN103026525B (zh) 2010-07-26 2016-11-09 默克专利有限公司 在器件中的纳米晶体
US8737674B2 (en) * 2011-02-11 2014-05-27 Infineon Technologies Ag Housed loudspeaker array
WO2012110178A1 (en) 2011-02-14 2012-08-23 Merck Patent Gmbh Device and method for treatment of cells and cell tissue
WO2012112540A2 (en) 2011-02-15 2012-08-23 Fujifilm Dimatix, Inc. Piezoelectric transducers using micro-dome arrays
JP2012195829A (ja) 2011-03-17 2012-10-11 Seiko Epson Corp 発振回路
US9923152B2 (en) 2011-03-24 2018-03-20 Merck Patent Gmbh Organic ionic functional materials
JP2012222718A (ja) 2011-04-13 2012-11-12 Seiko Epson Corp 発振器
JP6223961B2 (ja) 2011-05-12 2017-11-01 メルク パテント ゲーエムベーハー 有機イオン性機能材料、組成物および電子素子
US8643140B2 (en) 2011-07-11 2014-02-04 United Microelectronics Corp. Suspended beam for use in MEMS device
US8525354B2 (en) 2011-10-13 2013-09-03 United Microelectronics Corporation Bond pad structure and fabricating method thereof
ITTO20110995A1 (it) * 2011-10-31 2013-05-01 St Microelectronics Srl Dispositivo micro-elettro-meccanico dotato di regioni conduttive sepolte e relativo procedimento di fabbricazione
US20140147955A1 (en) * 2012-11-29 2014-05-29 Agency For Science, Technology And Research Method of encapsulating a micro-electromechanical (mems) device
DE102013102223B4 (de) * 2013-03-06 2014-09-18 Epcos Ag Miniaturisiertes Mehrkomponentenbauelement und Verfahren zur Herstellung
US8981501B2 (en) 2013-04-25 2015-03-17 United Microelectronics Corp. Semiconductor device and method of forming the same
US9416003B2 (en) * 2014-02-24 2016-08-16 Freescale Semiconductor, Inc. Semiconductor die with high pressure cavity
KR101572045B1 (ko) * 2014-04-14 2015-11-27 한국과학기술원 소자 패키징 방법 및 이를 이용한 소자 패키지
JP6461030B2 (ja) * 2016-03-15 2019-01-30 株式会社東芝 電子装置及び電子装置の製造方法
EP3455326B1 (de) 2016-05-11 2021-02-24 Merck Patent GmbH Zusammensetzungen für elektrochemische zellen
FR3051458B1 (fr) * 2016-05-20 2020-09-04 Univ Limoges Commutateur variable microelectromecanique radiofrequence
DE102016111911A1 (de) * 2016-06-29 2018-01-04 Snaptrack, Inc. Bauelement mit Dünnschicht-Abdeckung und Verfahren zur Herstellung
US10192850B1 (en) 2016-09-19 2019-01-29 Sitime Corporation Bonding process with inhibited oxide formation
US11427731B2 (en) 2018-03-23 2022-08-30 Teledyne Micralyne, Inc. Adhesive silicon oxynitride film
CN117253889B (zh) * 2023-11-20 2024-01-26 成都科华新创科技有限公司 射频集成电路的固支梁结构静电保护电路及其制备方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5723171A (en) * 1992-10-23 1998-03-03 Symetrix Corporation Integrated circuit electrode structure and process for fabricating same
US5619061A (en) * 1993-07-27 1997-04-08 Texas Instruments Incorporated Micromechanical microwave switching
US5499449A (en) * 1994-03-01 1996-03-19 Molded Metal Services, Inc. Method of manufacturing battery terminals
US5504026A (en) * 1995-04-14 1996-04-02 Analog Devices, Inc. Methods for planarization and encapsulation of micromechanical devices in semiconductor processes
US6969635B2 (en) * 2000-12-07 2005-11-29 Reflectivity, Inc. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US5798283A (en) * 1995-09-06 1998-08-25 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
US5963788A (en) * 1995-09-06 1999-10-05 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
US6146917A (en) * 1997-03-03 2000-11-14 Ford Motor Company Fabrication method for encapsulated micromachined structures
US6149828A (en) * 1997-05-05 2000-11-21 Micron Technology, Inc. Supercritical etching compositions and method of using same
JP2000186931A (ja) * 1998-12-21 2000-07-04 Murata Mfg Co Ltd 小型電子部品及びその製造方法並びに該小型電子部品に用いるビアホールの成形方法
US6174820B1 (en) * 1999-02-16 2001-01-16 Sandia Corporation Use of silicon oxynitride as a sacrificial material for microelectromechanical devices
JP3714020B2 (ja) * 1999-04-20 2005-11-09 オムロン株式会社 半導体素子の密封構造
DE19961578A1 (de) 1999-12-21 2001-06-28 Bosch Gmbh Robert Sensor mit zumindest einer mikromechanischen Struktur und Verfahren zur Herstellung
US6307169B1 (en) * 2000-02-01 2001-10-23 Motorola Inc. Micro-electromechanical switch
DE10005555A1 (de) * 2000-02-09 2001-08-16 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
US6400015B1 (en) * 2000-03-31 2002-06-04 Intel Corporation Method of creating shielded structures to protect semiconductor devices
US6811714B1 (en) * 2000-10-06 2004-11-02 Freescale Semiconductor, Inc. Micromachined component and method of manufacture
US6534413B1 (en) * 2000-10-27 2003-03-18 Air Products And Chemicals, Inc. Method to remove metal and silicon oxide during gas-phase sacrificial oxide etch
JP2002151657A (ja) * 2000-11-08 2002-05-24 Sanyo Electric Co Ltd 誘電体素子およびその製造方法
US20020096421A1 (en) * 2000-11-29 2002-07-25 Cohn Michael B. MEMS device with integral packaging
US6883977B2 (en) * 2000-12-14 2005-04-26 Shipley Company, L.L.C. Optical device package for flip-chip mounting
ITVA20000042A1 (it) * 2000-12-15 2002-06-15 St Microelectronics Srl Sensore di pressione monoliticamente integrato e relativo processo direalizzazione.
US6512300B2 (en) * 2001-01-10 2003-01-28 Raytheon Company Water level interconnection
US6803843B2 (en) * 2001-02-22 2004-10-12 Canon Kabushiki Kaisha Movable-body apparatus, optical deflector, and method of fabricating the same
US6465280B1 (en) * 2001-03-07 2002-10-15 Analog Devices, Inc. In-situ cap and method of fabricating same for an integrated circuit device
US6859542B2 (en) * 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US6646778B2 (en) * 2001-08-01 2003-11-11 Silicon Light Machines Grating light valve with encapsulated dampening gas
ATE417021T1 (de) * 2001-11-09 2008-12-15 Wispry Inc Mems-einrichtung mit dreischichtigem strahl und diesbezügliche verfahren
US6660564B2 (en) * 2002-01-25 2003-12-09 Sony Corporation Wafer-level through-wafer packaging process for MEMS and MEMS package produced thereby
US7163763B2 (en) * 2002-06-04 2007-01-16 Tulip Corporation Cold formed battery terminal
US7070441B1 (en) * 2004-03-15 2006-07-04 Tulip Corporation Acid seal

Also Published As

Publication number Publication date
JP2005517546A (ja) 2005-06-16
US20060183262A1 (en) 2006-08-17
AU2003222215A1 (en) 2003-09-09
US7875941B2 (en) 2011-01-25
WO2003070625A2 (en) 2003-08-28
US7638429B2 (en) 2009-12-29
US20030155643A1 (en) 2003-08-21
US7045459B2 (en) 2006-05-16
DE60323606D1 (de) 2008-10-30
WO2003070625A3 (en) 2004-03-25
EP1476394A2 (de) 2004-11-17
US20100237446A1 (en) 2010-09-23
EP1476394B1 (de) 2008-09-17

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