ATE408649T1 - Härtbare silikonzusammensetzung und daraus hergestellte elektronische vorrichtung - Google Patents

Härtbare silikonzusammensetzung und daraus hergestellte elektronische vorrichtung

Info

Publication number
ATE408649T1
ATE408649T1 AT06729606T AT06729606T ATE408649T1 AT E408649 T1 ATE408649 T1 AT E408649T1 AT 06729606 T AT06729606 T AT 06729606T AT 06729606 T AT06729606 T AT 06729606T AT E408649 T1 ATE408649 T1 AT E408649T1
Authority
AT
Austria
Prior art keywords
designates
positive number
epoxy
electronic device
silicone composition
Prior art date
Application number
AT06729606T
Other languages
English (en)
Inventor
Yoshitsugu Morita
Minoru Isshiki
Hiroshi Ueki
Tomoko Kato
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE408649T1 publication Critical patent/ATE408649T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
AT06729606T 2005-03-15 2006-03-15 Härtbare silikonzusammensetzung und daraus hergestellte elektronische vorrichtung ATE408649T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005072395A JP5166677B2 (ja) 2005-03-15 2005-03-15 硬化性シリコーン組成物および電子部品

Publications (1)

Publication Number Publication Date
ATE408649T1 true ATE408649T1 (de) 2008-10-15

Family

ID=36602660

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06729606T ATE408649T1 (de) 2005-03-15 2006-03-15 Härtbare silikonzusammensetzung und daraus hergestellte elektronische vorrichtung

Country Status (9)

Country Link
US (1) US20090214870A1 (de)
EP (1) EP1858983B1 (de)
JP (1) JP5166677B2 (de)
KR (1) KR101247176B1 (de)
CN (1) CN101142280B (de)
AT (1) ATE408649T1 (de)
DE (1) DE602006002808D1 (de)
TW (1) TWI383025B (de)
WO (1) WO2006098493A1 (de)

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JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
US7879739B2 (en) * 2006-05-09 2011-02-01 Intel Corporation Thin transition layer between a group III-V substrate and a high-k gate dielectric layer
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JP5388409B2 (ja) * 2006-09-28 2014-01-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
JP5306592B2 (ja) * 2006-12-04 2013-10-02 東レ・ダウコーニング株式会社 硬化性エポキシ樹脂組成物、硬化物、およびその用途
JP5248012B2 (ja) * 2006-12-25 2013-07-31 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
JP5238157B2 (ja) * 2006-12-25 2013-07-17 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP2008255295A (ja) * 2007-04-09 2008-10-23 Asahi Kasei Chemicals Corp 熱硬化性組成物及び光半導体封止材
CN100573856C (zh) * 2007-07-11 2009-12-23 南茂科技股份有限公司 增进散热效益的卷带式半导体封装构造
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JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
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JP5278386B2 (ja) * 2010-06-22 2013-09-04 信越化学工業株式会社 実装用封止材及びそれを用いて封止した半導体装置
JP5278385B2 (ja) * 2010-06-22 2013-09-04 信越化学工業株式会社 実装用封止材及びそれを用いて封止した半導体装置
CN103906783B (zh) * 2012-03-23 2016-09-14 株式会社艾迪科 含硅固化性树脂组合物
JP2014169415A (ja) * 2013-03-05 2014-09-18 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6141064B2 (ja) * 2013-03-21 2017-06-07 日立オートモティブシステムズ株式会社 回路基板と筐体の接続方法
US9318450B1 (en) * 2014-11-24 2016-04-19 Raytheon Company Patterned conductive epoxy heat-sink attachment in a monolithic microwave integrated circuit (MMIC)
EP3467043B1 (de) * 2016-05-31 2020-10-28 Sekisui Polymatech Co., Ltd. Wärmeleitendes element, wärmeleitende zusammensetzung und herstellungsverfahren für wärmeleitende zusammensetzung
WO2018148282A1 (en) 2017-02-08 2018-08-16 Elkem Silicones USA Corp. Secondary battery pack with improved thermal management
US10050010B1 (en) * 2017-03-22 2018-08-14 International Business Machines Corporation Selectively cross-linked thermal interface materials
KR20230077716A (ko) * 2020-09-30 2023-06-01 세키수이 폴리머텍 가부시키가이샤 열전도성 시트, 그 장착 방법 및 제조 방법
CN115602646A (zh) * 2021-07-08 2023-01-13 碁达科技股份有限公司（Tw） 热介面组成物、热介面材料及其制备方法
WO2023044701A1 (en) * 2021-09-24 2023-03-30 Henkel Ag & Co. Kgaa Thermally conductive adhesive composition, preparation method and use thereof
JP7797942B2 (ja) * 2022-03-30 2026-01-14 株式会社レゾナック 熱伝導性組成物
CN114634784A (zh) * 2022-04-21 2022-06-17 苏州晶之电科技有限公司 一种有机硅环氧灌封胶及其制备方法
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Also Published As

Publication number Publication date
KR101247176B1 (ko) 2013-03-25
CN101142280B (zh) 2010-12-08
DE602006002808D1 (de) 2008-10-30
TW200636012A (en) 2006-10-16
WO2006098493A1 (en) 2006-09-21
EP1858983B1 (de) 2008-09-17
TWI383025B (zh) 2013-01-21
CN101142280A (zh) 2008-03-12
US20090214870A1 (en) 2009-08-27
EP1858983A1 (de) 2007-11-28
JP5166677B2 (ja) 2013-03-21
JP2006257115A (ja) 2006-09-28
KR20070117597A (ko) 2007-12-12

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