ATE417944T1 - Verfahren zur herstellung von goldnitrid - Google Patents

Verfahren zur herstellung von goldnitrid

Info

Publication number
ATE417944T1
ATE417944T1 AT05747126T AT05747126T ATE417944T1 AT E417944 T1 ATE417944 T1 AT E417944T1 AT 05747126 T AT05747126 T AT 05747126T AT 05747126 T AT05747126 T AT 05747126T AT E417944 T1 ATE417944 T1 AT E417944T1
Authority
AT
Austria
Prior art keywords
gold
nitrogen plasma
nitride
film
plasma
Prior art date
Application number
AT05747126T
Other languages
English (en)
Inventor
Lidija Siller
Satheesh Krishnamurthy
Yimin Chao
Original Assignee
Univ Newcastle
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Newcastle filed Critical Univ Newcastle
Application granted granted Critical
Publication of ATE417944T1 publication Critical patent/ATE417944T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5826—Treatment with charged particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5846—Reactive treatment
    • C23C14/586—Nitriding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/694—Inorganic materials composed of nitrides
    • H10P14/6943—Inorganic materials composed of nitrides containing silicon
    • H10P14/69433—Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Ceramic Products (AREA)
  • Catalysts (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
AT05747126T 2004-06-10 2005-06-03 Verfahren zur herstellung von goldnitrid ATE417944T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0413036.5A GB0413036D0 (en) 2004-06-10 2004-06-10 Method of making gold nitride

Publications (1)

Publication Number Publication Date
ATE417944T1 true ATE417944T1 (de) 2009-01-15

Family

ID=32732309

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05747126T ATE417944T1 (de) 2004-06-10 2005-06-03 Verfahren zur herstellung von goldnitrid

Country Status (6)

Country Link
US (1) US20080264776A1 (de)
EP (1) EP1756327B1 (de)
AT (1) ATE417944T1 (de)
DE (1) DE602005011798D1 (de)
GB (1) GB0413036D0 (de)
WO (1) WO2005121395A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013099570A1 (ja) * 2011-12-27 2013-07-04 キヤノンアネルバ株式会社 貴金属膜の連続成膜方法及び電子部品の連続製造方法
BE1028380B1 (fr) 2020-06-08 2022-01-17 Ionics Sa Couche d'alliage nickel-or ayant des atomes d'azote insérés en son sein et procédé de traitement lie

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4495254A (en) * 1981-05-18 1985-01-22 Westinghouse Electric Corp. Protectively-coated gold-plated article of jewelry or wristwatch component
DE4205017A1 (de) * 1992-02-19 1993-08-26 Leybold Ag Verfahren zur erzeugung einer dekorativen goldlegierungsschicht
US5453168A (en) * 1993-08-25 1995-09-26 Tulip Memory Systems, Inc. Method for forming protective overcoatings for metallic-film magnetic-recording mediums
US7094705B2 (en) * 2004-01-20 2006-08-22 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-step plasma treatment method to improve CU interconnect electrical performance

Also Published As

Publication number Publication date
EP1756327B1 (de) 2008-12-17
DE602005011798D1 (de) 2009-01-29
WO2005121395A1 (en) 2005-12-22
GB0413036D0 (en) 2004-07-14
US20080264776A1 (en) 2008-10-30
EP1756327A1 (de) 2007-02-28

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Legal Events

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