ATE418749T1 - Verfahren zur bestimmung der relativen auslenkkurvenamplitude - Google Patents

Verfahren zur bestimmung der relativen auslenkkurvenamplitude

Info

Publication number
ATE418749T1
ATE418749T1 AT04770290T AT04770290T ATE418749T1 AT E418749 T1 ATE418749 T1 AT E418749T1 AT 04770290 T AT04770290 T AT 04770290T AT 04770290 T AT04770290 T AT 04770290T AT E418749 T1 ATE418749 T1 AT E418749T1
Authority
AT
Austria
Prior art keywords
predetermined wavelength
determining
deflection curve
relative deflection
curve amplitude
Prior art date
Application number
AT04770290T
Other languages
English (en)
Inventor
David Ziger
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE418749T1 publication Critical patent/ATE418749T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Paper (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
AT04770290T 2003-10-20 2004-10-19 Verfahren zur bestimmung der relativen auslenkkurvenamplitude ATE418749T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US51274403P 2003-10-20 2003-10-20

Publications (1)

Publication Number Publication Date
ATE418749T1 true ATE418749T1 (de) 2009-01-15

Family

ID=34465371

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04770290T ATE418749T1 (de) 2003-10-20 2004-10-19 Verfahren zur bestimmung der relativen auslenkkurvenamplitude

Country Status (5)

Country Link
US (1) US7790480B2 (de)
EP (1) EP1728122B1 (de)
AT (1) ATE418749T1 (de)
DE (1) DE602004018690D1 (de)
WO (1) WO2005038529A2 (de)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4308586A (en) * 1980-05-02 1981-12-29 Nanometrics, Incorporated Method for the precise determination of photoresist exposure time
US5607800A (en) * 1995-02-15 1997-03-04 Lucent Technologies Inc. Method and arrangement for characterizing micro-size patterns
US5982496A (en) * 1996-03-11 1999-11-09 Vlsi Technology, Inc. Thin film thickness and optimal focus measuring using reflectivity
US6316167B1 (en) * 2000-01-10 2001-11-13 International Business Machines Corporation Tunabale vapor deposited materials as antireflective coatings, hardmasks and as combined antireflective coating/hardmasks and methods of fabrication thereof and application thereof
JP4601744B2 (ja) * 1998-07-14 2010-12-22 ノバ メジャリング インスツルメンツ リミテッド フォトリソグラフィープロセスを制御するための方法およびシステム
TW200512927A (en) 2003-08-08 2005-04-01 Koninkl Philips Electronics Nv Method for determining optimal resist thickness

Also Published As

Publication number Publication date
WO2005038529A3 (en) 2005-07-07
US7790480B2 (en) 2010-09-07
EP1728122B1 (de) 2008-12-24
WO2005038529A2 (en) 2005-04-28
EP1728122A2 (de) 2006-12-06
DE602004018690D1 (de) 2009-02-05
US20090119069A1 (en) 2009-05-07

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Legal Events

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