ATE419509T1 - Verfahren und system zur höhentriangulationsmessung - Google Patents

Verfahren und system zur höhentriangulationsmessung

Info

Publication number
ATE419509T1
ATE419509T1 AT05735069T AT05735069T ATE419509T1 AT E419509 T1 ATE419509 T1 AT E419509T1 AT 05735069 T AT05735069 T AT 05735069T AT 05735069 T AT05735069 T AT 05735069T AT E419509 T1 ATE419509 T1 AT E419509T1
Authority
AT
Austria
Prior art keywords
height
light strip
numerical aperture
trangulation
measurement
Prior art date
Application number
AT05735069T
Other languages
English (en)
Inventor
Meir Ben-Levi
Original Assignee
Camtek Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Camtek Ltd filed Critical Camtek Ltd
Application granted granted Critical
Publication of ATE419509T1 publication Critical patent/ATE419509T1/de

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608Height gauges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/022Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of tv-camera scanning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Measurement Of Optical Distance (AREA)
  • Measuring Fluid Pressure (AREA)
AT05735069T 2004-05-03 2005-05-01 Verfahren und system zur höhentriangulationsmessung ATE419509T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL161745A IL161745A (en) 2004-05-03 2004-05-03 A symmetrical configuration for triangulation measurement, especially for object height measurement

Publications (1)

Publication Number Publication Date
ATE419509T1 true ATE419509T1 (de) 2009-01-15

Family

ID=35242096

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05735069T ATE419509T1 (de) 2004-05-03 2005-05-01 Verfahren und system zur höhentriangulationsmessung

Country Status (8)

Country Link
US (1) US8363229B2 (de)
EP (1) EP1756513B1 (de)
JP (1) JP2007536553A (de)
AT (1) ATE419509T1 (de)
CA (1) CA2563907A1 (de)
DE (1) DE602005012091D1 (de)
IL (1) IL161745A (de)
WO (1) WO2005104658A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100315655A1 (en) * 2006-12-07 2010-12-16 Esec Ag Method And Device For Measuring A Height Difference
EP2191788A1 (de) * 2008-11-29 2010-06-02 Braun Gmbh Verfahren und Vorrichtung zur dreidimensionalen Messung eines Zahnmodells
JP5882011B2 (ja) * 2011-10-03 2016-03-09 ソフトワークス株式会社 尖端バンプの高さ測定装置
TWI509265B (zh) * 2012-04-18 2015-11-21 Chipmos Technologies Inc 垂直式探針卡及應用其之檢測模組
US9885671B2 (en) 2014-06-09 2018-02-06 Kla-Tencor Corporation Miniaturized imaging apparatus for wafer edge
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
CN105387807A (zh) * 2014-09-04 2016-03-09 富泰华工业(深圳)有限公司 测量物体高度的系统及方法
CN116097059A (zh) * 2020-07-13 2023-05-09 卡姆特有限公司 凸块测量高度计量
US11959961B2 (en) 2022-04-08 2024-04-16 Orbotech Ltd. Method of determining an X and Y location of a surface particle

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3187185A (en) * 1960-12-22 1965-06-01 United States Steel Corp Apparatus for determining surface contour
JP2507370B2 (ja) * 1986-12-02 1996-06-12 株式会社東芝 試料面位置測定装置
JPS63262513A (ja) * 1987-04-20 1988-10-28 Fujitsu Ltd パタ−ン検査装置
US5028799A (en) * 1988-08-01 1991-07-02 Robotic Vision System, Inc. Method and apparatus for three dimensional object surface determination using co-planar data from multiple sensors
JPH0255936A (ja) * 1988-08-19 1990-02-26 Nippon Kagaku Kogyo Kk 光散乱式計測装置
US5181424A (en) * 1991-04-18 1993-01-26 International Paper Company Tear-strip testing apparatus
JPH0758172B2 (ja) * 1992-05-01 1995-06-21 工業技術院長 形状測定方法およびその装置
US5818061A (en) * 1992-06-24 1998-10-06 Robotic Vision Systems, Inc. Apparatus and method for obtaining three-dimensional data from objects in a contiguous array
JPH0949709A (ja) * 1995-08-09 1997-02-18 Hitachi Ltd 部品の傾き・高さ測定方法及びそれを用いた検査装置
JP3335826B2 (ja) * 1995-12-05 2002-10-21 株式会社日立製作所 はんだバンプの測定装置
JP3942252B2 (ja) * 1997-12-19 2007-07-11 Juki株式会社 3次元測定装置
JP2001289614A (ja) * 2000-01-31 2001-10-19 Omron Corp 変位センサ
US6975410B1 (en) * 2002-04-15 2005-12-13 Sturgill Dennis T Measuring device
US7145654B2 (en) * 2003-10-01 2006-12-05 Tokyo Electron Limited Method and apparatus to reduce spotsize in an optical metrology instrument

Also Published As

Publication number Publication date
WO2005104658A3 (en) 2006-04-06
JP2007536553A (ja) 2007-12-13
WO2005104658A2 (en) 2005-11-10
CA2563907A1 (en) 2005-11-10
EP1756513A4 (de) 2007-05-02
IL161745A (en) 2014-07-31
US20100220340A1 (en) 2010-09-02
EP1756513A2 (de) 2007-02-28
DE602005012091D1 (de) 2009-02-12
EP1756513B1 (de) 2008-12-31
US8363229B2 (en) 2013-01-29
IL161745A0 (en) 2005-11-20

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Legal Events

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