ATE421154T1 - Elektrische leiter - Google Patents

Elektrische leiter

Info

Publication number
ATE421154T1
ATE421154T1 AT03778694T AT03778694T ATE421154T1 AT E421154 T1 ATE421154 T1 AT E421154T1 AT 03778694 T AT03778694 T AT 03778694T AT 03778694 T AT03778694 T AT 03778694T AT E421154 T1 ATE421154 T1 AT E421154T1
Authority
AT
Austria
Prior art keywords
electrical conductors
conduct
coated
metallic wire
electric current
Prior art date
Application number
AT03778694T
Other languages
English (en)
Inventor
Paolo Agostinelli
Original Assignee
Paolo Agostinelli
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Paolo Agostinelli filed Critical Paolo Agostinelli
Application granted granted Critical
Publication of ATE421154T1 publication Critical patent/ATE421154T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating With Molten Metal (AREA)
  • Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Valve Device For Special Equipments (AREA)
  • Glass Compositions (AREA)
  • Cable Accessories (AREA)
AT03778694T 2002-12-18 2003-12-17 Elektrische leiter ATE421154T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT002672A ITMI20022672A1 (it) 2002-12-18 2002-12-18 Conduttori elettrici.

Publications (1)

Publication Number Publication Date
ATE421154T1 true ATE421154T1 (de) 2009-01-15

Family

ID=32587869

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03778694T ATE421154T1 (de) 2002-12-18 2003-12-17 Elektrische leiter

Country Status (10)

Country Link
US (1) US7501578B2 (de)
EP (1) EP1581955B1 (de)
JP (1) JP4914009B2 (de)
CN (1) CN100401429C (de)
AT (1) ATE421154T1 (de)
AU (1) AU2003289662A1 (de)
DE (1) DE60325899D1 (de)
DK (1) DK1581955T3 (de)
IT (1) ITMI20022672A1 (de)
WO (1) WO2004055834A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3015762B1 (fr) * 2013-12-19 2017-12-15 Nexans Element electriquement conducteur allonge resistant a l'oxydation
NO349018B1 (en) * 2024-02-20 2025-08-25 Nexans A cable sheath of a tin-antimony alloy

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2744063A (en) * 1951-12-11 1956-05-01 Gen Motors Corp Electrodeposition of tin-antimonycopper alloys
US2774063A (en) * 1954-02-05 1956-12-11 Photocon Res Products Sequential circuit control device
US2950149A (en) * 1957-01-29 1960-08-23 John B Thomson Relatively reciprocable shaft and bearing
US3027269A (en) * 1959-09-09 1962-03-27 Yawata Iron & Steel Co Process for coating ferrous metal with aluminum
DE1957031C3 (de) * 1969-11-13 1974-09-05 Siemens Ag, 1000 Berlin Und 8000 Muenchen Vorrichtung zum Herstellen von Zinn- oder Zinnlegierungsschichten auf Draht aus Kupfer oder Kupferlegierungen durch Feuerverzinnen
FR2472252A1 (fr) * 1979-12-18 1981-06-26 Thomson Brandt Cable electrique multifilaire isole, a conducteurs proteges, soudables et non thermo collants
US4314230A (en) * 1980-07-31 1982-02-02 Raychem Corporation Devices comprising conductive polymers
DD220915A1 (de) 1984-01-20 1985-04-10 Mansfeld Kom W Pieck Fi F Ne M Verfahren zur herstellung von draht aus metallegierungen mit einer solidustemperatur unter 600 k
JPS60253115A (ja) * 1984-05-29 1985-12-13 古河電気工業株式会社 Ｓｎ又はＳｎ合金メツキ導体の製造法
JPS6123737A (ja) 1984-07-09 1986-02-01 Nippon Mining Co Ltd 耐熱性及び導電性に優れた銅合金
JPS61154790A (ja) 1984-12-27 1986-07-14 Toshiba Corp 軸受メタル肉盛溶接用ワイヤ
JPS61190058A (ja) 1985-02-19 1986-08-23 Hitachi Cable Ltd 溶融メツキ方法
CN1005852B (zh) * 1986-10-22 1989-11-22 北京市电信设备厂 电缆护套用多元铅合金和生产方法
JPH03229848A (ja) * 1990-02-05 1991-10-11 Furukawa Electric Co Ltd:The 溶融メッキ線の製造方法
EP0481493B1 (de) 1990-10-18 1996-02-07 Sumitomo Electric Industries, Limited Schmelzleiter
US5491036A (en) * 1992-03-27 1996-02-13 The Louis Berkman Company Coated strip
JP2942458B2 (ja) * 1993-04-16 1999-08-30 住友電気工業株式会社 フラットケーブル用導体の製造方法および製造設備
DE4442186C2 (de) * 1994-11-26 1999-03-04 Glyco Metall Werke Schichtwerkstoff und Verfahren zu seiner Herstellung
JP3353640B2 (ja) * 1997-04-16 2002-12-03 富士電機株式会社 はんだ合金
JPH11211143A (ja) * 1998-01-29 1999-08-06 Matsushita Electric Ind Co Ltd 分離型空気調和装置の電源板
DE69821130T2 (de) * 1998-07-21 2004-11-18 Paolo Agostinelli Kalibriertes verbindungskabel für audiosignale in aufnahme- und wiedergabevorrichtungen
JP2000119602A (ja) * 1998-10-16 2000-04-25 Tomoegawa Paper Co Ltd 線材の繊維状被覆の固定用材料及び固定方法
JP2000156450A (ja) * 1998-11-19 2000-06-06 Hitachi Cable Ltd 電子部品用リード
JP3266242B2 (ja) * 1999-10-12 2002-03-18 理研電線株式会社 錫めっき線の熱酸化黄変防止法
JP3445213B2 (ja) * 2000-02-16 2003-09-08 株式会社タムラ製作所 電源トランス
JP2001262391A (ja) * 2000-03-14 2001-09-26 Ishihara Chem Co Ltd スズ−銅系合金メッキ浴並びに当該皮膜を形成した電子部品

Also Published As

Publication number Publication date
AU2003289662A1 (en) 2004-07-09
JP2006511041A (ja) 2006-03-30
CN100401429C (zh) 2008-07-09
WO2004055834A1 (en) 2004-07-01
EP1581955A1 (de) 2005-10-05
CN1726564A (zh) 2006-01-25
EP1581955B1 (de) 2009-01-14
ITMI20022672A1 (it) 2004-06-19
DK1581955T3 (da) 2009-05-11
US20060054347A1 (en) 2006-03-16
JP4914009B2 (ja) 2012-04-11
US7501578B2 (en) 2009-03-10
DE60325899D1 (de) 2009-03-05

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