ATE422691T1 - Datenträger mit biege- und verwindungsschutz - Google Patents

Datenträger mit biege- und verwindungsschutz

Info

Publication number
ATE422691T1
ATE422691T1 AT01931682T AT01931682T ATE422691T1 AT E422691 T1 ATE422691 T1 AT E422691T1 AT 01931682 T AT01931682 T AT 01931682T AT 01931682 T AT01931682 T AT 01931682T AT E422691 T1 ATE422691 T1 AT E422691T1
Authority
AT
Austria
Prior art keywords
data carrier
module
substrate
bending
cover
Prior art date
Application number
AT01931682T
Other languages
English (en)
Inventor
Marcus Toth
Joachim Schober
Peter Schmallegger
Veronika Sauer
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE422691T1 publication Critical patent/ATE422691T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adornments (AREA)
  • Package Frames And Binding Bands (AREA)
AT01931682T 2000-05-23 2001-05-01 Datenträger mit biege- und verwindungsschutz ATE422691T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00890164 2000-05-23

Publications (1)

Publication Number Publication Date
ATE422691T1 true ATE422691T1 (de) 2009-02-15

Family

ID=8175934

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01931682T ATE422691T1 (de) 2000-05-23 2001-05-01 Datenträger mit biege- und verwindungsschutz

Country Status (8)

Country Link
US (1) US6657294B2 (de)
EP (1) EP1290631B1 (de)
JP (1) JP2003534614A (de)
KR (1) KR100810797B1 (de)
CN (1) CN1193317C (de)
AT (1) ATE422691T1 (de)
DE (1) DE60137628D1 (de)
WO (1) WO2001091047A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2712602C (en) * 2008-02-22 2014-08-05 Toppan Printing Co., Ltd. Transponder and booklet
TWI453677B (zh) * 2011-12-01 2014-09-21 Mutual Pak Technology Co Ltd 射頻識別標籤與具有其之衣物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
DE3689094T2 (de) 1985-07-27 1994-03-10 Dainippon Printing Co Ltd IC-Karte.
JP2502511B2 (ja) * 1986-02-06 1996-05-29 日立マクセル株式会社 半導体装置の製造方法
US5436203A (en) * 1994-07-05 1995-07-25 Motorola, Inc. Shielded liquid encapsulated semiconductor device and method for making the same
TW368745B (en) * 1994-08-15 1999-09-01 Citizen Watch Co Ltd Semiconductor device with IC chip highly secured
CA2192076C (en) * 1995-04-13 2000-01-18 Masao Gogami Ic card and ic module
US6075289A (en) * 1996-10-24 2000-06-13 Tessera, Inc. Thermally enhanced packaged semiconductor assemblies
US6157085A (en) * 1998-04-07 2000-12-05 Citizen Watch Co., Ltd. Semiconductor device for preventing exfoliation from occurring between a semiconductor chip and a resin substrate
US5977626A (en) * 1998-08-12 1999-11-02 Industrial Technology Research Institute Thermally and electrically enhanced PBGA package
DE19844965A1 (de) * 1998-09-30 2000-04-13 Siemens Ag Chipkartenmodul und Chipkarte
US6329228B1 (en) * 1999-04-28 2001-12-11 Citizen Watch Co., Ltd. Semiconductor device and method of fabricating the same

Also Published As

Publication number Publication date
US6657294B2 (en) 2003-12-02
EP1290631B1 (de) 2009-02-11
US20020020900A1 (en) 2002-02-21
KR20020021159A (ko) 2002-03-18
CN1386244A (zh) 2002-12-18
CN1193317C (zh) 2005-03-16
EP1290631A1 (de) 2003-03-12
DE60137628D1 (de) 2009-03-26
JP2003534614A (ja) 2003-11-18
WO2001091047A1 (en) 2001-11-29
KR100810797B1 (ko) 2008-03-06

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties