ATE423227T1 - Vorrichtung zum ätzen einer leitfähigen schicht und ätzverfahren - Google Patents

Vorrichtung zum ätzen einer leitfähigen schicht und ätzverfahren

Info

Publication number
ATE423227T1
ATE423227T1 AT05800584T AT05800584T ATE423227T1 AT E423227 T1 ATE423227 T1 AT E423227T1 AT 05800584 T AT05800584 T AT 05800584T AT 05800584 T AT05800584 T AT 05800584T AT E423227 T1 ATE423227 T1 AT E423227T1
Authority
AT
Austria
Prior art keywords
etching
conductive layer
substrate
nozzles
layer
Prior art date
Application number
AT05800584T
Other languages
English (en)
Inventor
Christophe Mazzara
Jaona Girard
Original Assignee
Saint Gobain
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain filed Critical Saint Gobain
Application granted granted Critical
Publication of ATE423227T1 publication Critical patent/ATE423227T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
AT05800584T 2004-10-19 2005-09-30 Vorrichtung zum ätzen einer leitfähigen schicht und ätzverfahren ATE423227T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0452369A FR2876863B1 (fr) 2004-10-19 2004-10-19 Dispositif de gravure d'une couche conductrice et procede de gravure

Publications (1)

Publication Number Publication Date
ATE423227T1 true ATE423227T1 (de) 2009-03-15

Family

ID=34953197

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05800584T ATE423227T1 (de) 2004-10-19 2005-09-30 Vorrichtung zum ätzen einer leitfähigen schicht und ätzverfahren

Country Status (10)

Country Link
US (1) US20080000873A1 (de)
EP (1) EP1802789B1 (de)
JP (1) JP2008517453A (de)
KR (1) KR20070083726A (de)
CN (1) CN101040067A (de)
AT (1) ATE423227T1 (de)
DE (1) DE602005012851D1 (de)
FR (1) FR2876863B1 (de)
RU (1) RU2007118645A (de)
WO (1) WO2006042985A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7694416B2 (en) * 2006-12-08 2010-04-13 Nitto Denko Corporation Producing method of wired circuit board
CA2760840C (en) 2009-08-24 2014-12-02 Board Of Trustees Of Michigan State University Pretreated densified biomass products and methods of making and using same
WO2011075416A1 (en) * 2009-12-18 2011-06-23 First Solar, Inc. Film removal
DE102010013909A1 (de) * 2010-04-01 2011-10-06 Lp Vermarktungs Gmbh & Co. Kg Vorrichtung und Verfahren zum Besprühen einer Oberfläche eines Substrates
JP2012160709A (ja) * 2011-01-13 2012-08-23 Univ Of Yamanashi 太陽電池用の薄膜形成装置及び薄膜形成方法
SG11201406820TA (en) 2012-04-27 2014-11-27 Michigan Biotechnology Inst D B A Mbi Methods of hydrolyzing pretreated densified biomass particulates and systems related thereto
US10518295B2 (en) * 2012-05-31 2019-12-31 Technical Devices Company Method for containing a fluid volume in an inline conveyorized cleaner for cleaning low standoff components
CN103484860A (zh) * 2012-06-13 2014-01-01 欣兴电子股份有限公司 湿式蚀刻设备及其供应装置
KR102153428B1 (ko) * 2013-02-20 2020-09-08 도오쿄 인스티튜드 오브 테크놀로지 도전성 나노와이어 네트워크 및 이것을 이용한 도전성 기판 및 투명전극, 그리고 그들의 제조 방법
CN104152961B (zh) * 2013-05-14 2016-08-31 欣兴电子股份有限公司 电镀蚀刻系统及电镀蚀刻方法
CN103849923A (zh) * 2014-03-07 2014-06-11 王夔 一种铝合金型材表面图案处理方法
CN105386054B (zh) * 2015-12-08 2018-10-09 赵宗轩 一种涌动式电极制作系统
CN109466092B (zh) * 2018-12-20 2024-06-04 北京大象和他的朋友们科技有限公司 一种避孕套润滑剂快速渗透的装置及方法
KR102048786B1 (ko) * 2019-07-26 2019-11-27 (주)세우인코퍼레이션 유기물 증착 효율을 높일 수 있는 엠보싱 텐션 마스크 제조방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2541675A1 (de) * 1975-09-18 1977-03-24 Siemens Ag Verfahren zum aetzen von zinn- oder indium-dioxyd
US20010008227A1 (en) * 1997-08-08 2001-07-19 Mitsuru Sadamoto Dry etching method of metal oxide/photoresist film laminate
US5976396A (en) * 1998-02-10 1999-11-02 Feldman Technology Corporation Method for etching
FR2775280B1 (fr) * 1998-02-23 2000-04-14 Saint Gobain Vitrage Procede de gravure d'une couche conductrice
JP2000077381A (ja) * 1998-09-02 2000-03-14 Toshiba Corp エッチング方法、エッチング装置、及び分析方法
JP2000195840A (ja) * 1998-12-25 2000-07-14 Fujitsu Ltd エッチング装置及びエッチング方法
JP2001024048A (ja) * 1999-07-08 2001-01-26 Sony Corp エッチング装置
JP2001053053A (ja) * 1999-08-11 2001-02-23 Mitsubishi Heavy Ind Ltd エッチング方法及びエッチング装置
JP2002134471A (ja) * 2000-10-30 2002-05-10 Sony Corp エッチング方法およびエッチング装置
US6699356B2 (en) * 2001-08-17 2004-03-02 Applied Materials, Inc. Method and apparatus for chemical-mechanical jet etching of semiconductor structures
JP2003158113A (ja) * 2001-11-26 2003-05-30 Mitsubishi Electric Corp 半導体装置の製造方法およびエッチング装置
JP3639812B2 (ja) * 2001-12-04 2005-04-20 大日本スクリーン製造株式会社 エッチング方法およびエッチング装置
JP2003234324A (ja) * 2002-02-06 2003-08-22 Mitsubishi Electric Corp 半導体装置の製造方法およびエッチング装置

Also Published As

Publication number Publication date
WO2006042985A1 (fr) 2006-04-27
DE602005012851D1 (de) 2009-04-02
US20080000873A1 (en) 2008-01-03
CN101040067A (zh) 2007-09-19
KR20070083726A (ko) 2007-08-24
EP1802789B1 (de) 2009-02-18
EP1802789A1 (de) 2007-07-04
RU2007118645A (ru) 2008-11-27
FR2876863A1 (fr) 2006-04-21
FR2876863B1 (fr) 2007-01-12
JP2008517453A (ja) 2008-05-22

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Legal Events

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