ATE434836T1 - Elektronisches bauelement für wärmetransport durch verdampfen und kondensation, sowie verfahren zur herstellung. - Google Patents

Elektronisches bauelement für wärmetransport durch verdampfen und kondensation, sowie verfahren zur herstellung.

Info

Publication number
ATE434836T1
ATE434836T1 AT07354044T AT07354044T ATE434836T1 AT E434836 T1 ATE434836 T1 AT E434836T1 AT 07354044 T AT07354044 T AT 07354044T AT 07354044 T AT07354044 T AT 07354044T AT E434836 T1 ATE434836 T1 AT E434836T1
Authority
AT
Austria
Prior art keywords
electronic component
condensation
evaporation
production
heat transport
Prior art date
Application number
AT07354044T
Other languages
English (en)
Inventor
Jean-Antoine Gruss
Marc Plissonnier
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE434836T1 publication Critical patent/ATE434836T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00—Chemistry: analytical and immunological testing
    • Y10T436/11—Automated chemical analysis
    • Y10T436/113332—Automated chemical analysis with conveyance of sample along a test line in a container or rack
    • Y10T436/114998—Automated chemical analysis with conveyance of sample along a test line in a container or rack with treatment or replacement of aspirator element [e.g., cleaning, etc.]

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Formation Of Insulating Films (AREA)
  • Thermistors And Varistors (AREA)
  • Ceramic Capacitors (AREA)
  • Moulding By Coating Moulds (AREA)
AT07354044T 2006-07-20 2007-07-10 Elektronisches bauelement für wärmetransport durch verdampfen und kondensation, sowie verfahren zur herstellung. ATE434836T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0606615A FR2904145B1 (fr) 2006-07-20 2006-07-20 Composant electronique a transfert de chaleur par ebullition et condensation et procede de fabrication

Publications (1)

Publication Number Publication Date
ATE434836T1 true ATE434836T1 (de) 2009-07-15

Family

ID=37946726

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07354044T ATE434836T1 (de) 2006-07-20 2007-07-10 Elektronisches bauelement für wärmetransport durch verdampfen und kondensation, sowie verfahren zur herstellung.

Country Status (7)

Country Link
US (1) US7802437B2 (de)
EP (1) EP1881538B1 (de)
JP (1) JP5042736B2 (de)
AT (1) ATE434836T1 (de)
DE (1) DE602007001366D1 (de)
ES (1) ES2327970T3 (de)
FR (1) FR2904145B1 (de)

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CN102160171B (zh) 2008-08-11 2015-07-22 绿色革命冷却股份有限公司 液体浸没的、水平计算机服务器机架及冷却此种服务器机架的系统和方法
US8278800B2 (en) * 2008-08-21 2012-10-02 Innowattech Ltd. Multi-layer piezoelectric generator
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
US8568027B2 (en) 2009-08-26 2013-10-29 Ut-Battelle, Llc Carbon nanotube temperature and pressure sensors
EP2312661A1 (de) * 2009-10-16 2011-04-20 Alcatel Lucent Thermoelektrische Einheit
US8344597B2 (en) * 2009-10-22 2013-01-01 Lawrence Livermore National Security, Llc Matrix-assisted energy conversion in nanostructured piezoelectric arrays
KR20110064702A (ko) * 2009-12-08 2011-06-15 삼성전자주식회사 요철 구조를 지닌 코어-쉘 나노 와이어 및 이를 이용한 열전 소자
US8642974B2 (en) * 2009-12-30 2014-02-04 Fei Company Encapsulation of electrodes in solid media for use in conjunction with fluid high voltage isolation
IT1398955B1 (it) * 2010-03-22 2013-03-28 Itec Srl Radiatore di tipo alettato
FR2959875B1 (fr) * 2010-05-05 2012-05-18 Commissariat Energie Atomique Dispositif thermoelectrique modulable.
JP5577897B2 (ja) * 2010-07-02 2014-08-27 富士通株式会社 電子デバイスとその製造方法
US9444027B2 (en) * 2011-10-04 2016-09-13 Infineon Technologies Ag Thermoelectrical device and method for manufacturing same
US20140096939A1 (en) * 2012-10-10 2014-04-10 Novel Concepts, Inc. Heat Spreader with Thermal Conductivity Inversely Proportional to Increasing Heat
CN103233966B (zh) * 2012-12-21 2015-06-03 珠海一多监测科技有限公司 具有测温功能的智能螺栓
GB201312535D0 (en) * 2013-07-12 2013-08-28 Europ Thermodynamics Ltd Thermoelectric generator
CN103515524B (zh) * 2013-10-23 2015-08-12 中国科学院半导体研究所 面向片上集成的热电器件制备方法
JP6241201B2 (ja) * 2013-10-29 2017-12-06 富士通株式会社 電子デバイス及びその製造方法
CN103904209B (zh) * 2014-04-18 2016-08-24 中国科学院半导体研究所 基于纳米线的平面热电器件的制备方法
US12523431B2 (en) 2014-09-15 2026-01-13 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
CN109773434A (zh) 2014-09-17 2019-05-21 科罗拉多州立大学董事会法人团体 启用微柱的热接地平面
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US12385697B2 (en) 2014-09-17 2025-08-12 Kelvin Thermal Technologies, Inc. Micropillar-enabled thermal ground plane
US12104856B2 (en) 2016-10-19 2024-10-01 Kelvin Thermal Technologies, Inc. Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems
WO2018089432A1 (en) * 2016-11-08 2018-05-17 Kelvin Thermal Technologies, Inc. Method and device for spreading high heat fluxes in thermal ground planes
WO2018208801A1 (en) 2017-05-08 2018-11-15 Kelvin Thermal Technologies, Inc. Thermal management planes
CN113167546A (zh) 2018-12-11 2021-07-23 开尔文热技术股份有限公司 均热板
US12141508B2 (en) 2020-03-16 2024-11-12 Washington University Systems and methods for forming micropillar array
US11930621B2 (en) 2020-06-19 2024-03-12 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
US11477911B1 (en) * 2021-05-19 2022-10-18 Dell Products L.P. Heat pipe tapered down in fin stack region and oppositely tapered fin stack
US12207445B2 (en) * 2023-01-16 2025-01-21 Amulaire Thermal Technology, Inc. Two-phase immersion-type composite heat dissipation device
US12262511B2 (en) * 2023-01-17 2025-03-25 Amulaire Thermal Technology, Inc. Two-phase immersion-type heat dissipation device having reinforced fins

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Also Published As

Publication number Publication date
EP1881538A1 (de) 2008-01-23
EP1881538B1 (de) 2009-06-24
FR2904145A1 (fr) 2008-01-25
DE602007001366D1 (de) 2009-08-06
ES2327970T3 (es) 2009-11-05
JP2008047892A (ja) 2008-02-28
US20080017356A1 (en) 2008-01-24
US7802437B2 (en) 2010-09-28
FR2904145B1 (fr) 2008-10-17
JP5042736B2 (ja) 2012-10-03

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