ATE435449T1 - Temperatursteuersystem und -verfahren - Google Patents
Temperatursteuersystem und -verfahrenInfo
- Publication number
- ATE435449T1 ATE435449T1 AT05812781T AT05812781T ATE435449T1 AT E435449 T1 ATE435449 T1 AT E435449T1 AT 05812781 T AT05812781 T AT 05812781T AT 05812781 T AT05812781 T AT 05812781T AT E435449 T1 ATE435449 T1 AT E435449T1
- Authority
- AT
- Austria
- Prior art keywords
- control system
- temperature control
- face
- tec
- frame
- Prior art date
Links
- 238000001816 cooling Methods 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Control Of Temperature (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62423604P | 2004-11-02 | 2004-11-02 | |
| PCT/IB2005/053535 WO2006048808A1 (en) | 2004-11-02 | 2005-10-28 | Temperature control system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE435449T1 true ATE435449T1 (de) | 2009-07-15 |
Family
ID=35788702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05812781T ATE435449T1 (de) | 2004-11-02 | 2005-10-28 | Temperatursteuersystem und -verfahren |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20090056914A1 (de) |
| EP (1) | EP1810107B1 (de) |
| JP (1) | JP2008519429A (de) |
| KR (1) | KR20070073842A (de) |
| CN (1) | CN101052931A (de) |
| AT (1) | ATE435449T1 (de) |
| DE (1) | DE602005015245D1 (de) |
| WO (1) | WO2006048808A1 (de) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101470449B (zh) * | 2007-12-28 | 2010-09-29 | 和椿科技股份有限公司 | 散热控制系统及其散热控制方法 |
| JP5713904B2 (ja) * | 2008-09-30 | 2015-05-07 | エーエスエムエル ネザーランズ ビー.ブイ. | 投影システムおよびリソグラフィ装置 |
| US8128188B2 (en) * | 2009-04-30 | 2012-03-06 | Hewlett-Packard Development Company, L.P. | Monitoring ink flow |
| JP5146417B2 (ja) * | 2009-07-10 | 2013-02-20 | トヨタ自動車株式会社 | 露光装置 |
| GB2494880B (en) * | 2011-09-21 | 2018-04-11 | Bae Systems Plc | Layer assembly for heat exchanger |
| US9059130B2 (en) | 2012-12-31 | 2015-06-16 | International Business Machines Corporation | Phase changing on-chip thermal heat sink |
| CN105892517A (zh) * | 2015-01-26 | 2016-08-24 | 中国科学院宁波材料技术与工程研究所 | 温度控制系统 |
| KR102627913B1 (ko) | 2015-07-23 | 2024-01-22 | 세페이드 | 서멀 제어 기기 및 사용 방법 |
| US20160327347A1 (en) * | 2016-07-21 | 2016-11-10 | Eric D. Stanley | Synergistic pairing convective and conductive cooling system and process |
| CN107454813B (zh) * | 2017-09-30 | 2023-05-23 | 中国工程物理研究院应用电子学研究所 | 一种热电制冷复合相变蓄冷的控温冷却装置及其控温方法 |
| US11889664B2 (en) * | 2021-06-24 | 2024-01-30 | Baidu Usa Llc | Thermal management system with phase change and auxiliary cooling systems |
| CH718844A1 (de) | 2021-07-20 | 2023-01-31 | Ziemba Georg | System zur Erzeugung von hohen Temperaturen in einem Reaktor. |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100236506B1 (ko) * | 1990-11-29 | 2000-01-15 | 퍼킨-엘머시터스인스트루먼츠 | 폴리머라제 연쇄 반응 수행 장치 |
| US5564471A (en) * | 1995-01-23 | 1996-10-15 | Dover Corporation | Fuel hose breakaway unit |
| US5695221A (en) * | 1995-10-02 | 1997-12-09 | Dover Corporation | Fuel hose breakaway units |
| US5887435A (en) * | 1995-12-08 | 1999-03-30 | Litton Systems, Inc. | Environmentally protected module |
| US5918469A (en) | 1996-01-11 | 1999-07-06 | Silicon Thermal, Inc. | Cooling system and method of cooling electronic devices |
| KR100331206B1 (ko) * | 1996-11-08 | 2002-04-06 | 구보다 다다시 | 열전냉각 시스템 |
| JP3952325B2 (ja) * | 1997-06-10 | 2007-08-01 | Smc株式会社 | 高速薄板冷却装置 |
| GB2331838A (en) * | 1997-11-24 | 1999-06-02 | Coolbox | Portable,thermoelectric,temperature controlled receptacles. |
| US5931000A (en) * | 1998-04-23 | 1999-08-03 | Turner; William Evans | Cooled electrical system for use downhole |
| US20030205363A1 (en) | 2001-11-09 | 2003-11-06 | International Business Machines Corporation | Enhanced air cooling of electronic devices using fluid phase change heat transfer |
| US6532746B1 (en) * | 2002-01-24 | 2003-03-18 | Tyco Telecommunications (Us) Inc. | Method and apparatus for securing an electronic component |
| US20040002655A1 (en) | 2002-06-27 | 2004-01-01 | Acuson, A Siemens Company | System and method for improved transducer thermal design using thermo-electric cooling |
| AU2003248918A1 (en) | 2002-07-11 | 2004-02-02 | Temptronic Corporation | Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules |
| US6997197B2 (en) * | 2002-12-13 | 2006-02-14 | International Business Machines Corporation | Apparatus and method for rapid thermal control of a workpiece in liquid or dense phase fluid |
| US6809417B1 (en) * | 2003-04-07 | 2004-10-26 | Fairchild Semiconductor Corporation | Power circuitry with a thermionic cooling system |
-
2005
- 2005-10-28 EP EP05812781A patent/EP1810107B1/de not_active Expired - Lifetime
- 2005-10-28 DE DE602005015245T patent/DE602005015245D1/de not_active Expired - Fee Related
- 2005-10-28 WO PCT/IB2005/053535 patent/WO2006048808A1/en not_active Ceased
- 2005-10-28 CN CNA2005800377581A patent/CN101052931A/zh active Pending
- 2005-10-28 JP JP2007538596A patent/JP2008519429A/ja not_active Withdrawn
- 2005-10-28 KR KR1020077009829A patent/KR20070073842A/ko not_active Withdrawn
- 2005-10-28 AT AT05812781T patent/ATE435449T1/de not_active IP Right Cessation
- 2005-10-28 US US11/718,240 patent/US20090056914A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070073842A (ko) | 2007-07-10 |
| DE602005015245D1 (de) | 2009-08-13 |
| WO2006048808A1 (en) | 2006-05-11 |
| CN101052931A (zh) | 2007-10-10 |
| US20090056914A1 (en) | 2009-03-05 |
| JP2008519429A (ja) | 2008-06-05 |
| EP1810107B1 (de) | 2009-07-01 |
| EP1810107A1 (de) | 2007-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2008148042A3 (en) | System and method for distributed thermoelectric heating and cooling | |
| DK1016839T3 (da) | Kølesystem med variabel tilførsel, navnlig til kyogene temperaturer | |
| ATE435449T1 (de) | Temperatursteuersystem und -verfahren | |
| WO2004014169A3 (en) | Temperature regulated clothing | |
| WO2008124087A8 (en) | Heat transfer systems using mixtures of polyols and ionic liquids | |
| DE60001828D1 (de) | Wärmegedämmter behälter | |
| WO2002065029A8 (en) | Improved efficiency thermoelectrics utilizing convective heat flow | |
| WO2008025850A3 (en) | An energy system with a heat pump | |
| TW200634263A (en) | Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics | |
| EP1138942A3 (de) | Mikro-elektro-mechanische Systeme (MEMS) mit thermisch betätigten Biegeelementen die auf Heizern angebracht sind und mit diesen mitbewegen | |
| DE50313308D1 (de) | Stapelbares Modul | |
| SE0702290L (sv) | Anordning vid värmepump | |
| DE60322058D1 (de) | Wärmetauscher | |
| GB9807694D0 (en) | Fluid circuit arrangement | |
| TW200638173A (en) | Temperature control method and temperature control device | |
| MY162297A (en) | Downhole thermal component temperature management system and method | |
| DK1262597T3 (da) | Fremgangsmåde og system til at opvarme en skinne samt skinneelement til brug dermed | |
| NO20031575D0 (no) | Varmevekslerkonstruksjon for höye temperaturer | |
| DE60107119D1 (de) | Thermisch übertragbare zusammensetzungen und verfahren | |
| NO20005974D0 (no) | Kjöle- eller varmepumpesystem med varmeavgivelse ved endring i temperatur | |
| ITMI20020554A1 (it) | Disposizione per lo sgancio termico con compensazione della temperatura | |
| GB0209352D0 (en) | Improved heat exchanger temperature control system | |
| ATE453307T1 (de) | Beheizbare leitung | |
| GB2407300B (en) | Anticipative temperature control for thermal transfer overcoating | |
| FI990576A0 (fi) | Lämmönvaihtimen jäähdytyselementti |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |