US20090056914A1 - Temperature control system and method - Google Patents

Temperature control system and method Download PDF

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Publication number
US20090056914A1
US20090056914A1 US11/718,240 US71824005A US2009056914A1 US 20090056914 A1 US20090056914 A1 US 20090056914A1 US 71824005 A US71824005 A US 71824005A US 2009056914 A1 US2009056914 A1 US 2009056914A1
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US
United States
Prior art keywords
frame
temperature
tec
signal
thermal device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/718,240
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English (en)
Inventor
Theo A.M. Ruijl
Ralph T.H. Maessen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
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Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Priority to US11/718,240 priority Critical patent/US20090056914A1/en
Assigned to KONINKLIJKE PHILIPS ELECTRONICS N V reassignment KONINKLIJKE PHILIPS ELECTRONICS N V ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MAESSEN, RALPH T.H., RUIJL, THEO A.M.
Publication of US20090056914A1 publication Critical patent/US20090056914A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

Definitions

  • This invention relates generally to metrology and manufacturing systems, and more specifically to metrology and manufacturing system temperature control.
  • Metrology systems are increasingly important as component sizes decline and precision requirements increase.
  • the component under test must be held stationary throughout the measurement to provide accurate measurement.
  • the component rests on a metrology frame, which must be dimensionally stable and vibration free to provide a stable geometric reference for the physical measurement. Problems arise, however, when the metrology frame includes or is in contact with a heat source causing thermal expansion in the metrology frame, or includes or is in contact with a vibration source.
  • one approach to maintain the temperature of the metrology frame is to pump fluid at a precisely controlled temperature through holes in the metrology frame.
  • the fluid flow induces vibrations in the metrology system reducing the accuracy. Therefore, it is necessary to trade off temperature control for vibration control.
  • heat sources in or on the metrology frame More than one heat source can be present on or in the metrology frame. This causes complex distortions of the metrology frame, which cannot be accounted for through simple post-measurement correction.
  • the heat production of the heat source can also be a function of time. For example, when the heat source is a drive motor, the drive motor produces the most heat when it is driving, changing temperature as it is turned on and off. Controlling the metrology frame temperature through cooling fluid temperature limits the ability to adapt to such changing conditions. The cooling fluid temperature must also be precisely controlled throughout the measurement to avoid introducing uncertainty.
  • One aspect of the present invention provides a temperature control system for a frame, including a thermal electric cooling (TEC) element having a first face and a second face, the TEC element disposed to form a gap between the first face and the frame, and a fluid heat transfer element thermally connected to the second face.
  • TEC thermal electric cooling
  • a temperature control system for a frame including a thermal electric cooling (TEC) element having a first face and a second face, and a thermal group including a thermal device and a fluid heat transfer element, the thermal device being thermally connected to the fluid heat transfer element, wherein the first face is thermally connected to the frame and the second face is thermally connected to the thermal group.
  • TEC thermal electric cooling
  • TEC thermal electric cooling
  • Another aspect of the present invention provides a method of temperature control for a frame, including providing a thermal electric cooling (TEC) element and a fluid heat transfer element thermally connected to the TEC element, locating the TEC element near the frame to form a gap, and controlling the TEC element to transfer heat across the gap.
  • TEC thermal electric cooling
  • TEC thermal electric cooling
  • FIGS. 1 & 2 are schematic diagrams of a temperature control system employing a gap made in accordance with the present invention
  • FIG. 7 is a schematic diagram of a temperature control system employing a flushable reservoir made in accordance with the present invention.
  • FIG. 8 is a schematic diagram of a temperature control system employing a phase change element made in accordance with the present invention.
  • FIG. 9 is a schematic diagram of an operational control system for a temperature control system made in accordance with the present invention.
  • FIGS. 1 & 2 are schematic diagrams of a temperature control system employing a gap made in accordance with the present invention.
  • the temperature control system is separated from the frame by a gap, which avoids vibration from the temperature control system being transferred to the frame.
  • Heat is exchanged between the temperature control system and the frame across the gap by radiative and/or conductive heat transfer.
  • frame 20 includes a thermal device 22 , such as a heat source or cold source.
  • Temperature control system 30 includes thermal electric cooling (TEC) elements 32 and a fluid heat transfer element 38 .
  • the TEC elements 32 each have a first face 34 disposed toward the frame 20 and a second face 36 thermally connected to the fluid heat transfer element 38 .
  • a temperature controller (not shown) provides a TEC control signal to the TEC elements 32 to control heat transfer across the TEC elements 32 .
  • Temperature sensor 68 thermally connected to the frame 20 provides a measured frame temperature signal to the operational control system.
  • the fluid heat transfer element 38 includes a fluid passage 40 permitting flow of a temperature control fluid, which is controlled by valve 72 .
  • the frame 20 is separated from the temperature control system 30 by gap 50 .
  • a TEC radiative coating 52 and/or a frame radiative coating 54 are disposed on the first face 34 of the TEC elements 32 and/or the frame 20 , respectively, to promote heat transfer across the gap 50 .
  • no radiative coating is used.
  • the frame 20 is any frame for which dimensional stability and freedom from vibration are required, such as a metrology frame, semiconductor wafer stepper, precision milling machine stage, or the like.
  • the thermal device 22 can be associated with operation and control of the frame 20 , such as a motor, drive system, hydraulic lines, or the like.
  • the thermal device 22 can also be a specimen or workpiece being examined or worked on the frame 20 , or heating, cooling, motion, or control equipment associated with the specimen or workpiece.
  • the thermal device 22 can be in direct contact with the frame 20 and exchange heat with the frame 20 by conduction, or can be near the frame 20 and exchange heat with the frame 20 by radiation and/or convection.
  • the TEC elements 32 are thermoelectric coolers, also known as Peltier coolers.
  • the TEC elements 32 act as heat pumps, moving heat from one face to the other in response to a DC current TEC control signal.
  • the direction of heat flow through the TEC elements 32 can be reversed by reversing the polarity of the DC current TEC control signal, providing precise temperature control.
  • a typical TEC element includes semiconductor material between plates forming the faces.
  • the TEC elements 32 can be a single TEC element or a number of individual TEC elements.
  • the gap 50 is of any width permitting radiative heat transfer between the frame 20 and the temperature control system 30 . Avoiding contact between the frame 20 and the temperature control system 30 prevents vibrations from the temperature control system 30 , such as vibrations from the fluid flow through the fluid heat transfer element 38 , from transferring to the frame 20 .
  • the gap 50 can be large or small, as desired. In one embodiment, the gap 50 is about 4 millimeters or larger.
  • the fluid heat transfer element 38 exchanges heat with the TEC elements 32 and transfers the heat to the temperature control fluid flowing through the fluid passage 40 .
  • the fluid heat transfer element 38 can include internal and/or external fins to further promote heat transfer from the temperature control fluid to the fluid heat transfer element 38 or from the fluid heat transfer element 38 to the surrounding environment.
  • the temperature control fluid flowing through the fluid passage 40 can be water, oil, or any other fluid suitable for the temperature range of intended use.
  • the valve 72 such as a stop valve or a flow control valve, controls flow of the temperature control fluid through the fluid passage 40 .
  • the fluid passage 40 can include a flushable reservoir allowing rapid exchange of the temperature control fluid within the flushable reservoir.
  • the flow of the temperature control fluid within the fluid passage 40 can be shut off during the measurement or manufacturing process on the frame 20 to further reduce any disturbances near the frame 20 .
  • the optional TEC radiative coating 52 and frame radiative coating 54 are high emissivity, high thermal conductivity coatings to promote radiative heat transfer between the frame 20 and the temperature control system 30 across the gap 50 .
  • the coatings can be any high emissivity, high conductivity coating, such as those used in vacuum or solar applications, including metallic oxide coatings, glass (Si 0 2) coatings, or ceramic coatings.
  • the coatings are applied directly to the respective faces of the frame 20 and the fluid heat transfer element 38 .
  • the coatings are applied to an additional layer, such as a copper plate, and the additional layer applied to the respective faces of the frame 20 and the fluid heat transfer element 38 .
  • the temperature control system 30 controls the temperature locally by exchanging heat with the thermal device 22 directly.
  • the gap 50 is formed about the thermal device 22 .
  • the TEC radiative coating 52 and/or a frame radiative coating 54 are disposed on the first face 34 of the TEC elements 32 and/or the thermal device 22 , respectively, to promote heat transfer across the gap 50 .
  • the temperature control system 30 exchanges heat with the frame 20 and/or the thermal device 22 to maintain the frame 20 at a constant temperature.
  • the temperature of the frame 20 is held stable to maintain a constant geometry for the frame 20 : the absolute temperature of the frame 20 is not critical.
  • the temperature of the frame 20 is held at the desired temperature required by the process.
  • the temperature sensor 68 thermally connected to the frame 20 provides an indication of the frame temperature.
  • the temperature sensor 68 can be physically located anywhere on the frame 20 or fluid heat transfer element 38 that provides a suitable temperature measurement for the operational control system. As discussed in connection with FIG.
  • control of the heat flow through the TEC elements 32 can use feedback control on temperature error and can optionally use feed forward control anticipating thermal load from the thermal device 22 .
  • the flow rate and/or temperature of the temperature control fluid through the fluid heat transfer element 38 can be varied to provide additional temperature control.
  • FIGS. 3-6 are schematic diagrams of a temperature control system employing a thermal group made in accordance with the present invention.
  • the temperature control system employs a thermal group including a thermal device, which is associated with the frame, and a fluid heat transfer element.
  • temperature control system 30 includes thermal electric cooling (TEC) elements 32 and a thermal group 60 .
  • the TEC elements 32 each have a first face 34 thermally connected to the frame 20 and a second face 36 thermally connected to the thermal group 60 .
  • the thermal group 60 includes a thermal device 22 , such as a heat source or cold source, associated with the frame 20 and a fluid heat transfer element 38 .
  • the thermal device 22 is mechanically connected to the frame 20 , with the TEC elements 32 disposed between the thermal device 22 and the frame 20 in the embodiment illustrated.
  • the thermal device 22 is adjacent to the TEC elements 32
  • the fluid heat transfer element 38 is further away from the frame 20 than the thermal device 22
  • the thermal device 22 is thermally connected to the second face 36 .
  • the fluid heat transfer element 38 is adjacent to the TEC elements 32 , the thermal device 22 is further away from the frame 20 than the fluid heat transfer element 38 , and the fluid heat transfer element 38 is thermally connected to the second face 36 .
  • a temperature controller (not shown) provides a TEC control signal to the TEC elements 32 to control heat transfer across the TEC elements 32 between the frame 20 and the thermal group 60 .
  • the TEC elements 32 provide perfect insulation of the frame 20 by zeroing out heat transfer with the frame 20 .
  • the temperature control system 30 includes mounting pads 62 located between the thermal group 60 and the frame 20 , in parallel with the TEC elements 32 .
  • the mounting pads 62 allow a firm mechanical connection between the thermal group 60 and the frame 20 , while the TEC elements 32 manage heat transfer between the thermal group 60 and the frame 20 .
  • the frame 20 includes an insulating layer 64 and a conducting layer 66 with the conducting layer 66 disposed on the insulating layer 64 .
  • the conducting layer 66 is thermally connected to the first face 34 of the TEC elements 32 .
  • the conducting layer 66 includes a temperature sensor 68 thermally connected to the conducting layer 66 to generate a measured frame temperature signal.
  • the conducting layer 66 provides a homogeneous indication of frame temperature by being highly conductive, better smoothing out local temperature variations.
  • the conducting layer 66 can be any material with high thermal conductivity, such as aluminum, copper, or the like.
  • the insulating layer 64 can be any material with low thermal conductivity, such as plastic, ceramic, foam, or the like.
  • the frame 20 includes the insulating layer 64 and the conducting layer 66 , with mounting pads 62 located between the thermal group 60 and the conducting layer 66 in parallel with the TEC elements 32 .
  • the mounting pads 62 allow a firm mechanical connection between the thermal group 60 and the frame 20 , while the TEC elements 32 manage heat transfer between the thermal group 60 and the frame 20 .
  • FIG. 7 is a schematic diagram of a temperature control system employing a flushable reservoir made in accordance with the present invention.
  • the flushable reservoir allows rapid replacement of the temperature control fluid to provide fresh heat transfer capacity.
  • Temperature control system 30 includes thermal electric cooling (TEC) elements 32 and a fluid heat transfer element 38 .
  • the fluid heat transfer element 38 includes a body 74 and a fluid passage 40 .
  • Flushable reservoir 70 is included in the fluid passage 40 of the fluid heat transfer element 38 and contains the temperature control fluid (not shown).
  • Valve 72 controls the flow through the fluid passage 40 .
  • the heat capacity of the temperature control fluid in the flushable reservoir 70 is larger than the heat capacity of the body 74 of the fluid heat transfer element 38 , so that the temperature control fluid in the flushable reservoir 70 acts as the heat source or heat sink for the TEC elements 32 .
  • the temperature control fluid is flushed from the flushable reservoir 70 and replaced by fresh temperature control fluid, so that the heat source or heat sink is replenished for the next use.
  • the flushable reservoir 70 is filled and the valve 72 is shut to avoid any flow vibrations from the fluid heat transfer element 38 which could be transferred to the frame 20 .
  • the temperature control system 30 exchanges heat with the frame 20 through the TEC elements 32 .
  • the temperature of the temperature control fluid increases or decreases depending on whether the flushable reservoir 70 is a heat sink or heat source.
  • the valve 72 is opened to rapidly flush the temperature control fluid from the flushable reservoir 70 and to provide fresh temperature control fluid.
  • the valve 72 is closed and the fluid heat transfer element 30 is ready for the next use.
  • the flushable reservoir 70 can be used with any of the temperature control systems described herein.
  • FIG. 8 is a schematic diagram of a temperature control system employing a phase change element made in accordance with the present invention.
  • the phase change element acts as a thermal reservoir, allowing flow through the fluid heat transfer element to be shut off when minimal frame vibration is required.
  • Temperature control system 30 includes thermal electric cooling (TEC) elements 32 , phase change element 76 , and fluid heat transfer element 38 .
  • the TEC elements 32 are thermally connected to the frame 20 and the phase change element 76 .
  • the phase change element 76 is thermally connected to the fluid heat transfer element 38 , which includes a fluid passage 40 for flow of a temperature control fluid.
  • Valve 72 controls the flow through the fluid passage 40 .
  • the phase change element 76 includes phase change materials which change phase at or near the operating temperature of the TEC elements 32 .
  • the fluid heat transfer element 38 is included as part of and incorporated within the phase change element 76 to increase the heat transfer between the phase change materials and the temperature control fluid.
  • phase change in the phase change element 76 can be any phase change that absorbs or releases heat as desired for a particular application, such as a solid-liquid transition (heat of fusion), liquid-gas transition (heat of vaporization), or solid-gas transition (heat of sublimation).
  • phase change materials that can be used in the phase change element 76 include water; salt hydrate, such as potassium fluoride tetrahydrate (KF.4H 2 O) or calcium chloride hexahydrate (CaCl 2 .6H 2 O); or a eutectic mixture, such as a salt-water mixture, like a sodium chloride (NaCl)-water mixture.
  • phase change element 76 a number of phase change materials are suitable for use in the phase change element 76 depending on the particular phase change temperature desired.
  • salt hydrate can be used around room temperature and a salt-water eutectic mixture can be used around a low temperature of about ⁇ 20 degrees C.
  • the valve 72 is shut to avoid any flow vibrations from the fluid heat transfer element 38 which could be transferred to the frame 20 .
  • the temperature control system 30 exchanges heat with the frame 20 through the TEC elements 32 .
  • the phase change materials in the phase change element 76 change phase in response to the heat transfer with the TEC elements 32 .
  • the valve 72 is opened to provide temperature control fluid through the fluid passage 40 .
  • the phase change materials return to their initial state and the phase change element 76 is ready for the next use.
  • the phase change element 76 can be used with any of the temperature control systems described herein.
  • FIG. 9 is a schematic diagram of a operational control system for a temperature control system made in accordance with the present invention.
  • the operational control system provides a TEC control signal to the TEC elements to control heat transfer across the TEC elements.
  • the operational control system 100 includes a temperature sensor 68 being thermally connected to the frame and generating a measured frame temperature signal 102 .
  • a number of temperature sensors can be a thermally connected to the frame and their outputs combined so that the measured frame temperature signal indicates an average or weighted average frame temperature.
  • a desired temperature T_set 104 is set manually or determined by another control system and a desired temperature signal 106 generated.
  • the measured frame temperature signal 102 and the desired temperature signal 106 are compared at comparator 108 and a temperature difference signal 110 generated.
  • a temperature controller 112 is responsive to the temperature difference signal 110 and generates a TEC control signal 114 , which controls heat flow through the TEC elements 32 .
  • the temperature controller 112 is additionally responsive to a thermal device signal 118 , providing feed forward control.
  • a thermal device controller 116 controls the thermal device 22 , such as a motor or drive system.
  • the thermal device controller 116 generates the thermal device signal 118 , which is provided to both the thermal device 22 and the temperature controller 112 .
  • the temperature controller 112 adjusts the TEC control signal 114 to anticipate the change in heat load to the frame from any change in operation of the thermal device 22 .
  • the temperature controller 112 can include modeling of the thermal transient response of the frame and the thermal device 22 to account for lag between the control signal and the thermal response.
  • the operational control system 100 can be used with any of the temperature control systems described herein.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US11/718,240 2004-11-02 2005-10-28 Temperature control system and method Abandoned US20090056914A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/718,240 US20090056914A1 (en) 2004-11-02 2005-10-28 Temperature control system and method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62423604P 2004-11-02 2004-11-02
PCT/IB2005/053535 WO2006048808A1 (en) 2004-11-02 2005-10-28 Temperature control system and method
US11/718,240 US20090056914A1 (en) 2004-11-02 2005-10-28 Temperature control system and method

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US20090056914A1 true US20090056914A1 (en) 2009-03-05

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US (1) US20090056914A1 (de)
EP (1) EP1810107B1 (de)
JP (1) JP2008519429A (de)
KR (1) KR20070073842A (de)
CN (1) CN101052931A (de)
AT (1) ATE435449T1 (de)
DE (1) DE602005015245D1 (de)
WO (1) WO2006048808A1 (de)

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US20100277520A1 (en) * 2009-04-30 2010-11-04 Muela David Ramirez Monitoring Ink Flow
US20110170078A1 (en) * 2008-09-30 2011-07-14 Asml Netherlands B.V. Projection System and Lithographic Apparatus
US20140230455A1 (en) * 2011-09-21 2014-08-21 Bae Systems Plc Layer assembly for heat exchanger
US9041195B2 (en) 2012-12-31 2015-05-26 International Business Machines Corporation Phase changing on-chip thermal heat sink
WO2018017805A1 (en) * 2016-07-21 2018-01-25 Stanley Eric D Synergistic pairing convective and conductive cooling system and process

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CN101470449B (zh) * 2007-12-28 2010-09-29 和椿科技股份有限公司 散热控制系统及其散热控制方法
JP5146417B2 (ja) * 2009-07-10 2013-02-20 トヨタ自動車株式会社 露光装置
CN105892517A (zh) * 2015-01-26 2016-08-24 中国科学院宁波材料技术与工程研究所 温度控制系统
US10544966B2 (en) 2015-07-23 2020-01-28 Cepheid Thermal control device and methods of use
CN107454813B (zh) * 2017-09-30 2023-05-23 中国工程物理研究院应用电子学研究所 一种热电制冷复合相变蓄冷的控温冷却装置及其控温方法
US11889664B2 (en) * 2021-06-24 2024-01-30 Baidu Usa Llc Thermal management system with phase change and auxiliary cooling systems
CH718844A1 (de) 2021-07-20 2023-01-31 Ziemba Georg System zur Erzeugung von hohen Temperaturen in einem Reaktor.

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US9164401B2 (en) * 2008-09-30 2015-10-20 Asml Netherlands B.V. Projection system and lithographic apparatus
US20110170078A1 (en) * 2008-09-30 2011-07-14 Asml Netherlands B.V. Projection System and Lithographic Apparatus
US20100277520A1 (en) * 2009-04-30 2010-11-04 Muela David Ramirez Monitoring Ink Flow
US20140230455A1 (en) * 2011-09-21 2014-08-21 Bae Systems Plc Layer assembly for heat exchanger
US9631844B2 (en) * 2011-09-21 2017-04-25 Bae Systems Plc Layer assembly for heat exchanger
US9059130B2 (en) 2012-12-31 2015-06-16 International Business Machines Corporation Phase changing on-chip thermal heat sink
US9287141B2 (en) 2012-12-31 2016-03-15 International Business Machines Corporation Phase changing on-chip thermal heat sink
US9312147B2 (en) 2012-12-31 2016-04-12 International Business Machines Corporation Phase changing on-chip thermal heat sink
US9041195B2 (en) 2012-12-31 2015-05-26 International Business Machines Corporation Phase changing on-chip thermal heat sink
US9704778B2 (en) 2012-12-31 2017-07-11 International Business Machines Corporation Phase changing on-chip thermal heat sink
US9911682B2 (en) 2012-12-31 2018-03-06 International Business Machines Corporation Phase changing on-chip thermal heat sink
US9984954B2 (en) 2012-12-31 2018-05-29 International Business Machines Corporation Phase changing on-chip thermal heat sink
US10032691B2 (en) 2012-12-31 2018-07-24 International Business Machines Corporation Phase changing on-chip thermal heat sink
US10157816B2 (en) 2012-12-31 2018-12-18 International Business Machines Corporation Phase changing on-chip thermal heat sink
US10177071B2 (en) 2012-12-31 2019-01-08 International Business Machines Corporation Phase changing on-chip thermal heat sink
US11004770B2 (en) 2012-12-31 2021-05-11 International Business Machines Corporation Phase changing on-chip thermal heat sink
WO2018017805A1 (en) * 2016-07-21 2018-01-25 Stanley Eric D Synergistic pairing convective and conductive cooling system and process

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Publication number Publication date
JP2008519429A (ja) 2008-06-05
EP1810107A1 (de) 2007-07-25
DE602005015245D1 (de) 2009-08-13
KR20070073842A (ko) 2007-07-10
CN101052931A (zh) 2007-10-10
EP1810107B1 (de) 2009-07-01
WO2006048808A1 (en) 2006-05-11
ATE435449T1 (de) 2009-07-15

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