ATE438287T1 - Für anbringung an einem substrat ausgelegte komponente und verfahren zum anbringen einer oberflächenangebrachten anordnung - Google Patents

Für anbringung an einem substrat ausgelegte komponente und verfahren zum anbringen einer oberflächenangebrachten anordnung

Info

Publication number
ATE438287T1
ATE438287T1 AT06809589T AT06809589T ATE438287T1 AT E438287 T1 ATE438287 T1 AT E438287T1 AT 06809589 T AT06809589 T AT 06809589T AT 06809589 T AT06809589 T AT 06809589T AT E438287 T1 ATE438287 T1 AT E438287T1
Authority
AT
Austria
Prior art keywords
substrate
mounted device
attaching
attachment
component designed
Prior art date
Application number
AT06809589T
Other languages
English (en)
Inventor
Maurice Donners
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE438287T1 publication Critical patent/ATE438287T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10484—Obliquely mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
AT06809589T 2005-10-21 2006-10-13 Für anbringung an einem substrat ausgelegte komponente und verfahren zum anbringen einer oberflächenangebrachten anordnung ATE438287T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05109811 2005-10-21
PCT/IB2006/053768 WO2007046045A2 (en) 2005-10-21 2006-10-13 A component adapted for being mounted on a substrate and a method of mounting a surface mounted device

Publications (1)

Publication Number Publication Date
ATE438287T1 true ATE438287T1 (de) 2009-08-15

Family

ID=37872435

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06809589T ATE438287T1 (de) 2005-10-21 2006-10-13 Für anbringung an einem substrat ausgelegte komponente und verfahren zum anbringen einer oberflächenangebrachten anordnung

Country Status (8)

Country Link
US (1) US8045334B2 (de)
EP (1) EP1943888B1 (de)
KR (1) KR101242653B1 (de)
CN (1) CN101292576B (de)
AT (1) ATE438287T1 (de)
DE (1) DE602006008173D1 (de)
TW (1) TW200738088A (de)
WO (1) WO2007046045A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITPD20080068A1 (it) * 2008-02-26 2009-08-27 Easy Internat S R L Lampada a led e metodo per la sua progettazione
US20120176785A1 (en) * 2011-01-10 2012-07-12 GEM-SUN Technologies Co., Ltd. Structure improvement of led lamp
KR102127688B1 (ko) * 2013-12-19 2020-06-29 어플라이드 머티어리얼스, 인코포레이티드 교체가능한 램프를 위한 어댑터
EP2938170A1 (de) * 2014-04-23 2015-10-28 odelo GmbH Halter für SMD-Leuchtdiode
CN104486900A (zh) * 2014-11-07 2015-04-01 广东风华高新科技股份有限公司 用于电路板的支撑件及其制备方法
CN110165036B (zh) * 2019-04-15 2021-11-09 深圳技术大学 一种新型表贴发光器件
US10952324B2 (en) * 2019-04-15 2021-03-16 Facebook Technologies, Llc Spacer for surface mountable electronic components
CN112018594A (zh) * 2020-07-31 2020-12-01 深圳市聚飞光电股份有限公司 一种光源投射器及其制作方法
TWI778835B (zh) * 2021-10-21 2022-09-21 隆達電子股份有限公司 電子元件連接基座以及使用此電子元件連接基座製成之電子裝置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5118300A (en) * 1991-05-23 1992-06-02 Amp Incorporated Active electrical connector
JPH0542718A (ja) 1991-08-09 1993-02-23 Ricoh Co Ltd 半導体発光装置
US5277612A (en) * 1992-04-21 1994-01-11 Chrysler Corporation Carrier for guiding and supporting semiconductor devices
JPH0715021A (ja) * 1993-06-18 1995-01-17 Hitachi Ltd 半導体受光装置
JP2001094146A (ja) 1999-09-21 2001-04-06 Rohm Co Ltd 発光素子およびその製造方法
EP1376782B1 (de) * 2001-04-03 2009-09-02 Kureha Corporation Ic-fassung
JP2002329893A (ja) 2001-05-02 2002-11-15 Kansai Tlo Kk Ｌｅｄ面発光装置
JP2003264299A (ja) * 2002-03-11 2003-09-19 Honda Motor Co Ltd 受光装置、発光装置及び光無線通信装置
JP2004146571A (ja) 2002-10-24 2004-05-20 Sharp Corp 複合半導体基板および半導体装置および複合半導体基板の製造方法
JP4069771B2 (ja) * 2003-03-17 2008-04-02 セイコーエプソン株式会社 半導体装置、電子機器および半導体装置の製造方法
DE10345632B4 (de) * 2003-09-29 2006-01-05 Siemens Ag Anordnung mit einem Sensor
US7201507B2 (en) 2003-12-25 2007-04-10 Ichikoh Industries, Ltd. Projector type vehicle light
US8376578B2 (en) * 2009-06-12 2013-02-19 Lg Innotek Co., Ltd. Lighting device

Also Published As

Publication number Publication date
WO2007046045A3 (en) 2007-07-12
DE602006008173D1 (de) 2009-09-10
US20080314624A1 (en) 2008-12-25
KR20080059319A (ko) 2008-06-26
EP1943888B1 (de) 2009-07-29
KR101242653B1 (ko) 2013-03-19
CN101292576A (zh) 2008-10-22
JP2009512979A (ja) 2009-03-26
WO2007046045A2 (en) 2007-04-26
JP5011303B2 (ja) 2012-08-29
EP1943888A2 (de) 2008-07-16
US8045334B2 (en) 2011-10-25
TW200738088A (en) 2007-10-01
CN101292576B (zh) 2012-05-02

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