ATE441211T1 - Nichtflüchtige integrierte mehrzustands- speichersysteme, die dielektrische speicherelemente verwenden - Google Patents
Nichtflüchtige integrierte mehrzustands- speichersysteme, die dielektrische speicherelemente verwendenInfo
- Publication number
- ATE441211T1 ATE441211T1 AT07002288T AT07002288T ATE441211T1 AT E441211 T1 ATE441211 T1 AT E441211T1 AT 07002288 T AT07002288 T AT 07002288T AT 07002288 T AT07002288 T AT 07002288T AT E441211 T1 ATE441211 T1 AT E441211T1
- Authority
- AT
- Austria
- Prior art keywords
- integrated multi
- volatile integrated
- dielectric
- memory elements
- state memory
- Prior art date
Links
- 239000003989 dielectric material Substances 0.000 abstract 2
- 238000009792 diffusion process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5671—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge trapping in an insulator
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
- H10D30/691—IGFETs having charge trapping gate insulators, e.g. MNOS transistors having more than two programming levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
- H10D30/694—IGFETs having charge trapping gate insulators, e.g. MNOS transistors characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
- G11C16/0475—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS] comprising two or more independent storage sites which store independent data
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0491—Virtual ground arrays
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2216/00—Indexing scheme relating to G11C16/00 and subgroups, for features not directly covered by these groups
- G11C2216/02—Structural aspects of erasable programmable read-only memories
- G11C2216/06—Floating gate cells in which the floating gate consists of multiple isolated silicon islands, e.g. nanocrystals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/002,696 US6897522B2 (en) | 2001-10-31 | 2001-10-31 | Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements |
| US10/161,235 US20030080370A1 (en) | 2001-10-31 | 2002-05-31 | Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements |
| US10/280,352 US6925007B2 (en) | 2001-10-31 | 2002-10-25 | Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE441211T1 true ATE441211T1 (de) | 2009-09-15 |
Family
ID=21702020
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07002289T ATE493763T1 (de) | 2001-10-31 | 2002-10-31 | Nichtflüchtige integrierte mehrzustands- speichersysteme, die dielektrische speicherelemente verwenden |
| AT07002288T ATE441211T1 (de) | 2001-10-31 | 2002-10-31 | Nichtflüchtige integrierte mehrzustands- speichersysteme, die dielektrische speicherelemente verwenden |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07002289T ATE493763T1 (de) | 2001-10-31 | 2002-10-31 | Nichtflüchtige integrierte mehrzustands- speichersysteme, die dielektrische speicherelemente verwenden |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6897522B2 (de) |
| JP (1) | JP4846979B2 (de) |
| KR (1) | KR101124259B1 (de) |
| CN (1) | CN101140799B (de) |
| AT (2) | ATE493763T1 (de) |
| DE (2) | DE60233533D1 (de) |
| TW (3) | TWI344195B (de) |
Families Citing this family (43)
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| US6925007B2 (en) * | 2001-10-31 | 2005-08-02 | Sandisk Corporation | Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements |
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| JP2003309194A (ja) * | 2002-04-18 | 2003-10-31 | Nec Electronics Corp | 半導体記憶装置とその製造方法 |
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| JP4412903B2 (ja) * | 2002-06-24 | 2010-02-10 | 株式会社ルネサステクノロジ | 半導体装置 |
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| JP5558695B2 (ja) * | 2008-11-18 | 2014-07-23 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| TWI473253B (zh) * | 2010-04-07 | 2015-02-11 | 旺宏電子股份有限公司 | 具有連續電荷儲存介電堆疊的非揮發記憶陣列 |
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| US9548448B1 (en) | 2015-11-12 | 2017-01-17 | Avalanche Technology, Inc. | Memory device with increased separation between memory elements |
| US10431576B1 (en) * | 2018-04-20 | 2019-10-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory cell array and method of manufacturing same |
| US11744065B2 (en) | 2021-09-22 | 2023-08-29 | International Business Machines Corporation | Read-only memory for chip security that is MOSFET process compatible |
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2001
- 2001-10-31 US US10/002,696 patent/US6897522B2/en not_active Expired - Lifetime
-
2002
- 2002-05-31 US US10/161,235 patent/US20030080370A1/en not_active Abandoned
- 2002-10-30 TW TW096151683A patent/TWI344195B/zh not_active IP Right Cessation
- 2002-10-30 TW TW091132182A patent/TWI318786B/zh not_active IP Right Cessation
- 2002-10-30 TW TW096151684A patent/TWI351699B/zh not_active IP Right Cessation
- 2002-10-31 JP JP2003541063A patent/JP4846979B2/ja not_active Expired - Fee Related
- 2002-10-31 CN CN2007101358023A patent/CN101140799B/zh not_active Expired - Lifetime
- 2002-10-31 DE DE60233533T patent/DE60233533D1/de not_active Expired - Lifetime
- 2002-10-31 DE DE60238796T patent/DE60238796D1/de not_active Expired - Lifetime
- 2002-10-31 KR KR1020097025906A patent/KR101124259B1/ko not_active Expired - Lifetime
- 2002-10-31 AT AT07002289T patent/ATE493763T1/de not_active IP Right Cessation
- 2002-10-31 AT AT07002288T patent/ATE441211T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200924117A (en) | 2009-06-01 |
| DE60233533D1 (de) | 2009-10-08 |
| US20030082871A1 (en) | 2003-05-01 |
| JP4846979B2 (ja) | 2011-12-28 |
| DE60238796D1 (de) | 2011-02-10 |
| TWI351699B (en) | 2011-11-01 |
| TW200923943A (en) | 2009-06-01 |
| TWI344195B (en) | 2011-06-21 |
| CN101140799B (zh) | 2011-06-08 |
| CN101140799A (zh) | 2008-03-12 |
| TWI318786B (en) | 2009-12-21 |
| ATE493763T1 (de) | 2011-01-15 |
| US6897522B2 (en) | 2005-05-24 |
| US20030080370A1 (en) | 2003-05-01 |
| KR20100006170A (ko) | 2010-01-18 |
| TW200406887A (en) | 2004-05-01 |
| JP2005508094A (ja) | 2005-03-24 |
| KR101124259B1 (ko) | 2012-04-24 |
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