ATE442673T1 - Verfahren zur herstellung von tansistoren - Google Patents
Verfahren zur herstellung von tansistorenInfo
- Publication number
- ATE442673T1 ATE442673T1 AT03747596T AT03747596T ATE442673T1 AT E442673 T1 ATE442673 T1 AT E442673T1 AT 03747596 T AT03747596 T AT 03747596T AT 03747596 T AT03747596 T AT 03747596T AT E442673 T1 ATE442673 T1 AT E442673T1
- Authority
- AT
- Austria
- Prior art keywords
- aperture
- tansistors
- producing
- substrate
- features
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/221—Changing the shape of the active layer in the devices, e.g. patterning by lift-off techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/211—Fullerenes, e.g. C60
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/311—Phthalocyanine
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/69398—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides the material having a perovskite structure, e.g. BaTiO3
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/943—Movable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/944—Shadow
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Physics & Mathematics (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/137,562 US6667215B2 (en) | 2002-05-02 | 2002-05-02 | Method of making transistors |
| PCT/US2003/012022 WO2003094219A1 (en) | 2002-05-02 | 2003-04-17 | Method of making transistors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE442673T1 true ATE442673T1 (de) | 2009-09-15 |
Family
ID=29269106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03747596T ATE442673T1 (de) | 2002-05-02 | 2003-04-17 | Verfahren zur herstellung von tansistoren |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6667215B2 (de) |
| EP (1) | EP1502295B1 (de) |
| JP (1) | JP4426438B2 (de) |
| KR (1) | KR20040105251A (de) |
| CN (1) | CN100372082C (de) |
| AT (1) | ATE442673T1 (de) |
| AU (1) | AU2003226425A1 (de) |
| DE (1) | DE60329177D1 (de) |
| WO (1) | WO2003094219A1 (de) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6821348B2 (en) * | 2002-02-14 | 2004-11-23 | 3M Innovative Properties Company | In-line deposition processes for circuit fabrication |
| US20030151118A1 (en) * | 2002-02-14 | 2003-08-14 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
| US6897164B2 (en) * | 2002-02-14 | 2005-05-24 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
| ES2284738T3 (es) * | 2002-03-19 | 2007-11-16 | Scheuten Glasgroep | Conexion en serie autoajustable de capas delgadas y gruesas y procedimiento de fabricacion. |
| EP1357602A1 (de) * | 2002-03-19 | 2003-10-29 | Scheuten Glasgroep | Selbstjustierende Serienverschaltung von Dünnschichten und Verfahren zur Herstellung |
| DE10212878B4 (de) * | 2002-03-22 | 2007-11-29 | Qimonda Ag | Halbleiterschaltungsanordnung und Halbleiterspeichereinrichtung |
| US6784017B2 (en) * | 2002-08-12 | 2004-08-31 | Precision Dynamics Corporation | Method of creating a high performance organic semiconductor device |
| JP2004319964A (ja) * | 2003-03-28 | 2004-11-11 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| US7556982B2 (en) * | 2003-08-07 | 2009-07-07 | Uchicago Argonne, Llc | Method to grow pure nanocrystalline diamond films at low temperatures and high deposition rates |
| US7459839B2 (en) * | 2003-12-05 | 2008-12-02 | Zhidan Li Tolt | Low voltage electron source with self aligned gate apertures, and luminous display using the electron source |
| US7078937B2 (en) | 2003-12-17 | 2006-07-18 | 3M Innovative Properties Company | Logic circuitry powered by partially rectified ac waveform |
| US7772063B2 (en) * | 2004-08-11 | 2010-08-10 | Identifi Technologies, Inc. | Reduced-step CMOS processes for low-cost radio frequency identification devices |
| KR101090250B1 (ko) * | 2004-10-15 | 2011-12-06 | 삼성전자주식회사 | 유기 반도체를 이용한 박막 트랜지스터 표시판 및 그 제조방법 |
| ATE518259T1 (de) * | 2004-11-09 | 2011-08-15 | Creator Technology Bv | Selbstausgerichtetes verfahren zur herstellung organischer transistoren |
| US20060105550A1 (en) * | 2004-11-17 | 2006-05-18 | Manish Sharma | Method of depositing material on a substrate for a device |
| DE102004059467A1 (de) * | 2004-12-10 | 2006-07-20 | Polyic Gmbh & Co. Kg | Gatter aus organischen Feldeffekttransistoren |
| US20060128165A1 (en) * | 2004-12-13 | 2006-06-15 | 3M Innovative Properties Company | Method for patterning surface modification |
| JP4938984B2 (ja) * | 2005-02-02 | 2012-05-23 | 独立行政法人理化学研究所 | トップコンタクト型電界効果トランジスタの製造方法およびトップコンタクト型電界効果トランジスタ |
| KR20060104092A (ko) * | 2005-03-29 | 2006-10-09 | 삼성전자주식회사 | 유기 박막 트랜지스터 표시판 및 그 제조 방법 |
| US7410907B2 (en) * | 2005-03-31 | 2008-08-12 | Lucent Technologies Inc. | Fabricating integrated devices using embedded masks |
| EP1727219B1 (de) | 2005-05-25 | 2014-05-07 | Samsung SDI Germany GmbH | Organischer Dünnschichttransistor und Verfahren zu seiner Herstellung |
| US7615501B2 (en) * | 2005-08-11 | 2009-11-10 | 3M Innovative Properties Company | Method for making a thin film layer |
| JP5078246B2 (ja) * | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
| US8414962B2 (en) | 2005-10-28 | 2013-04-09 | The Penn State Research Foundation | Microcontact printed thin film capacitors |
| JP4722679B2 (ja) * | 2005-11-11 | 2011-07-13 | 日本電信電話株式会社 | 電極の製造方法及び素子の製造方法 |
| US20080187651A1 (en) * | 2006-10-24 | 2008-08-07 | 3M Innovative Properties Company | Conductive ink formulations |
| US20080171422A1 (en) * | 2007-01-11 | 2008-07-17 | Tokie Jeffrey H | Apparatus and methods for fabrication of thin film electronic devices and circuits |
| US7960708B2 (en) * | 2007-03-13 | 2011-06-14 | University Of Houston | Device and method for manufacturing a particulate filter with regularly spaced micropores |
| JP4531850B2 (ja) * | 2007-03-23 | 2010-08-25 | パイオニア株式会社 | 有機トランジスタ及びその製造方法 |
| WO2009005902A1 (en) * | 2007-06-28 | 2009-01-08 | 3M Innovative Properties Company | Method for forming gate structures |
| US20090111086A1 (en) * | 2007-10-18 | 2009-04-30 | Katz Howard E | Kit for facile deposition and evaluation of semiconductor devices |
| KR20100054630A (ko) * | 2008-11-14 | 2010-05-25 | 엘지디스플레이 주식회사 | 유기 박막 트랜지스터와 이의 제조방법 그리고 이를 이용한표시장치 |
| US9625878B2 (en) | 2009-03-10 | 2017-04-18 | Drexel University | Dynamic time multiplexing fabrication of holographic polymer dispersed liquid crystals for increased wavelength sensitivity |
| CN102379042B (zh) * | 2009-04-10 | 2015-04-29 | 三菱化学株式会社 | 场效应晶体管、其制造方法以及使用了该场效应晶体管的电子器件 |
| US9752932B2 (en) * | 2010-03-10 | 2017-09-05 | Drexel University | Tunable electro-optic filter stack |
| EP2657960A1 (de) * | 2010-12-22 | 2013-10-30 | Mitsubishi Chemical Corporation | Feldeffekttransistor, verfahren zu seiner herstellung und elektronische vorrichtung damit |
| US9144490B2 (en) * | 2012-04-30 | 2015-09-29 | California Institute Of Technology | High-lead count implant device and method of making the same |
| US10008443B2 (en) | 2012-04-30 | 2018-06-26 | California Institute Of Technology | Implant device |
| US9781842B2 (en) | 2013-08-05 | 2017-10-03 | California Institute Of Technology | Long-term packaging for the protection of implant electronics |
| US10274819B2 (en) * | 2015-02-05 | 2019-04-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | EUV pellicle fabrication methods and structures thereof |
| WO2017040302A1 (en) * | 2015-08-28 | 2017-03-09 | California Institute Of Technology | Implant device and method of making the same |
| CN108735915B (zh) * | 2017-04-14 | 2021-02-09 | 上海视涯技术有限公司 | 用于oled蒸镀的荫罩及其制作方法、oled面板的制作方法 |
| JP2019533761A (ja) * | 2017-09-27 | 2019-11-21 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板をマスクするためのマスク装置、基板を処理するための装置、およびその方法 |
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| GB9817745D0 (en) | 1998-08-15 | 1998-10-14 | Philips Electronics Nv | Manufacture of electronic devices comprising thin-film circuit elements |
| JP2000132762A (ja) | 1998-10-27 | 2000-05-12 | Matsushita Electric Works Ltd | 受光量表示ユニット付き光電式分離型感知器及び波形確認端子ユニット付き光電式分離型感知器 |
| US6384529B2 (en) | 1998-11-18 | 2002-05-07 | Eastman Kodak Company | Full color active matrix organic electroluminescent display panel having an integrated shadow mask |
| JP4948726B2 (ja) | 1999-07-21 | 2012-06-06 | イー インク コーポレイション | 電子ディスプレイを制御するための電子回路素子を作製する好適な方法 |
| JP4053209B2 (ja) | 2000-05-01 | 2008-02-27 | 三星エスディアイ株式会社 | 有機elディスプレイの製造方法 |
| JP2002050764A (ja) * | 2000-08-02 | 2002-02-15 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタ、アレイ基板、液晶表示装置、有機el表示装置およびその製造方法 |
| US6791258B2 (en) | 2001-06-21 | 2004-09-14 | 3M Innovative Properties Company | Organic light emitting full color display panel |
| US20030097010A1 (en) | 2001-09-27 | 2003-05-22 | Vogel Dennis E. | Process for preparing pentacene derivatives |
| ATE331304T1 (de) | 2001-09-27 | 2006-07-15 | 3M Innovative Properties Co | Halbleiter auf basis von substituiertem pentacen |
| US20030151118A1 (en) | 2002-02-14 | 2003-08-14 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
| US6897164B2 (en) | 2002-02-14 | 2005-05-24 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
| US6821348B2 (en) | 2002-02-14 | 2004-11-23 | 3M Innovative Properties Company | In-line deposition processes for circuit fabrication |
-
2002
- 2002-05-02 US US10/137,562 patent/US6667215B2/en not_active Expired - Fee Related
-
2003
- 2003-04-17 AT AT03747596T patent/ATE442673T1/de not_active IP Right Cessation
- 2003-04-17 WO PCT/US2003/012022 patent/WO2003094219A1/en not_active Ceased
- 2003-04-17 DE DE60329177T patent/DE60329177D1/de not_active Expired - Lifetime
- 2003-04-17 JP JP2004502343A patent/JP4426438B2/ja not_active Expired - Fee Related
- 2003-04-17 CN CNB038098725A patent/CN100372082C/zh not_active Expired - Fee Related
- 2003-04-17 KR KR10-2004-7017661A patent/KR20040105251A/ko not_active Withdrawn
- 2003-04-17 AU AU2003226425A patent/AU2003226425A1/en not_active Abandoned
- 2003-04-17 EP EP03747596A patent/EP1502295B1/de not_active Expired - Lifetime
- 2003-11-21 US US10/719,209 patent/US6806520B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN100372082C (zh) | 2008-02-27 |
| WO2003094219A1 (en) | 2003-11-13 |
| DE60329177D1 (de) | 2009-10-22 |
| US20040106262A1 (en) | 2004-06-03 |
| US6806520B2 (en) | 2004-10-19 |
| EP1502295B1 (de) | 2009-09-09 |
| US20030207505A1 (en) | 2003-11-06 |
| CN1650409A (zh) | 2005-08-03 |
| KR20040105251A (ko) | 2004-12-14 |
| JP2005531131A (ja) | 2005-10-13 |
| US6667215B2 (en) | 2003-12-23 |
| EP1502295A1 (de) | 2005-02-02 |
| JP4426438B2 (ja) | 2010-03-03 |
| AU2003226425A1 (en) | 2003-11-17 |
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| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |