JPS5462984A - Masking deposition method - Google Patents

Masking deposition method

Info

Publication number
JPS5462984A
JPS5462984A JP11594878A JP11594878A JPS5462984A JP S5462984 A JPS5462984 A JP S5462984A JP 11594878 A JP11594878 A JP 11594878A JP 11594878 A JP11594878 A JP 11594878A JP S5462984 A JPS5462984 A JP S5462984A
Authority
JP
Japan
Prior art keywords
substrate
incidence
angle
mask
evaporated material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11594878A
Other languages
Japanese (ja)
Inventor
Koichi Inoue
Tomiro Yasuda
Masao Funiyu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11594878A priority Critical patent/JPS5462984A/en
Publication of JPS5462984A publication Critical patent/JPS5462984A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE:To obtain a product of improved pattern preciseness in a good yield, by controlling angle of incidence of evaporated material, which is to be deposited on the substrate, between the evaporation source and the mask placed on the substrate. CONSTITUTION:In depositing metal 3 in vacuum on a substrate 1 through a metal mask 2, evaporated material is made to fall upon the substrate 1 with its angle of incidence controlled. The angle of incidence is controlled by the incidence of the evaporated material through a cylinder 5 or a slit 6 placed between the mask 2 and evaporation source 3. The cylinder 5 or the slit 6 may be remolved together with the substrate 1, or allowed to stand still. This method effects deposition with excellent pattern preciseness even when plural substrates are subjected to simultaneous masking deposition while the substrates revolving.
JP11594878A 1978-09-22 1978-09-22 Masking deposition method Pending JPS5462984A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11594878A JPS5462984A (en) 1978-09-22 1978-09-22 Masking deposition method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11594878A JPS5462984A (en) 1978-09-22 1978-09-22 Masking deposition method

Publications (1)

Publication Number Publication Date
JPS5462984A true JPS5462984A (en) 1979-05-21

Family

ID=14675115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11594878A Pending JPS5462984A (en) 1978-09-22 1978-09-22 Masking deposition method

Country Status (1)

Country Link
JP (1) JPS5462984A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131134A (en) * 1988-11-12 1990-05-18 Shinku Yakin Kk Organic ultrafine particle production equipment
JPH04116925A (en) * 1990-09-07 1992-04-17 Kanegafuchi Chem Ind Co Ltd Method for forming patterning thin film and substrate-retention tool used for it
US6667215B2 (en) * 2002-05-02 2003-12-23 3M Innovative Properties Method of making transistors
JP2004103269A (en) * 2002-09-05 2004-04-02 Sanyo Electric Co Ltd Manufacture method for organic electroluminescence display device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49118681A (en) * 1973-03-02 1974-11-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49118681A (en) * 1973-03-02 1974-11-13

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131134A (en) * 1988-11-12 1990-05-18 Shinku Yakin Kk Organic ultrafine particle production equipment
JPH04116925A (en) * 1990-09-07 1992-04-17 Kanegafuchi Chem Ind Co Ltd Method for forming patterning thin film and substrate-retention tool used for it
US6667215B2 (en) * 2002-05-02 2003-12-23 3M Innovative Properties Method of making transistors
JP2004103269A (en) * 2002-09-05 2004-04-02 Sanyo Electric Co Ltd Manufacture method for organic electroluminescence display device

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