ATE442766T1 - Vorrichtung zur befestigung eines elektrischen bauteils auf einer leiterplatte - Google Patents

Vorrichtung zur befestigung eines elektrischen bauteils auf einer leiterplatte

Info

Publication number
ATE442766T1
ATE442766T1 AT06122447T AT06122447T ATE442766T1 AT E442766 T1 ATE442766 T1 AT E442766T1 AT 06122447 T AT06122447 T AT 06122447T AT 06122447 T AT06122447 T AT 06122447T AT E442766 T1 ATE442766 T1 AT E442766T1
Authority
AT
Austria
Prior art keywords
circuit board
circuit component
attachment member
fastening
circuit
Prior art date
Application number
AT06122447T
Other languages
English (en)
Inventor
Geoffrey Kerr
Original Assignee
Delphi Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Tech Inc filed Critical Delphi Tech Inc
Application granted granted Critical
Publication of ATE442766T1 publication Critical patent/ATE442766T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10606—Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AT06122447T 2006-10-17 2006-10-17 Vorrichtung zur befestigung eines elektrischen bauteils auf einer leiterplatte ATE442766T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06122447A EP1915043B1 (de) 2006-10-17 2006-10-17 Vorrichtung zur Befestigung eines elektrischen Bauteils auf einer Leiterplatte

Publications (1)

Publication Number Publication Date
ATE442766T1 true ATE442766T1 (de) 2009-09-15

Family

ID=37969937

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06122447T ATE442766T1 (de) 2006-10-17 2006-10-17 Vorrichtung zur befestigung eines elektrischen bauteils auf einer leiterplatte

Country Status (4)

Country Link
US (1) US20080086867A1 (de)
EP (1) EP1915043B1 (de)
AT (1) ATE442766T1 (de)
DE (1) DE602006009121D1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113948319B (zh) * 2021-09-15 2023-07-21 南京高喜电子科技有限公司 一种用于集成电路板电解电容器包胶设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4630875A (en) * 1984-07-02 1986-12-23 Amp Incorporated Chip carrier socket which requires low insertion force for the chip carrier
JPS63124556A (ja) * 1986-11-14 1988-05-28 Hitachi Ltd 半導体パツケ−ジ
US5612513A (en) * 1995-09-19 1997-03-18 Micron Communications, Inc. Article and method of manufacturing an enclosed electrical circuit using an encapsulant
GB9703306D0 (en) * 1997-02-18 1997-04-09 Integrated Optical Components Carriers for optical components and methods of using the same
US6809937B2 (en) * 2001-11-16 2004-10-26 Hewlett-Packard Development Company, L.P. Method and apparatus for shock and vibration isolation of a circuit component
US6594151B2 (en) * 2001-12-05 2003-07-15 Intel Corporation Frame support for a printed board assembly
US7146721B2 (en) * 2004-03-15 2006-12-12 Delphi Technologies, Inc. Method of manufacturing a sealed electronic module
US7652892B2 (en) * 2006-03-03 2010-01-26 Kingston Technology Corporation Waterproof USB drives and method of making

Also Published As

Publication number Publication date
DE602006009121D1 (de) 2009-10-22
EP1915043A1 (de) 2008-04-23
EP1915043B1 (de) 2009-09-09
US20080086867A1 (en) 2008-04-17

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Legal Events

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