ATE446667T1 - Verfahren zur herstellung eines substrats - Google Patents

Verfahren zur herstellung eines substrats

Info

Publication number
ATE446667T1
ATE446667T1 AT02768784T AT02768784T ATE446667T1 AT E446667 T1 ATE446667 T1 AT E446667T1 AT 02768784 T AT02768784 T AT 02768784T AT 02768784 T AT02768784 T AT 02768784T AT E446667 T1 ATE446667 T1 AT E446667T1
Authority
AT
Austria
Prior art keywords
substrate
another
producing
conductive material
vias
Prior art date
Application number
AT02768784T
Other languages
English (en)
Inventor
Shaun Pendo
Rajiv Shah
Edward Chernoff
Original Assignee
Medtronic Minimed Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Medtronic Minimed Inc filed Critical Medtronic Minimed Inc
Priority claimed from PCT/US2002/028020 external-priority patent/WO2003023388A1/en
Application granted granted Critical
Publication of ATE446667T1 publication Critical patent/ATE446667T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
AT02768784T 2001-09-07 2002-09-04 Verfahren zur herstellung eines substrats ATE446667T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US31805501P 2001-09-07 2001-09-07
US3827601A 2001-12-31 2001-12-31
PCT/US2002/028020 WO2003023388A1 (en) 2001-09-07 2002-09-04 Sensor substrate and method of fabricating same

Publications (1)

Publication Number Publication Date
ATE446667T1 true ATE446667T1 (de) 2009-11-15

Family

ID=32473896

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02768784T ATE446667T1 (de) 2001-09-07 2002-09-04 Verfahren zur herstellung eines substrats

Country Status (6)

Country Link
EP (1) EP1436605B1 (de)
JP (1) JP2005502403A (de)
AT (1) ATE446667T1 (de)
AU (1) AU2002331796A1 (de)
CA (2) CA2776343A1 (de)
DE (1) DE60234113D1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10004433B2 (en) * 2014-07-07 2018-06-26 Verily Life Sciences Llc Electrochemical sensor chip
JP7564251B2 (ja) * 2020-06-10 2024-10-08 アボット ダイアベティス ケア インコーポレイテッド 一つ以上の検出促進強化を備える被検物質センサ
CN116314142B (zh) * 2023-05-08 2023-07-21 粤芯半导体技术股份有限公司 薄膜器件性能测试结构、测试方法及测试结构的制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5821011A (en) * 1989-10-11 1998-10-13 Medtronic, Inc. Body implanted device with electrical feedthrough
JP2501492B2 (ja) * 1991-03-08 1996-05-29 日本碍子株式会社 セラミックス基板およびその製造方法
JP2559977B2 (ja) * 1992-07-29 1996-12-04 インターナショナル・ビジネス・マシーンズ・コーポレイション バイアに係るクラックを除去する方法及び構造、並びに、半導体セラミックパッケージ基板。
JP2756223B2 (ja) * 1993-07-02 1998-05-25 株式会社三協精機製作所 基板の貫通電極
US5569958A (en) * 1994-05-26 1996-10-29 Cts Corporation Electrically conductive, hermetic vias and their use in high temperature chip packages
US5683758A (en) * 1995-12-18 1997-11-04 Lucent Technologies Inc. Method of forming vias
JPH1140911A (ja) * 1997-07-17 1999-02-12 Alps Electric Co Ltd プリント基板
US6259937B1 (en) * 1997-09-12 2001-07-10 Alfred E. Mann Foundation Implantable substrate sensor
DE19742072B4 (de) * 1997-09-24 2005-11-24 Robert Bosch Gmbh Verfahren zur Herstellung druckdichter Durchkontaktierungen

Also Published As

Publication number Publication date
CA2459401C (en) 2013-11-26
JP2005502403A (ja) 2005-01-27
AU2002331796A1 (en) 2003-03-24
EP1436605A4 (de) 2006-10-04
CA2776343A1 (en) 2003-03-20
EP1436605B1 (de) 2009-10-21
EP1436605A1 (de) 2004-07-14
DE60234113D1 (de) 2009-12-03
CA2459401A1 (en) 2003-03-20

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ATE446667T1 (de) Verfahren zur herstellung eines substrats

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties