ATE448507T1 - Verfahren zur herstellung eines stempel für mikro/nano imprint-lithographie - Google Patents

Verfahren zur herstellung eines stempel für mikro/nano imprint-lithographie

Info

Publication number
ATE448507T1
ATE448507T1 AT06021860T AT06021860T ATE448507T1 AT E448507 T1 ATE448507 T1 AT E448507T1 AT 06021860 T AT06021860 T AT 06021860T AT 06021860 T AT06021860 T AT 06021860T AT E448507 T1 ATE448507 T1 AT E448507T1
Authority
AT
Austria
Prior art keywords
micro
imprint lithography
stamp
nano imprint
resist
Prior art date
Application number
AT06021860T
Other languages
English (en)
Inventor
Jun-Ho Jeong
Young-Suk Sim
Kin-Don Kim
Dae-Geun Choi
Eung-Sug Lee
Original Assignee
Korea Mach & Materials Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Mach & Materials Inst filed Critical Korea Mach & Materials Inst
Application granted granted Critical
Publication of ATE448507T1 publication Critical patent/ATE448507T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3406—Carbon, e.g. diamond-like carbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/887—Nanoimprint lithography, i.e. nanostamp

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
AT06021860T 2005-10-18 2006-10-18 Verfahren zur herstellung eines stempel für mikro/nano imprint-lithographie ATE448507T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050098080A KR100772639B1 (ko) 2005-10-18 2005-10-18 다이아몬드상 카본 박막을 이용한 미세 임프린트리소그래피용 스탬프 및 그 제조방법

Publications (1)

Publication Number Publication Date
ATE448507T1 true ATE448507T1 (de) 2009-11-15

Family

ID=37814633

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06021860T ATE448507T1 (de) 2005-10-18 2006-10-18 Verfahren zur herstellung eines stempel für mikro/nano imprint-lithographie

Country Status (6)

Country Link
US (1) US7914693B2 (de)
EP (1) EP1785770B1 (de)
JP (1) JP2007116163A (de)
KR (1) KR100772639B1 (de)
AT (1) ATE448507T1 (de)
DE (1) DE602006010307D1 (de)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007320142A (ja) * 2006-05-31 2007-12-13 Meisho Kiko Kk ナノインプリント用モールド
KR100889814B1 (ko) * 2006-07-25 2009-03-20 삼성전자주식회사 스탬퍼 및 그 제조방법과 스탬퍼를 이용한 기판의 임프린팅공정
JP4858030B2 (ja) * 2006-09-13 2012-01-18 凸版印刷株式会社 インプリント用モールド、インプリント用モールド製造方法およびパターン形成方法
US7776628B2 (en) * 2006-11-16 2010-08-17 International Business Machines Corporation Method and system for tone inverting of residual layer tolerant imprint lithography
EP2163367A4 (de) * 2007-06-04 2011-03-23 Maruzen Petrochem Co Ltd Form, mikroverarbeiteter artikel und deren herstellungsverfahren
JP2009045817A (ja) * 2007-08-20 2009-03-05 Shineisha:Kk 凹版および凹版の製造方法
CN101118378B (zh) * 2007-08-22 2010-08-25 武汉工程大学 金刚石表面图形化的制备方法
US8470701B2 (en) * 2008-04-03 2013-06-25 Advanced Diamond Technologies, Inc. Printable, flexible and stretchable diamond for thermal management
US8343362B2 (en) * 2008-12-22 2013-01-01 Kabushiki Kaisha Toshiba Stamper manufacturing method
JP5305388B2 (ja) * 2009-01-16 2013-10-02 トーメイダイヤ株式会社 スタンパ用表面材
JP4575497B2 (ja) * 2009-01-23 2010-11-04 株式会社東芝 スタンパの製造方法
JP5027182B2 (ja) * 2009-04-01 2012-09-19 トーカロ株式会社 インプリント用型材の製造方法およびインプリント用型材
NL2005263A (en) 2009-09-29 2011-03-30 Asml Netherlands Bv Imprint lithography.
KR20120079734A (ko) * 2011-01-05 2012-07-13 삼성전자주식회사 나노임프린트용 스탬프 제조방법
KR101069545B1 (ko) 2011-06-20 2011-10-05 한국기계연구원 임프린트 리소그래피용 유연스탬프 제조 장치 및 제조 방법
US20150318475A1 (en) * 2011-09-01 2015-11-05 Guobiao Zhang Imprinted Memory
US20130056798A1 (en) * 2011-09-01 2013-03-07 Chengdu Haicun Ip Technology Llc Three-Dimensional Printed Memory
US20170110463A1 (en) * 2011-09-01 2017-04-20 Chengdu Haicun Ip Technology Llc Imprinted Memory
US20150117599A1 (en) 2013-10-31 2015-04-30 Sigray, Inc. X-ray interferometric imaging system
US9623590B2 (en) * 2012-01-27 2017-04-18 Asahi Kasei E-Materials Corporation Fine concavo-convex structure product, heat-reactive resist material for dry etching, mold manufacturing method and mold
JP6015140B2 (ja) * 2012-06-01 2016-10-26 大日本印刷株式会社 ナノインプリントモールドおよびその製造方法
CN103436853B (zh) * 2013-09-04 2016-03-16 苏州锦元纳米科技有限公司 掺氟类金刚石薄膜、其制备方法及包含该薄膜的压印模板
US10295485B2 (en) 2013-12-05 2019-05-21 Sigray, Inc. X-ray transmission spectrometer system
US10269528B2 (en) 2013-09-19 2019-04-23 Sigray, Inc. Diverging X-ray sources using linear accumulation
US10297359B2 (en) 2013-09-19 2019-05-21 Sigray, Inc. X-ray illumination system with multiple target microstructures
US9390881B2 (en) 2013-09-19 2016-07-12 Sigray, Inc. X-ray sources using linear accumulation
US9449781B2 (en) 2013-12-05 2016-09-20 Sigray, Inc. X-ray illuminators with high flux and high flux density
US9448190B2 (en) 2014-06-06 2016-09-20 Sigray, Inc. High brightness X-ray absorption spectroscopy system
US9570265B1 (en) 2013-12-05 2017-02-14 Sigray, Inc. X-ray fluorescence system with high flux and high flux density
USRE48612E1 (en) 2013-10-31 2021-06-29 Sigray, Inc. X-ray interferometric imaging system
US10304580B2 (en) 2013-10-31 2019-05-28 Sigray, Inc. Talbot X-ray microscope
US9823203B2 (en) 2014-02-28 2017-11-21 Sigray, Inc. X-ray surface analysis and measurement apparatus
US9594036B2 (en) 2014-02-28 2017-03-14 Sigray, Inc. X-ray surface analysis and measurement apparatus
JP6167967B2 (ja) * 2014-03-31 2017-07-26 株式会社島津製作所 紫外線照射装置及びこれを備えた分析装置
US10401309B2 (en) 2014-05-15 2019-09-03 Sigray, Inc. X-ray techniques using structured illumination
US10352880B2 (en) 2015-04-29 2019-07-16 Sigray, Inc. Method and apparatus for x-ray microscopy
US10295486B2 (en) 2015-08-18 2019-05-21 Sigray, Inc. Detector for X-rays with high spatial and high spectral resolution
US10247683B2 (en) 2016-12-03 2019-04-02 Sigray, Inc. Material measurement techniques using multiple X-ray micro-beams
WO2018175570A1 (en) 2017-03-22 2018-09-27 Sigray, Inc. Method of performing x-ray spectroscopy and x-ray absorption spectrometer system
US11261085B2 (en) * 2017-05-03 2022-03-01 Nanotech Security Corp. Methods for micro and nano fabrication by selective template removal
US10578566B2 (en) 2018-04-03 2020-03-03 Sigray, Inc. X-ray emission spectrometer system
KR102314284B1 (ko) 2018-05-30 2021-10-19 주식회사 엘지화학 임프린팅용 포토마스크 및 이의 제조방법
JP7195341B2 (ja) 2018-06-04 2022-12-23 シグレイ、インコーポレイテッド 波長分散型ｘ線分光計
US10649119B2 (en) 2018-07-16 2020-05-12 Facebook Technologies, Llc Duty cycle, depth, and surface energy control in nano fabrication
DE112019003777B4 (de) 2018-07-26 2025-09-11 Sigray, Inc. Röntgenreflexionsquelle mit hoher helligkeit
US10656105B2 (en) 2018-08-06 2020-05-19 Sigray, Inc. Talbot-lau x-ray source and interferometric system
CN112638261B (zh) 2018-09-04 2025-06-27 斯格瑞公司 利用滤波的x射线荧光的系统和方法
CN112823280B (zh) 2018-09-07 2024-11-05 斯格瑞公司 用于深度可选x射线分析的系统和方法
CN109683445A (zh) * 2019-01-10 2019-04-26 京东方科技集团股份有限公司 一种纳米图案的拼接方法、纳米压印板、光栅及制作方法
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
JP7403961B2 (ja) * 2019-03-19 2023-12-25 キオクシア株式会社 インプリント方法および半導体装置の製造方法
IT201900006740A1 (it) * 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
US11550083B2 (en) 2019-06-26 2023-01-10 Meta Platforms Technologies, Llc Techniques for manufacturing slanted structures
CN110456611A (zh) * 2019-09-02 2019-11-15 无锡微视传感科技有限公司 纳米压印模板及制作方法
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
CN112951707A (zh) * 2019-12-11 2021-06-11 株洲中车时代电气股份有限公司 一种薄膜及其制备方法和应用
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
CN112011784B (zh) * 2020-06-29 2022-09-20 南方科技大学 一种有序图案化多孔金刚石薄膜及其制备方法和用途
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods
CN114551702B (zh) * 2022-02-25 2025-02-21 连云港杰瑞电子有限公司 一种led灯散热器、该散热器的制作方法及led灯

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2800274B2 (ja) 1989-06-16 1998-09-21 日本電気株式会社 スタンパ
JP3189347B2 (ja) * 1991-12-24 2001-07-16 住友電気工業株式会社 樹脂用金型と樹脂用金型の製造方法および樹脂の成形方法
JPH1096808A (ja) 1996-09-24 1998-04-14 Nippon Telegr & Teleph Corp <Ntt> 微細パタン形成法
JP3062163B2 (ja) * 1998-12-01 2000-07-10 キヤノン販売株式会社 半導体装置及び半導体装置の膜の形成方法
AU2905901A (en) * 1999-11-30 2001-06-12 Regents Of The University Of California, The Method for producing fluorinated diamond-like carbon films
CN100472330C (zh) 2002-01-25 2009-03-25 捷时雅株式会社 双层层叠物及使用它的构图方法
JP2004130775A (ja) 2002-08-09 2004-04-30 Maxell Hi Tec Ltd 射出成形装置およびそれに用いる構成部材ならびに表面処理方法
JP2004164689A (ja) * 2002-11-08 2004-06-10 Ricoh Co Ltd ダイレクトマスタリングの基板の製造方法、ダイレクトマスタリングの基板、及びスタンパの製造方法
US6858909B2 (en) * 2002-11-29 2005-02-22 International Business Machines Corporation CMP assisted liftoff micropatterning
KR100488049B1 (ko) 2003-01-16 2005-05-06 엘지전자 주식회사 나노 임프린트 제조 방법
JP2004311713A (ja) 2003-04-07 2004-11-04 Mitsubishi Electric Corp 半導体装置製造用モールド
JP2005047080A (ja) * 2003-07-31 2005-02-24 Alps Electric Co Ltd 微細凹凸面を有する樹脂製光学部品成形用型及びこれを用いた樹脂製光学部品の製造方法
US20050084804A1 (en) 2003-10-16 2005-04-21 Molecular Imprints, Inc. Low surface energy templates
JP4257848B2 (ja) 2003-12-26 2009-04-22 独立行政法人産業技術総合研究所 金型及びその製造方法
US7309515B2 (en) 2004-02-04 2007-12-18 Industrial Technology Research Institute Method for fabricating an imprint mold structure
JP2006032423A (ja) 2004-07-12 2006-02-02 Toshiba Corp インプリント加工用スタンパーおよびその製造方法
US7186574B2 (en) * 2004-09-30 2007-03-06 Hitachi Global Storage Technologies Netherlands B.V. CMP process metrology test structures

Also Published As

Publication number Publication date
US7914693B2 (en) 2011-03-29
DE602006010307D1 (de) 2009-12-24
US20070158872A1 (en) 2007-07-12
EP1785770A3 (de) 2007-07-11
EP1785770A2 (de) 2007-05-16
JP2007116163A (ja) 2007-05-10
EP1785770B1 (de) 2009-11-11
KR20070042309A (ko) 2007-04-23
KR100772639B1 (ko) 2007-11-02

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