ATE450908T1 - Elektronische baugruppe mit abgewinkelten federteilen - Google Patents

Elektronische baugruppe mit abgewinkelten federteilen

Info

Publication number
ATE450908T1
ATE450908T1 AT04718075T AT04718075T ATE450908T1 AT E450908 T1 ATE450908 T1 AT E450908T1 AT 04718075 T AT04718075 T AT 04718075T AT 04718075 T AT04718075 T AT 04718075T AT E450908 T1 ATE450908 T1 AT E450908T1
Authority
AT
Austria
Prior art keywords
electronic assembly
spring parts
angled spring
arrays
directions
Prior art date
Application number
AT04718075T
Other languages
English (en)
Inventor
Brian Deford
Donald Tran
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE450908T1 publication Critical patent/ATE450908T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board

Landscapes

  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Multi-Conductor Connections (AREA)
  • Springs (AREA)
AT04718075T 2003-04-09 2004-03-05 Elektronische baugruppe mit abgewinkelten federteilen ATE450908T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/410,733 US7121838B2 (en) 2003-04-09 2003-04-09 Electronic assembly having angled spring portions
PCT/US2004/006879 WO2004095898A2 (en) 2003-04-09 2004-03-05 An electronic assembly having angled spring portions

Publications (1)

Publication Number Publication Date
ATE450908T1 true ATE450908T1 (de) 2009-12-15

Family

ID=33130832

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04718075T ATE450908T1 (de) 2003-04-09 2004-03-05 Elektronische baugruppe mit abgewinkelten federteilen

Country Status (7)

Country Link
US (1) US7121838B2 (de)
EP (1) EP1611644B1 (de)
CN (1) CN100533865C (de)
AT (1) ATE450908T1 (de)
DE (1) DE602004024379D1 (de)
TW (1) TWI242311B (de)
WO (1) WO2004095898A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050112959A1 (en) * 2003-11-20 2005-05-26 Kuang-Chih Lai Large elastic momentum conduction member of IC device socket
TWM373059U (en) * 2009-05-18 2010-01-21 Hon Hai Prec Ind Co Ltd Electrical connector
CN202009091U (zh) * 2010-12-07 2011-10-12 富士康(昆山)电脑接插件有限公司 电连接器
US9076698B2 (en) * 2012-10-23 2015-07-07 Intel Corporation Flexible package-to-socket interposer
US8961193B2 (en) 2012-12-12 2015-02-24 Intel Corporation Chip socket including a circular contact pattern
JP7523748B2 (ja) * 2020-09-23 2024-07-29 株式会社リコー 基板ユニット、着脱ユニット、及び、画像形成装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US6330164B1 (en) 1985-10-18 2001-12-11 Formfactor, Inc. Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device
US4927369A (en) 1989-02-22 1990-05-22 Amp Incorporated Electrical connector for high density usage
US6528984B2 (en) * 1996-09-13 2003-03-04 Ibm Corporation Integrated compliant probe for wafer level test and burn-in
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US6315576B1 (en) 1997-10-30 2001-11-13 Intercon Systems, Inc. Interposer assembly
US6132220A (en) 1999-08-11 2000-10-17 Hon Hai Precision Ind. Co., Ltd. Land grid array socket
JP4579361B2 (ja) 1999-09-24 2010-11-10 軍生 木本 接触子組立体
US6604950B2 (en) * 2001-04-26 2003-08-12 Teledyne Technologies Incorporated Low pitch, high density connector
US6585527B2 (en) * 2001-05-31 2003-07-01 Samtec, Inc. Compliant connector for land grid array
TW520087U (en) * 2001-12-26 2003-02-01 Hon Hai Prec Ind Co Ltd Socket connector
US7044746B2 (en) 2002-10-16 2006-05-16 Tyco Electronics Corporation Separable interface electrical connector having opposing contacts
TW542444U (en) * 2002-10-18 2003-07-11 Hon Hai Prec Ind Co Ltd Electrical contact
US20040102066A1 (en) 2002-11-21 2004-05-27 Fci Americas Technology, Inc. Electrical connector with deflectable contacts and fusible elements

Also Published As

Publication number Publication date
HK1077931A1 (en) 2006-02-24
EP1611644B1 (de) 2009-12-02
WO2004095898A3 (en) 2005-05-26
US20040203261A1 (en) 2004-10-14
CN1802777A (zh) 2006-07-12
CN100533865C (zh) 2009-08-26
DE602004024379D1 (de) 2010-01-14
WO2004095898A2 (en) 2004-11-04
TW200507354A (en) 2005-02-16
EP1611644A2 (de) 2006-01-04
US7121838B2 (en) 2006-10-17
TWI242311B (en) 2005-10-21

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties