ATE453135T1 - Lichtempfindliche polyzyclische copolymere enthaltende zusammensetzungen - Google Patents

Lichtempfindliche polyzyclische copolymere enthaltende zusammensetzungen

Info

Publication number
ATE453135T1
ATE453135T1 AT03762871T AT03762871T ATE453135T1 AT E453135 T1 ATE453135 T1 AT E453135T1 AT 03762871 T AT03762871 T AT 03762871T AT 03762871 T AT03762871 T AT 03762871T AT E453135 T1 ATE453135 T1 AT E453135T1
Authority
AT
Austria
Prior art keywords
copolymers
compositions containing
noc
photosensitive compositions
group
Prior art date
Application number
AT03762871T
Other languages
English (en)
Inventor
Edmund Elce
Takashi Hirano
Jeffrey Krotine
Larry Rhodes
Brian Goodall
Saikumar Jayaraman
Chris Mcdougal
Shenliang Sun
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Application granted granted Critical
Publication of ATE453135T1 publication Critical patent/ATE453135T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymerisation Methods In General (AREA)
  • Silicon Polymers (AREA)
AT03762871T 2002-07-03 2003-07-02 Lichtempfindliche polyzyclische copolymere enthaltende zusammensetzungen ATE453135T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39372602P 2002-07-03 2002-07-03
US10/465,511 US7022790B2 (en) 2002-07-03 2003-06-19 Photosensitive compositions based on polycyclic polymers
PCT/JP2003/008407 WO2004006020A1 (en) 2002-07-03 2003-07-02 Photosensitive compositions based on polycyclic polymers

Publications (1)

Publication Number Publication Date
ATE453135T1 true ATE453135T1 (de) 2010-01-15

Family

ID=30118385

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03762871T ATE453135T1 (de) 2002-07-03 2003-07-02 Lichtempfindliche polyzyclische copolymere enthaltende zusammensetzungen

Country Status (11)

Country Link
US (2) US7022790B2 (de)
EP (1) EP1532486B1 (de)
JP (1) JP4623419B2 (de)
KR (1) KR100688632B1 (de)
CN (2) CN102298265B (de)
AT (1) ATE453135T1 (de)
AU (1) AU2003243013A1 (de)
DE (1) DE60330672D1 (de)
MY (1) MY142759A (de)
TW (2) TWI398459B (de)
WO (1) WO2004006020A1 (de)

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Also Published As

Publication number Publication date
TWI398459B (zh) 2013-06-11
TW200835710A (en) 2008-09-01
KR100688632B1 (ko) 2007-03-02
US20040039153A1 (en) 2004-02-26
US8114948B2 (en) 2012-02-14
US20060167197A1 (en) 2006-07-27
US7022790B2 (en) 2006-04-04
MY142759A (en) 2010-12-31
DE60330672D1 (de) 2010-02-04
KR20050033565A (ko) 2005-04-12
EP1532486B1 (de) 2009-12-23
JP2005531680A (ja) 2005-10-20
CN1666150A (zh) 2005-09-07
EP1532486A1 (de) 2005-05-25
WO2004006020A1 (en) 2004-01-15
CN102298265A (zh) 2011-12-28
TWI300167B (en) 2008-08-21
AU2003243013A1 (en) 2004-01-23
JP4623419B2 (ja) 2011-02-02
TW200412472A (en) 2004-07-16
CN102298265B (zh) 2014-04-16

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