ATE454430T1 - Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung - Google Patents

Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung

Info

Publication number
ATE454430T1
ATE454430T1 AT07791537T AT07791537T ATE454430T1 AT E454430 T1 ATE454430 T1 AT E454430T1 AT 07791537 T AT07791537 T AT 07791537T AT 07791537 T AT07791537 T AT 07791537T AT E454430 T1 ATE454430 T1 AT E454430T1
Authority
AT
Austria
Prior art keywords
organopolysiloxane composition
curable organopolysiloxane
silicon
organopolysiloxane
semiconductor device
Prior art date
Application number
AT07791537T
Other languages
English (en)
Inventor
Tomoko Kato
Yoshitsugu Morita
Shinichi Yamamoto
Toshio Saruyama
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE454430T1 publication Critical patent/ATE454430T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
AT07791537T 2006-08-25 2007-07-24 Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung ATE454430T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006229551A JP5148088B2 (ja) 2006-08-25 2006-08-25 硬化性オルガノポリシロキサン組成物および半導体装置
PCT/JP2007/064843 WO2008023537A1 (en) 2006-08-25 2007-07-24 Curable orgnopolysiloxane composition and semiconductor device

Publications (1)

Publication Number Publication Date
ATE454430T1 true ATE454430T1 (de) 2010-01-15

Family

ID=38596765

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07791537T ATE454430T1 (de) 2006-08-25 2007-07-24 Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung

Country Status (10)

Country Link
US (1) US8217388B2 (de)
EP (1) EP2061840B1 (de)
JP (1) JP5148088B2 (de)
KR (1) KR101408711B1 (de)
CN (1) CN101506309B (de)
AT (1) ATE454430T1 (de)
DE (1) DE602007004235D1 (de)
MY (1) MY145422A (de)
TW (1) TWI398488B (de)
WO (1) WO2008023537A1 (de)

Cited By (2)

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US9593277B2 (en) 2014-02-04 2017-03-14 Dow Corning Toray Co., Ltd. Curable silicone composition, cured product therefrom, and optical semiconductor device
US9944759B2 (en) 2014-02-04 2018-04-17 Dow Corning Toray Co., Ltd. Curable silicone composition, cured product therefrom, and optical semiconductor device

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JP5920766B2 (ja) 2010-12-22 2016-05-18 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱硬化型ポリオルガノシロキサン組成物及びその使用
JP5522111B2 (ja) 2011-04-08 2014-06-18 信越化学工業株式会社 シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
EP2707417A4 (de) 2011-05-11 2015-01-07 Henkel China Co Ltd Silikonharz mit verbesserten barriereeigenschaften
JPWO2012157330A1 (ja) * 2011-05-17 2014-07-31 積水化学工業株式会社 光半導体装置用封止剤及び光半導体装置
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KR102071013B1 (ko) 2012-05-14 2020-01-29 모멘티브 퍼포먼스 머티리얼즈 인크. 고굴절률 물질
JP5819787B2 (ja) * 2012-07-19 2015-11-24 信越化学工業株式会社 硬化性シリコーン樹脂組成物
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9593277B2 (en) 2014-02-04 2017-03-14 Dow Corning Toray Co., Ltd. Curable silicone composition, cured product therefrom, and optical semiconductor device
US9944759B2 (en) 2014-02-04 2018-04-17 Dow Corning Toray Co., Ltd. Curable silicone composition, cured product therefrom, and optical semiconductor device

Also Published As

Publication number Publication date
TW200811244A (en) 2008-03-01
JP5148088B2 (ja) 2013-02-20
EP2061840A1 (de) 2009-05-27
MY145422A (en) 2012-02-15
KR20090054429A (ko) 2009-05-29
WO2008023537A1 (en) 2008-02-28
CN101506309B (zh) 2012-03-21
US20100301377A1 (en) 2010-12-02
CN101506309A (zh) 2009-08-12
KR101408711B1 (ko) 2014-06-17
TWI398488B (zh) 2013-06-11
EP2061840B1 (de) 2010-01-06
JP2008050494A (ja) 2008-03-06
US8217388B2 (en) 2012-07-10
DE602007004235D1 (de) 2010-02-25

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