ATE455160T1 - Schlammzusammensetzung für das sekundärpolieren eines siliziumwafers - Google Patents

Schlammzusammensetzung für das sekundärpolieren eines siliziumwafers

Info

Publication number
ATE455160T1
ATE455160T1 AT03812702T AT03812702T ATE455160T1 AT E455160 T1 ATE455160 T1 AT E455160T1 AT 03812702 T AT03812702 T AT 03812702T AT 03812702 T AT03812702 T AT 03812702T AT E455160 T1 ATE455160 T1 AT E455160T1
Authority
AT
Austria
Prior art keywords
weight
secondary polishing
silicon wafer
sludge composition
composition
Prior art date
Application number
AT03812702T
Other languages
English (en)
Inventor
hyun Roh
Tae Park
Kill Lee
In Lee
Original Assignee
Cheil Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cheil Ind Inc filed Critical Cheil Ind Inc
Application granted granted Critical
Publication of ATE455160T1 publication Critical patent/ATE455160T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Silicon Compounds (AREA)
AT03812702T 2002-12-09 2003-07-30 Schlammzusammensetzung für das sekundärpolieren eines siliziumwafers ATE455160T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2002-0077860A KR100516886B1 (ko) 2002-12-09 2002-12-09 실리콘 웨이퍼의 최종 연마용 슬러리 조성물
PCT/KR2003/001532 WO2004053968A1 (en) 2002-12-09 2003-07-30 Slurry composition for secondary polishing of silicon wafer

Publications (1)

Publication Number Publication Date
ATE455160T1 true ATE455160T1 (de) 2010-01-15

Family

ID=36165413

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03812702T ATE455160T1 (de) 2002-12-09 2003-07-30 Schlammzusammensetzung für das sekundärpolieren eines siliziumwafers

Country Status (9)

Country Link
US (1) US7534277B2 (de)
EP (1) EP1570512B1 (de)
JP (1) JP4220966B2 (de)
KR (1) KR100516886B1 (de)
CN (1) CN100490082C (de)
AT (1) ATE455160T1 (de)
DE (1) DE60330994D1 (de)
TW (1) TWI243849B (de)
WO (1) WO2004053968A1 (de)

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TWI593864B (zh) * 2011-11-11 2017-08-01 Sumco Corp Semiconductor manufacturing plant
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CN102766408B (zh) * 2012-06-28 2014-05-28 深圳市力合材料有限公司 一种适用于低下压力的硅晶片精抛光组合液及其制备方法
JP5460827B2 (ja) * 2012-11-14 2014-04-02 株式会社フジミインコーポレーテッド シリコンウエハの製造方法
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JP6314019B2 (ja) * 2014-03-31 2018-04-18 ニッタ・ハース株式会社 半導体基板の研磨方法
JP6259723B2 (ja) 2014-06-18 2018-01-10 株式会社フジミインコーポレーテッド シリコンウェーハの研磨方法、研磨用組成物および研磨用組成物セット
CN105448689B (zh) * 2014-08-07 2018-09-21 中芯国际集成电路制造(上海)有限公司 一种半导体器件的制造方法和电子装置
JP6206360B2 (ja) * 2014-08-29 2017-10-04 株式会社Sumco シリコンウェーハの研磨方法
TWI595081B (zh) * 2016-04-29 2017-08-11 臺灣永光化學工業股份有限公司 用於拋光藍寶石基板之研磨組成物和拋光藍寶石基板之方法
CN107398780B (zh) * 2016-05-18 2020-03-31 上海新昇半导体科技有限公司 一种晶圆的双面抛光方法
CN109971358A (zh) * 2017-12-27 2019-07-05 安集微电子（上海）有限公司 一种化学机械抛光液
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CN115662877B (zh) * 2022-09-08 2023-08-04 东海县太阳光新能源有限公司 一种单晶硅表面清洗方法
CN115851138B (zh) * 2022-12-23 2024-06-28 博力思(天津)电子科技有限公司 一种可减少硅片表面颗粒沾污的硅精抛液
KR20250050299A (ko) * 2023-10-06 2025-04-15 에스케이엔펄스 주식회사 반도체 공정용 연마 조성물 및 이를 이용한 기판의 연마방법
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Also Published As

Publication number Publication date
WO2004053968A1 (en) 2004-06-24
EP1570512A1 (de) 2005-09-07
KR20040050726A (ko) 2004-06-17
CN1714432A (zh) 2005-12-28
CN100490082C (zh) 2009-05-20
TWI243849B (en) 2005-11-21
JP2006509364A (ja) 2006-03-16
TW200415233A (en) 2004-08-16
JP4220966B2 (ja) 2009-02-04
US20060242912A1 (en) 2006-11-02
DE60330994D1 (de) 2010-03-04
EP1570512A4 (de) 2007-05-09
EP1570512B1 (de) 2010-01-13
US7534277B2 (en) 2009-05-19
KR100516886B1 (ko) 2005-09-23

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