ATE458769T1 - Härtbare epoxidharzzusammensetzung - Google Patents
Härtbare epoxidharzzusammensetzungInfo
- Publication number
- ATE458769T1 ATE458769T1 AT07105538T AT07105538T ATE458769T1 AT E458769 T1 ATE458769 T1 AT E458769T1 AT 07105538 T AT07105538 T AT 07105538T AT 07105538 T AT07105538 T AT 07105538T AT E458769 T1 ATE458769 T1 AT E458769T1
- Authority
- AT
- Austria
- Prior art keywords
- composition
- epoxy resin
- resin composition
- curable epoxy
- dgebf
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP07105538A EP1978049B1 (de) | 2007-04-03 | 2007-04-03 | Härtbare Epoxidharzzusammensetzung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE458769T1 true ATE458769T1 (de) | 2010-03-15 |
Family
ID=38516147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07105538T ATE458769T1 (de) | 2007-04-03 | 2007-04-03 | Härtbare epoxidharzzusammensetzung |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US20100018750A1 (de) |
| EP (1) | EP1978049B1 (de) |
| JP (1) | JP2010523747A (de) |
| KR (1) | KR20100014721A (de) |
| CN (1) | CN101663344A (de) |
| AT (1) | ATE458769T1 (de) |
| AU (1) | AU2008233984A1 (de) |
| BR (1) | BRPI0809920A2 (de) |
| CA (1) | CA2682617A1 (de) |
| DE (1) | DE602007004946D1 (de) |
| DK (1) | DK1978049T3 (de) |
| ES (1) | ES2341375T3 (de) |
| MX (1) | MX2009010648A (de) |
| WO (1) | WO2008119624A1 (de) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010031445A1 (en) * | 2008-09-19 | 2010-03-25 | Abb Research Ltd | Epoxy resin composition |
| DE102009012195A1 (de) * | 2009-03-06 | 2010-09-09 | Siemens Aktiengesellschaft | Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit |
| CN102695739B (zh) * | 2009-08-27 | 2014-08-13 | Abb研究有限公司 | 可固化环氧树脂组合物 |
| JP5745248B2 (ja) * | 2010-10-08 | 2015-07-08 | 株式会社ダイセル | エポキシ樹脂用硬化剤組成物、硬化性樹脂組成物及びその硬化物 |
| US8536250B2 (en) | 2010-10-14 | 2013-09-17 | Tnemec Company Inc. | Geopolymer and epoxy simultaneous interpenetrating polymer network composition, and methods for the same |
| RU2606120C2 (ru) * | 2011-08-31 | 2017-01-10 | Хантсман Эдванст Матириалз (Свитзеленд) Гмбх | Способ пропитки реакторов с воздушным сердечником, подвергнутый пропитке реактор с воздушным сердечником и применение системы пропитки |
| MX365593B (es) * | 2011-12-20 | 2019-06-07 | Dow Global Technologies Llc | Proceso para preparar compuestos epoxicos curados. |
| CN102515626B (zh) * | 2012-01-06 | 2013-05-29 | 桂林理工大学 | 一种干式电力变压器用高导热环氧浇注料及其制备方法 |
| EP2629305B1 (de) * | 2012-02-20 | 2014-04-02 | ABB Technology AG | Verbundstoffmaterialien zur Verwendung in Hochspannungsvorrichtungen |
| WO2014035145A1 (ko) * | 2012-08-28 | 2014-03-06 | 주식회사 케이오씨솔루션 | 에폭시 아크릴계 광학재료의 제조방법 |
| CN102911544B (zh) * | 2012-11-20 | 2015-01-21 | 中国海洋石油总公司 | 一种改性环氧无溶剂涂料 |
| CN103881301B (zh) * | 2012-12-24 | 2015-12-09 | 江苏绿材谷新材料科技发展有限公司 | 一种可用于拉挤成型的耐高温环氧树脂组合物及制备方法 |
| EP3083748B1 (de) * | 2013-12-18 | 2018-02-14 | Blue Cube IP LLC | Destillierte epoxid-novolac-harze |
| CN104004320B (zh) * | 2014-05-15 | 2016-02-24 | 江苏绿材谷新材料科技发展有限公司 | 一种可用于拉挤成型的阻燃耐高温环氧树脂组合物及制备方法 |
| DE102015213815A1 (de) * | 2015-07-17 | 2017-01-19 | Siemens Aktiengesellschaft | Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem |
| DE102015218096A1 (de) * | 2015-09-21 | 2017-03-23 | Siemens Aktiengesellschaft | Formulierung für ein Imprägnierharz für den VPI Prozess |
| JPWO2017098566A1 (ja) * | 2015-12-07 | 2018-08-30 | 株式会社日立製作所 | 高電圧機器用電気絶縁材料 |
| JP6714493B2 (ja) | 2015-12-24 | 2020-06-24 | 信越化学工業株式会社 | 有機膜形成用化合物、有機膜形成用組成物、有機膜形成方法、及びパターン形成方法 |
| JP6714492B2 (ja) * | 2015-12-24 | 2020-06-24 | 信越化学工業株式会社 | 有機膜形成用化合物、有機膜形成用組成物、有機膜形成方法、及びパターン形成方法 |
| CN106566367A (zh) * | 2016-10-26 | 2017-04-19 | 上海维凯光电新材料有限公司 | 模压转移涂料组合物 |
| CN106519191A (zh) * | 2016-11-02 | 2017-03-22 | 武汉工程大学 | 用于环氧树脂体系的新型固化剂及其应用方法 |
| CN106519192A (zh) * | 2016-11-02 | 2017-03-22 | 武汉工程大学 | 一种用于环氧树脂体系的固化剂及其应用方法 |
| CN106496523A (zh) * | 2016-11-02 | 2017-03-15 | 武汉工程大学 | 一种用于环氧树脂体系的新型固化剂及其应用方法 |
| CN107880310B (zh) * | 2017-10-18 | 2019-06-04 | 常州大学 | 一种用于制备聚酚氧/聚酰胺共混塑料合金的增容剂及其增容方法 |
| KR102279438B1 (ko) | 2017-12-01 | 2021-07-19 | 엘에스일렉트릭(주) | 에폭시 수지 조성물 및 이를 포함하는 변압기 |
| KR20200133362A (ko) * | 2018-03-16 | 2020-11-27 | 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 | 페이퍼 부싱의 함침에 사용하기 위한 조성물 |
| EP3766085A1 (de) * | 2018-03-16 | 2021-01-20 | Huntsman Advanced Materials Licensing (Switzerland) GmbH | Härtbare mischungen zur verwendung bei der imprägnierung von papierhülsen |
| EP3850294A4 (de) * | 2018-09-11 | 2022-06-08 | Henkel IP & Holding GmbH | Mit phasenwechselmaterial beschichtete wärmetauschrohre |
| US10822517B2 (en) * | 2018-11-28 | 2020-11-03 | Industrial Technology Research Institute | Resin composition and cured resin composition |
| KR102008964B1 (ko) * | 2019-03-04 | 2019-10-23 | 제룡전기 주식회사 | 몰드 변압기용 친환경 하이브리드수지 조성물 및 그 제조방법 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3868613A (en) * | 1971-10-14 | 1975-02-25 | Westinghouse Electric Corp | Solventless epoxy resin composition and an electrical member impregnated therewith |
| JPS59201684A (ja) * | 1983-04-30 | 1984-11-15 | Canon Inc | 振動波モ−タ |
| US4665111A (en) * | 1984-10-12 | 1987-05-12 | Siemens Aktiengesellschaft | Casting compound for electrical and electronic components and modules |
| ES2203643T3 (es) * | 1994-07-01 | 2004-04-16 | Vantico Ag | Composicion de colada a base de resina epoxi. |
| JP2875479B2 (ja) * | 1994-09-08 | 1999-03-31 | 日本ペルノックス株式会社 | 半導体の封止方法 |
| US6194490B1 (en) * | 1998-02-27 | 2001-02-27 | Vantico, Inc. | Curable composition comprising epoxidized natural oils |
| ATE355318T1 (de) * | 2003-06-16 | 2006-03-15 | Abb Technology Ltd | Epoxyharzzusammensetzungen und verfahren zur herstellung von geformten gegenständen daraus |
| KR100655056B1 (ko) * | 2003-12-30 | 2006-12-06 | 제일모직주식회사 | 반도체 소자 밀봉용 액상 에폭시 수지 조성물 |
-
2007
- 2007-04-03 ES ES07105538T patent/ES2341375T3/es active Active
- 2007-04-03 EP EP07105538A patent/EP1978049B1/de not_active Revoked
- 2007-04-03 DK DK07105538.8T patent/DK1978049T3/da active
- 2007-04-03 DE DE602007004946T patent/DE602007004946D1/de active Active
- 2007-04-03 AT AT07105538T patent/ATE458769T1/de not_active IP Right Cessation
-
2008
- 2008-03-12 MX MX2009010648A patent/MX2009010648A/es unknown
- 2008-03-12 WO PCT/EP2008/052893 patent/WO2008119624A1/en not_active Ceased
- 2008-03-12 AU AU2008233984A patent/AU2008233984A1/en not_active Abandoned
- 2008-03-12 CA CA002682617A patent/CA2682617A1/en not_active Abandoned
- 2008-03-12 KR KR1020097020518A patent/KR20100014721A/ko not_active Withdrawn
- 2008-03-12 CN CN200880011002A patent/CN101663344A/zh active Pending
- 2008-03-12 JP JP2010501459A patent/JP2010523747A/ja not_active Withdrawn
- 2008-03-12 BR BRPI0809920-0A2A patent/BRPI0809920A2/pt not_active Application Discontinuation
-
2009
- 2009-10-02 US US12/572,872 patent/US20100018750A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| BRPI0809920A2 (pt) | 2014-10-07 |
| WO2008119624A1 (en) | 2008-10-09 |
| DE602007004946D1 (de) | 2010-04-08 |
| KR20100014721A (ko) | 2010-02-10 |
| CN101663344A (zh) | 2010-03-03 |
| ES2341375T3 (es) | 2010-06-18 |
| JP2010523747A (ja) | 2010-07-15 |
| EP1978049A1 (de) | 2008-10-08 |
| EP1978049B1 (de) | 2010-02-24 |
| MX2009010648A (es) | 2009-11-26 |
| US20100018750A1 (en) | 2010-01-28 |
| AU2008233984A1 (en) | 2008-10-09 |
| CA2682617A1 (en) | 2008-10-09 |
| DK1978049T3 (da) | 2010-06-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |