BRPI0809920A2 - Composições de resina epóxi curável - Google Patents

Composições de resina epóxi curável

Info

Publication number
BRPI0809920A2
BRPI0809920A2 BRPI0809920-0A2A BRPI0809920A BRPI0809920A2 BR PI0809920 A2 BRPI0809920 A2 BR PI0809920A2 BR PI0809920 A BRPI0809920 A BR PI0809920A BR PI0809920 A2 BRPI0809920 A2 BR PI0809920A2
Authority
BR
Brazil
Prior art keywords
composition
epoxy resin
curable epoxy
resin compositions
dgebf
Prior art date
Application number
BRPI0809920-0A2A
Other languages
English (en)
Inventor
Stephane Schaal
Patricia Gonzalez
Cherif Ghoul
Jens Rocks
Francisco Arauzo
Patrick Meier
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38516147&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BRPI0809920(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Publication of BRPI0809920A2 publication Critical patent/BRPI0809920A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Paints Or Removers (AREA)
BRPI0809920-0A2A 2007-04-03 2008-03-12 Composições de resina epóxi curável BRPI0809920A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07105538A EP1978049B1 (en) 2007-04-03 2007-04-03 Curable Epoxy Resin Composition
PCT/EP2008/052893 WO2008119624A1 (en) 2007-04-03 2008-03-12 Curable epoxy resin composition

Publications (1)

Publication Number Publication Date
BRPI0809920A2 true BRPI0809920A2 (pt) 2014-10-07

Family

ID=38516147

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0809920-0A2A BRPI0809920A2 (pt) 2007-04-03 2008-03-12 Composições de resina epóxi curável

Country Status (14)

Country Link
US (1) US20100018750A1 (pt)
EP (1) EP1978049B1 (pt)
JP (1) JP2010523747A (pt)
KR (1) KR20100014721A (pt)
CN (1) CN101663344A (pt)
AT (1) ATE458769T1 (pt)
AU (1) AU2008233984A1 (pt)
BR (1) BRPI0809920A2 (pt)
CA (1) CA2682617A1 (pt)
DE (1) DE602007004946D1 (pt)
DK (1) DK1978049T3 (pt)
ES (1) ES2341375T3 (pt)
MX (1) MX2009010648A (pt)
WO (1) WO2008119624A1 (pt)

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CN102159614A (zh) * 2008-09-19 2011-08-17 Abb研究有限公司 环氧树脂组合物
DE102009012195A1 (de) * 2009-03-06 2010-09-09 Siemens Aktiengesellschaft Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit
CN102695739B (zh) * 2009-08-27 2014-08-13 Abb研究有限公司 可固化环氧树脂组合物
JP5745248B2 (ja) * 2010-10-08 2015-07-08 株式会社ダイセル エポキシ樹脂用硬化剤組成物、硬化性樹脂組成物及びその硬化物
US8536250B2 (en) * 2010-10-14 2013-09-17 Tnemec Company Inc. Geopolymer and epoxy simultaneous interpenetrating polymer network composition, and methods for the same
WO2013029832A1 (en) * 2011-08-31 2013-03-07 Huntsman Advanced Materials (Switzerland) Gmbh Process for the impregnation of air core reactors, impregnated air core reactor and use of an impregnation system
EP2794757B1 (en) * 2011-12-20 2019-05-15 Dow Global Technologies LLC Process for preparing cured epoxy composites
CN102515626B (zh) * 2012-01-06 2013-05-29 桂林理工大学 一种干式电力变压器用高导热环氧浇注料及其制备方法
EP2629305B1 (en) * 2012-02-20 2014-04-02 ABB Technology AG Composite materials for use in high voltage devices
CN104583251B (zh) * 2012-08-28 2017-01-18 可奥熙搜路司有限公司 环氧丙烯酸类光学材料的制备方法
CN102911544B (zh) * 2012-11-20 2015-01-21 中国海洋石油总公司 一种改性环氧无溶剂涂料
CN103881301B (zh) * 2012-12-24 2015-12-09 江苏绿材谷新材料科技发展有限公司 一种可用于拉挤成型的耐高温环氧树脂组合物及制备方法
EP3083748B1 (en) * 2013-12-18 2018-02-14 Blue Cube IP LLC Distilled epoxy novolac resins
CN104004320B (zh) * 2014-05-15 2016-02-24 江苏绿材谷新材料科技发展有限公司 一种可用于拉挤成型的阻燃耐高温环氧树脂组合物及制备方法
DE102015213815A1 (de) * 2015-07-17 2017-01-19 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
DE102015218096A1 (de) * 2015-09-21 2017-03-23 Siemens Aktiengesellschaft Formulierung für ein Imprägnierharz für den VPI Prozess
WO2017098566A1 (ja) * 2015-12-07 2017-06-15 株式会社日立製作所 高電圧機器用電気絶縁材料
JP6714492B2 (ja) * 2015-12-24 2020-06-24 信越化学工業株式会社 有機膜形成用化合物、有機膜形成用組成物、有機膜形成方法、及びパターン形成方法
JP6714493B2 (ja) 2015-12-24 2020-06-24 信越化学工業株式会社 有機膜形成用化合物、有機膜形成用組成物、有機膜形成方法、及びパターン形成方法
CN106566367A (zh) * 2016-10-26 2017-04-19 上海维凯光电新材料有限公司 模压转移涂料组合物
CN106519192A (zh) * 2016-11-02 2017-03-22 武汉工程大学 一种用于环氧树脂体系的固化剂及其应用方法
CN106519191A (zh) * 2016-11-02 2017-03-22 武汉工程大学 用于环氧树脂体系的新型固化剂及其应用方法
CN106496523A (zh) * 2016-11-02 2017-03-15 武汉工程大学 一种用于环氧树脂体系的新型固化剂及其应用方法
CN107880310B (zh) * 2017-10-18 2019-06-04 常州大学 一种用于制备聚酚氧/聚酰胺共混塑料合金的增容剂及其增容方法
KR102279438B1 (ko) 2017-12-01 2021-07-19 엘에스일렉트릭(주) 에폭시 수지 조성물 및 이를 포함하는 변압기
WO2019174891A1 (en) * 2018-03-16 2019-09-19 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Compositions for use in impregnation of paper bushings
EP3766085A1 (en) * 2018-03-16 2021-01-20 Huntsman Advanced Materials Licensing (Switzerland) GmbH Curable mixtures for use in impregnation of paper bushings
CN112424557B (zh) * 2018-09-11 2023-07-25 汉高股份有限及两合公司 相变材料涂布的热交换管
US10822517B2 (en) * 2018-11-28 2020-11-03 Industrial Technology Research Institute Resin composition and cured resin composition
KR102008964B1 (ko) * 2019-03-04 2019-10-23 제룡전기 주식회사 몰드 변압기용 친환경 하이브리드수지 조성물 및 그 제조방법

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US3868613A (en) * 1971-10-14 1975-02-25 Westinghouse Electric Corp Solventless epoxy resin composition and an electrical member impregnated therewith
JPS59201684A (ja) * 1983-04-30 1984-11-15 Canon Inc 振動波モ−タ
US4665111A (en) * 1984-10-12 1987-05-12 Siemens Aktiengesellschaft Casting compound for electrical and electronic components and modules
ES2203643T3 (es) * 1994-07-01 2004-04-16 Vantico Ag Composicion de colada a base de resina epoxi.
JP2875479B2 (ja) * 1994-09-08 1999-03-31 日本ペルノックス株式会社 半導体の封止方法
US6194490B1 (en) * 1998-02-27 2001-02-27 Vantico, Inc. Curable composition comprising epoxidized natural oils
EP1491566B1 (en) * 2003-06-16 2007-02-28 ABB Technology Ltd Curable epoxy resin composition, and process for the production of shaped articles therefrom
KR100655056B1 (ko) * 2003-12-30 2006-12-06 제일모직주식회사 반도체 소자 밀봉용 액상 에폭시 수지 조성물

Also Published As

Publication number Publication date
MX2009010648A (es) 2009-11-26
ES2341375T3 (es) 2010-06-18
WO2008119624A1 (en) 2008-10-09
ATE458769T1 (de) 2010-03-15
DE602007004946D1 (de) 2010-04-08
EP1978049A1 (en) 2008-10-08
CN101663344A (zh) 2010-03-03
KR20100014721A (ko) 2010-02-10
CA2682617A1 (en) 2008-10-09
JP2010523747A (ja) 2010-07-15
DK1978049T3 (da) 2010-06-14
EP1978049B1 (en) 2010-02-24
US20100018750A1 (en) 2010-01-28
AU2008233984A1 (en) 2008-10-09

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]