ATE459888T1 - Dreiachsiger beschleunigungsmesser mit membran - Google Patents

Dreiachsiger beschleunigungsmesser mit membran

Info

Publication number
ATE459888T1
ATE459888T1 AT07103819T AT07103819T ATE459888T1 AT E459888 T1 ATE459888 T1 AT E459888T1 AT 07103819 T AT07103819 T AT 07103819T AT 07103819 T AT07103819 T AT 07103819T AT E459888 T1 ATE459888 T1 AT E459888T1
Authority
AT
Austria
Prior art keywords
membrane
substrate
integrated
mass
axis accelerometer
Prior art date
Application number
AT07103819T
Other languages
English (en)
Inventor
Philippe Robert
Sebastien Hentz
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE459888T1 publication Critical patent/ATE459888T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0062—Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0109—Bridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0181—See-saws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/082—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for two degrees of freedom of movement of a single mass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Surgical Instruments (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Buildings Adapted To Withstand Abnormal External Influences (AREA)
AT07103819T 2006-03-14 2007-03-09 Dreiachsiger beschleunigungsmesser mit membran ATE459888T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0602216A FR2898683B1 (fr) 2006-03-14 2006-03-14 Accelerometre triaxial a membrane

Publications (1)

Publication Number Publication Date
ATE459888T1 true ATE459888T1 (de) 2010-03-15

Family

ID=37421177

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07103819T ATE459888T1 (de) 2006-03-14 2007-03-09 Dreiachsiger beschleunigungsmesser mit membran

Country Status (6)

Country Link
US (1) US7600428B2 (de)
EP (1) EP1835294B1 (de)
JP (1) JP5211387B2 (de)
AT (1) ATE459888T1 (de)
DE (1) DE602007005036D1 (de)
FR (1) FR2898683B1 (de)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006062314A1 (de) * 2006-12-27 2008-07-03 Robert Bosch Gmbh Mehrachsiger mikromechanischer Beschleunigungssensor
DE102007017209B4 (de) * 2007-04-05 2014-02-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikromechanischer Inertialsensor zur Messung von Drehraten
TWI335903B (en) * 2007-10-05 2011-01-11 Pixart Imaging Inc Out-of-plane sensing device
US20110113880A1 (en) * 2008-05-15 2011-05-19 Continental Teves Ag & Co. Ohg Micromechanical acceleration sensor
KR100986221B1 (ko) * 2008-06-16 2010-10-08 한국산업기술대학교산학협력단 수직 방향 가속도 측정 장치
US8187902B2 (en) 2008-07-09 2012-05-29 The Charles Stark Draper Laboratory, Inc. High performance sensors and methods for forming the same
US8171793B2 (en) * 2008-07-31 2012-05-08 Honeywell International Inc. Systems and methods for detecting out-of-plane linear acceleration with a closed loop linear drive accelerometer
DE102008043524B4 (de) * 2008-11-06 2021-10-14 Robert Bosch Gmbh Beschleunigungssensor und Verfahren zu seiner Herstellung
DE102008044371B4 (de) * 2008-12-05 2016-10-27 Robert Bosch Gmbh Verfahren zur Herstellung einer Sensoranordnung
WO2010138717A1 (en) * 2009-05-27 2010-12-02 King Abdullah University Of Science And Technology Mems mass spring damper systems using an out-of-plane suspension scheme
US8307710B2 (en) * 2009-07-09 2012-11-13 Honeywell International Inc. Translational mass in-plane MEMS accelerometer
US8739626B2 (en) 2009-08-04 2014-06-03 Fairchild Semiconductor Corporation Micromachined inertial sensor devices
DE102009028343B4 (de) * 2009-08-07 2022-12-15 Robert Bosch Gmbh Sensorelement und Verfahren zum Betrieb eines Sensorelements
DE102010029645B4 (de) 2010-06-02 2018-03-29 Robert Bosch Gmbh Mikromechanisches Bauelement mit einer Teststruktur zur Bestimmung der Schichtdicke einer Abstandsschicht und Verfahren zum Herstellen einer solchen Teststruktur
WO2012003403A2 (en) * 2010-06-30 2012-01-05 Indiana University Research And Technology Corporation Supersensitive linear pressure transducer
CN102384984B (zh) * 2010-09-02 2013-06-12 孙博华 电容式单质量块全梳齿电极三轴加速度传感器及制作方法
WO2012037540A2 (en) 2010-09-18 2012-03-22 Fairchild Semiconductor Corporation Micromachined monolithic 3-axis gyroscope with single drive
WO2012037501A2 (en) 2010-09-18 2012-03-22 Cenk Acar Flexure bearing to reduce quadrature for resonating micromachined devices
US9278846B2 (en) 2010-09-18 2016-03-08 Fairchild Semiconductor Corporation Micromachined monolithic 6-axis inertial sensor
US9856132B2 (en) 2010-09-18 2018-01-02 Fairchild Semiconductor Corporation Sealed packaging for microelectromechanical systems
EP2616389B1 (de) 2010-09-18 2017-04-05 Fairchild Semiconductor Corporation Mehrchip-mems-verpackung
US8813564B2 (en) 2010-09-18 2014-08-26 Fairchild Semiconductor Corporation MEMS multi-axis gyroscope with central suspension and gimbal structure
US9006846B2 (en) 2010-09-20 2015-04-14 Fairchild Semiconductor Corporation Through silicon via with reduced shunt capacitance
US10065851B2 (en) 2010-09-20 2018-09-04 Fairchild Semiconductor Corporation Microelectromechanical pressure sensor including reference capacitor
US8839670B2 (en) * 2010-11-24 2014-09-23 Invensense, Inc. Anchor-tilt cancelling accelerometer
US8966990B2 (en) * 2011-02-11 2015-03-03 Purdue Research Foundation MEMS devices exhibiting linear characteristics
DE102012200740B4 (de) * 2011-10-27 2024-03-21 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
JP2013117396A (ja) * 2011-12-01 2013-06-13 Denso Corp 加速度センサ
TWI467179B (zh) * 2011-12-02 2015-01-01 Pixart Imaging Inc 三維微機電感測器
US9062972B2 (en) * 2012-01-31 2015-06-23 Fairchild Semiconductor Corporation MEMS multi-axis accelerometer electrode structure
US8978475B2 (en) 2012-02-01 2015-03-17 Fairchild Semiconductor Corporation MEMS proof mass with split z-axis portions
US8754694B2 (en) 2012-04-03 2014-06-17 Fairchild Semiconductor Corporation Accurate ninety-degree phase shifter
US8742964B2 (en) 2012-04-04 2014-06-03 Fairchild Semiconductor Corporation Noise reduction method with chopping for a merged MEMS accelerometer sensor
US9488693B2 (en) 2012-04-04 2016-11-08 Fairchild Semiconductor Corporation Self test of MEMS accelerometer with ASICS integrated capacitors
EP2647955B8 (de) 2012-04-05 2018-12-19 Fairchild Semiconductor Corporation MEMS-Vorrichtung mit Quadraturphasenverschiebungsauslöschung
EP2647952B1 (de) 2012-04-05 2017-11-15 Fairchild Semiconductor Corporation Automatische Verstärkungsregelungsschleife einer MEMS-Vorrichtung für mechanischen Amplitudenantrieb
US9069006B2 (en) 2012-04-05 2015-06-30 Fairchild Semiconductor Corporation Self test of MEMS gyroscope with ASICs integrated capacitors
EP2648334B1 (de) 2012-04-05 2020-06-10 Fairchild Semiconductor Corporation Front-end-Ladungsverstärker einer MEMS-Vorrichtung
US9094027B2 (en) 2012-04-12 2015-07-28 Fairchild Semiconductor Corporation Micro-electro-mechanical-system (MEMS) driver
US9625272B2 (en) * 2012-04-12 2017-04-18 Fairchild Semiconductor Corporation MEMS quadrature cancellation and signal demodulation
ITTO20120691A1 (it) 2012-08-01 2014-02-02 Milano Politecnico Sensore d'urto con meccanismo bistabile e metodo per il rilevamento di urti
DE102013014881B4 (de) 2012-09-12 2023-05-04 Fairchild Semiconductor Corporation Verbesserte Silizium-Durchkontaktierung mit einer Füllung aus mehreren Materialien
US9644963B2 (en) 2013-03-15 2017-05-09 Fairchild Semiconductor Corporation Apparatus and methods for PLL-based gyroscope gain control, quadrature cancellation and demodulation
KR101531088B1 (ko) * 2013-05-30 2015-07-06 삼성전기주식회사 관성센서
US20150247879A1 (en) * 2014-03-03 2015-09-03 Infineon Technologies Ag Acceleration sensor
US20150268269A1 (en) * 2014-03-20 2015-09-24 Freescale Semiconductor, Inc. Sensor with combined sense elements for multiple axis sensing
US9493339B2 (en) * 2014-09-02 2016-11-15 Kabushiki Kaisha Toshiba Micro electro mechanical system
CN104614553A (zh) * 2015-01-30 2015-05-13 歌尔声学股份有限公司 一种加速度计中的z轴结构
US10436812B2 (en) 2015-03-20 2019-10-08 Nxp Usa, Inc. Micro-electro-mechanical acceleration sensor device
US10697994B2 (en) 2017-02-22 2020-06-30 Semiconductor Components Industries, Llc Accelerometer techniques to compensate package stress
JP7176353B2 (ja) * 2018-10-29 2022-11-22 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
JP7123881B2 (ja) * 2019-08-28 2022-08-23 株式会社東芝 センサ
JP7134931B2 (ja) * 2019-08-28 2022-09-12 株式会社東芝 センサ
DE102020119371B3 (de) 2020-07-22 2021-08-05 IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH) Mikroelektromechanischer Beschleunigungssensor
KR102573515B1 (ko) * 2021-01-11 2023-09-06 한국공학대학교산학협력단 관성 센서
TWI826993B (zh) * 2021-04-06 2023-12-21 昇佳電子股份有限公司 慣性感測器
CN120028574B (zh) * 2025-02-18 2025-08-01 慧石（上海）测控科技有限公司 一种三轴加速芯片及制作方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04115165A (ja) * 1990-09-05 1992-04-16 Ricoh Co Ltd 加速度センサ
US5591910A (en) * 1994-06-03 1997-01-07 Texas Instruments Incorporated Accelerometer
JPH08166405A (ja) * 1994-12-15 1996-06-25 Murata Mfg Co Ltd 加速度センサ
JPH0989927A (ja) * 1995-09-28 1997-04-04 Zexel Corp 多軸加速度センサ
JP3114570B2 (ja) * 1995-05-26 2000-12-04 オムロン株式会社 静電容量型圧力センサ
US6612029B2 (en) * 2000-03-24 2003-09-02 Onix Microsystems Multi-layer, self-aligned vertical combdrive electrostatic actuators and fabrication methods
JP2003014778A (ja) * 2001-04-26 2003-01-15 Samsung Electronics Co Ltd 垂直変位測定及び駆動構造体とその製造方法
US6809529B2 (en) * 2001-08-10 2004-10-26 Wacoh Corporation Force detector
JP2003166999A (ja) * 2001-12-03 2003-06-13 Denso Corp 半導体力学量センサ
US6761070B2 (en) * 2002-01-31 2004-07-13 Delphi Technologies, Inc. Microfabricated linear accelerometer
JP2003329444A (ja) * 2002-03-07 2003-11-19 Alps Electric Co Ltd 静電容量式センサ
JP4174351B2 (ja) * 2002-03-15 2008-10-29 株式会社豊田中央研究所 可動電極を有する装置、可動ミラー装置、振動型ジャイロスコープ及びこれらの製造方法
US20040035206A1 (en) * 2002-03-26 2004-02-26 Ward Paul A. Microelectromechanical sensors having reduced signal bias errors and methods of manufacturing the same
US20050151448A1 (en) * 2002-04-02 2005-07-14 Koichi Hikida Inclination sensor, method of manufacturing inclination sensor, and method of measuring inclination
JP2004150993A (ja) * 2002-10-31 2004-05-27 Japan Aviation Electronics Industry Ltd 容量式３軸加速度センサ
JP2004361388A (ja) * 2003-05-15 2004-12-24 Mitsubishi Electric Corp 容量型慣性力検出装置
JP2005017227A (ja) * 2003-06-27 2005-01-20 Star Micronics Co Ltd 静電容量型加速度センサ
US6845670B1 (en) * 2003-07-08 2005-01-25 Freescale Semiconductor, Inc. Single proof mass, 3 axis MEMS transducer
JP4073382B2 (ja) * 2003-09-02 2008-04-09 ホシデン株式会社 振動センサ
EP1624284B1 (de) * 2004-07-29 2017-07-19 STMicroelectronics Srl Mikroelektromechanischer hochempfindlicher Inertialsensor und dessen Herstellungsverfahren
JP2006084219A (ja) * 2004-09-14 2006-03-30 Hosiden Corp 加速度センサ
US7258010B2 (en) * 2005-03-09 2007-08-21 Honeywell International Inc. MEMS device with thinned comb fingers
US20060207327A1 (en) * 2005-03-16 2006-09-21 Zarabadi Seyed R Linear accelerometer
US7337671B2 (en) * 2005-06-03 2008-03-04 Georgia Tech Research Corp. Capacitive microaccelerometers and fabrication methods
US7350415B2 (en) * 2006-05-25 2008-04-01 Honeywell International Inc. Closed-loop comb drive sensor

Also Published As

Publication number Publication date
US20070214891A1 (en) 2007-09-20
DE602007005036D1 (de) 2010-04-15
FR2898683A1 (fr) 2007-09-21
EP1835294A1 (de) 2007-09-19
US7600428B2 (en) 2009-10-13
JP2007248466A (ja) 2007-09-27
JP5211387B2 (ja) 2013-06-12
FR2898683B1 (fr) 2008-05-23
EP1835294B1 (de) 2010-03-03

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