ATE460467T1 - Zwei-komponenten epoxykleber mit verbesserter kraft - Google Patents

Zwei-komponenten epoxykleber mit verbesserter kraft

Info

Publication number
ATE460467T1
ATE460467T1 AT02786997T AT02786997T ATE460467T1 AT E460467 T1 ATE460467 T1 AT E460467T1 AT 02786997 T AT02786997 T AT 02786997T AT 02786997 T AT02786997 T AT 02786997T AT E460467 T1 ATE460467 T1 AT E460467T1
Authority
AT
Austria
Prior art keywords
component epoxy
epoxy adhesive
improved strength
resin
curing agent
Prior art date
Application number
AT02786997T
Other languages
English (en)
Inventor
Terry Gordon
Original Assignee
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa filed Critical Henkel Ag & Co Kgaa
Application granted granted Critical
Publication of ATE460467T1 publication Critical patent/ATE460467T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C08L9/02—Copolymers with acrylonitrile
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
AT02786997T 2002-08-06 2002-12-11 Zwei-komponenten epoxykleber mit verbesserter kraft ATE460467T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/213,883 US6645341B1 (en) 2002-08-06 2002-08-06 Two part epoxide adhesive with improved strength
PCT/US2002/039500 WO2004013248A1 (en) 2002-08-06 2002-12-11 Two part epoxide adhesive with improved strength

Publications (1)

Publication Number Publication Date
ATE460467T1 true ATE460467T1 (de) 2010-03-15

Family

ID=29400952

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02786997T ATE460467T1 (de) 2002-08-06 2002-12-11 Zwei-komponenten epoxykleber mit verbesserter kraft

Country Status (7)

Country Link
US (1) US6645341B1 (de)
EP (2) EP1527147B1 (de)
AT (1) ATE460467T1 (de)
AU (1) AU2002351344A1 (de)
DE (1) DE60235653D1 (de)
TW (1) TWI267541B (de)
WO (1) WO2004013248A1 (de)

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US20040072927A1 (en) * 2002-10-14 2004-04-15 Hachikian Zakar Raffi Two-part epoxy adhesives with improved flexibility and process for making and using same
US7157143B2 (en) * 2003-03-24 2007-01-02 Dow Global Technologies Inc. Two-component epoxy adhesive formulation for high elongation with low modulus
US7071263B2 (en) * 2003-05-19 2006-07-04 3M Innovative Properties Company Epoxy adhesives and bonded substrates
EP1695990A1 (de) * 2005-02-28 2006-08-30 Dow Global Technologies Inc. Zweikomponenten-epoxyklebstoffzusammensetzung
GB0513498D0 (en) * 2005-06-30 2006-03-29 Bae Systems Plc Fibre materials
US20080287566A1 (en) * 2005-09-28 2008-11-20 Essential Dental Systems, Inc. Epoxy based oil free root canal sealer
US20070236542A1 (en) * 2006-03-29 2007-10-11 Graham David C Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads
US20070293603A1 (en) * 2006-06-19 2007-12-20 Ashland Licensing And Intellectual Property Llc Epoxy adhesive composition and use thereof
CN100391996C (zh) * 2006-06-29 2008-06-04 广州市东风化工实业有限公司 环氧树脂固化剂及其制作工艺方法
US7737199B2 (en) * 2007-02-15 2010-06-15 Ashland Licensing & Intellectual Property Llc Two-component adhesive of epoxy resin/polyol pack and polyamide/aliphatic amine/tertiary amine pack
KR20100055478A (ko) * 2007-08-17 2010-05-26 다우 글로벌 테크놀로지스 인크. 2부분 충돌 내구성 에폭시 접착제
GB0717867D0 (en) * 2007-09-14 2007-10-24 3M Innovative Properties Co Flexible epoxy-based compositions
DE102008000499A1 (de) * 2008-03-04 2009-09-10 Evonik Degussa Gmbh Kieselsäure sowie Epoxidharze
US7951869B2 (en) * 2008-05-28 2011-05-31 Funston Randall A 2K waterborne isocyanate free coating system and methods thereof
US20100154333A1 (en) * 2008-12-18 2010-06-24 Huber Engineered Woods Llc Structural Members And Structures Using Them, And Methods
EP2223966B1 (de) * 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy-Haftmittelzusammensetzungen mit hoher mechanischer Festigkeit über einen breiten Temperaturbereich
EP2430104B1 (de) 2009-05-13 2014-08-20 Sun Chemical B.V. Modifizierte polyamid-acrylatoliogomere
US20110014354A1 (en) * 2009-07-20 2011-01-20 David Christopher Graham Adhesive compositions and methods for use in failure analysis
CN102575138B (zh) 2009-09-11 2013-10-16 3M创新有限公司 固化性和固化的粘合剂组合物
KR101727345B1 (ko) 2009-09-11 2017-04-14 쓰리엠 이노베이티브 프로퍼티즈 컴파니 경화성 및 경화된 접착제 조성물
WO2011097009A2 (en) 2010-02-02 2011-08-11 Dow Global Technologies Llc Curable epoxy resin compositions
EP2365046A1 (de) * 2010-03-02 2011-09-14 Sika Technology AG Schlagzäher bei Raumtemperatur härtender zwei-komponentiger Strukturklebstoff
US10023774B2 (en) 2010-10-01 2018-07-17 Council Of Scientific & Industrial Research Adhesive composition and uses thereof
CN103189411B (zh) 2010-11-12 2015-11-25 3M创新有限公司 可固化组合物和已固化组合物
JP5784134B2 (ja) 2010-11-12 2015-09-24 スリーエム イノベイティブ プロパティズ カンパニー 硬化性組成物
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US20140150970A1 (en) 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
US20160208042A1 (en) * 2013-10-01 2016-07-21 Basf Se Multi-component epoxy resin composition
BR112017018406A2 (pt) * 2015-02-27 2018-04-17 3M Innovative Properties Co adesivo estrutural em duas partes
JP6422598B2 (ja) * 2015-04-16 2018-11-14 スリーエム イノベイティブ プロパティズ カンパニー チオール−エポキシマトリックスを有する量子ドット物品
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
KR102566344B1 (ko) 2017-08-18 2023-08-10 피나 테크놀러지, 인코포레이티드 에폭시화된 폴리파르네센 및 이를 생산하기 위한 방법
CN109504062B (zh) * 2018-11-22 2021-07-16 南亚塑胶工业股份有限公司 一种热固性树脂组合物
KR102756427B1 (ko) * 2019-05-16 2025-01-21 에보니크 오퍼레이션즈 게엠베하 경화 조성물
DE102019209754A1 (de) 2019-07-03 2021-01-07 Tesa Se Thermisch härtender Klebstoff und daraus hergestelltes Klebeband

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JPS57179268A (en) 1981-04-27 1982-11-04 Semedain Kk Epoxy resin adhesive composition
CA1249691A (en) 1984-07-18 1989-01-31 Janis Robins Fast curing epoxy resin compositions
US4746381A (en) * 1986-05-05 1988-05-24 A. B. Chance Company Method of making an end cap connection for a fluid-resistance electrical device
US4803232A (en) 1987-07-30 1989-02-07 Lord Corporation Rubber-modified epoxy adhesive compositions
US4766186A (en) * 1987-09-03 1988-08-23 Texaco Inc. Epoxy adhesive
US5001193A (en) 1988-12-22 1991-03-19 American Cyanamid Epoxy adhesive for bonding of automotive parts made from bulk or sheet molding compound containing polymeric toughening agent and Mannich Base
US5140068A (en) 1990-04-27 1992-08-18 The B. F. Goodrich Company Epoxy resin systems modified with low viscosity statistical monofunctional reactive polymers
US5385990A (en) 1992-11-02 1995-01-31 Lord Corporation Structural adhesive composition having high temperature resistance
US5575956A (en) 1995-07-19 1996-11-19 Hughes Aircraft Company Room-temperature stable, one-component, electrically-conductive, flexible epoxy adhesives
JP2915379B2 (ja) 1996-06-18 1999-07-05 レイセオン・カンパニー 落下衝撃に耐える導電接着剤

Also Published As

Publication number Publication date
US6645341B1 (en) 2003-11-11
EP2014737A1 (de) 2009-01-14
AU2002351344A1 (en) 2004-02-23
WO2004013248A1 (en) 2004-02-12
EP1527147A1 (de) 2005-05-04
TW200416266A (en) 2004-09-01
DE60235653D1 (de) 2010-04-22
TWI267541B (en) 2006-12-01
EP1527147B1 (de) 2010-03-10

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