ATE463841T1 - Flexible oberflächenlage für hoch gefüllte oder niedrig vernetzte, thermisch leitende verbindungsflächen - Google Patents

Flexible oberflächenlage für hoch gefüllte oder niedrig vernetzte, thermisch leitende verbindungsflächen

Info

Publication number
ATE463841T1
ATE463841T1 AT03254186T AT03254186T ATE463841T1 AT E463841 T1 ATE463841 T1 AT E463841T1 AT 03254186 T AT03254186 T AT 03254186T AT 03254186 T AT03254186 T AT 03254186T AT E463841 T1 ATE463841 T1 AT E463841T1
Authority
AT
Austria
Prior art keywords
thermally conductive
networked
low
surface layer
bulk layer
Prior art date
Application number
AT03254186T
Other languages
English (en)
Inventor
Radesh Jewram
Kasyap Venkata Seethamraju
Kevin L Hanson
Original Assignee
Bergquist Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bergquist Co filed Critical Bergquist Co
Application granted granted Critical
Publication of ATE463841T1 publication Critical patent/ATE463841T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
AT03254186T 2002-08-15 2003-07-01 Flexible oberflächenlage für hoch gefüllte oder niedrig vernetzte, thermisch leitende verbindungsflächen ATE463841T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/219,210 US6657297B1 (en) 2002-08-15 2002-08-15 Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads

Publications (1)

Publication Number Publication Date
ATE463841T1 true ATE463841T1 (de) 2010-04-15

Family

ID=29549660

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03254186T ATE463841T1 (de) 2002-08-15 2003-07-01 Flexible oberflächenlage für hoch gefüllte oder niedrig vernetzte, thermisch leitende verbindungsflächen

Country Status (7)

Country Link
US (1) US6657297B1 (de)
EP (1) EP1389801B1 (de)
JP (1) JP2004080040A (de)
AT (1) ATE463841T1 (de)
CA (1) CA2437243C (de)
DE (1) DE60331992D1 (de)
TW (1) TWI264097B (de)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6841867B2 (en) * 2002-12-30 2005-01-11 Intel Corporation Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials
US20060063017A1 (en) * 2004-09-22 2006-03-23 Fuji Polymer Industries Co., Ltd. Thermally conductive sheet and method for producing the same
JP4395753B2 (ja) * 2004-12-27 2010-01-13 信越化学工業株式会社 熱伝導部材の製造方法及びこの使用方法並びに放熱構造体
US7436669B2 (en) * 2005-05-11 2008-10-14 Sung-Po Huang 3D multi-layer heat conduction diffusion plate
WO2007076014A2 (en) * 2005-12-23 2007-07-05 World Properties, Inc. Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
KR101347486B1 (ko) * 2006-01-31 2014-01-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 유연성 포일 구조를 구비한 ｌｅｄ 조명 조립체
US20070178255A1 (en) * 2006-01-31 2007-08-02 Farrow Timothy S Apparatus, system, and method for thermal conduction interfacing
US7710045B2 (en) * 2006-03-17 2010-05-04 3M Innovative Properties Company Illumination assembly with enhanced thermal conductivity
US7863639B2 (en) * 2006-04-12 2011-01-04 Semileds Optoelectronics Co. Ltd. Light-emitting diode lamp with low thermal resistance
US8373195B2 (en) 2006-04-12 2013-02-12 SemiLEDs Optoelectronics Co., Ltd. Light-emitting diode lamp with low thermal resistance
US7806560B2 (en) * 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
US8445102B2 (en) * 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8545987B2 (en) * 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US9795059B2 (en) * 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
US8076773B2 (en) * 2007-12-26 2011-12-13 The Bergquist Company Thermal interface with non-tacky surface
US8143631B2 (en) * 2008-03-06 2012-03-27 Metrospec Technology Llc Layered structure for use with high power light emitting diode systems
US8851356B1 (en) 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
US8007286B1 (en) 2008-03-18 2011-08-30 Metrospec Technology, Llc Circuit boards interconnected by overlapping plated through holes portions
US20090208722A1 (en) * 2008-02-18 2009-08-20 John Francis Timmerman Oriented Members for Thermally Conductive Interface Structures
US8410720B2 (en) 2008-04-07 2013-04-02 Metrospec Technology, LLC. Solid state lighting circuit and controls
US8802505B2 (en) * 2008-09-30 2014-08-12 Stats Chippac, Ltd. Semiconductor device and method of forming a protective layer on a backside of the wafer
US8430264B2 (en) * 2009-05-20 2013-04-30 The Bergquist Company Method for packaging thermal interface materials
US8205766B2 (en) * 2009-05-20 2012-06-26 The Bergquist Company Method for packaging thermal interface materials
US8081468B2 (en) * 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
US20100321897A1 (en) * 2009-06-17 2010-12-23 Laird Technologies, Inc. Compliant multilayered thermally-conductive interface assemblies
KR20110012780A (ko) * 2009-07-31 2011-02-09 엘지디스플레이 주식회사 액정표시장치
US8492961B2 (en) 2011-09-19 2013-07-23 Osram Sylvania Inc. Heat sink assembly
JP5942641B2 (ja) * 2012-07-02 2016-06-29 日立化成株式会社 樹脂シート及びその製造方法、樹脂シート硬化物、並びに放熱用部材
CN102917574B (zh) * 2012-10-24 2015-05-27 华为技术有限公司 导热垫、制造导热垫的方法、散热装置和电子设备
US9999158B2 (en) 2013-01-03 2018-06-12 Henkel IP & Holding GmbH Thermally conductive EMI suppression compositions
US9693481B2 (en) 2013-06-25 2017-06-27 Henkel IP & Holding GmbH Thermally conductive dielectric interface
CN105899714B (zh) 2013-12-05 2018-09-21 霍尼韦尔国际公司 具有经调节的pH的甲基磺酸亚锡溶液
KR20160122172A (ko) 2014-02-13 2016-10-21 허니웰 인터내셔날 인코포레이티드 압축성 열전도 재료
US20150334871A1 (en) * 2014-05-19 2015-11-19 Laird Technologies, Inc. Thermal interface materials with thin film sealants
PL3166999T3 (pl) 2014-07-07 2023-07-03 Honeywell International Inc. Materiał termoprzewodzący ze zmiataczem jonów
JP6295238B2 (ja) * 2014-10-31 2018-03-14 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
EP3227399B1 (de) 2014-12-05 2021-07-14 Honeywell International Inc. Hochleistungsfähige thermische zwischenmaterialien mit niedrigem wärmewiderstand
WO2017011453A1 (en) 2015-07-13 2017-01-19 Laird Technologies, Inc. Thermal management and/or emi mitigation materials with custom colored exterior surfaces
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
CN106711535B (zh) * 2015-11-17 2019-12-17 上海比亚迪有限公司 导热板及其制备方法和电池组装置
EP3426746B1 (de) 2016-03-08 2021-07-14 Honeywell International Inc. Phasenwechselmaterial
JP6710828B2 (ja) * 2016-04-06 2020-06-17 北川工業株式会社 熱伝導シート、および、熱伝導シートの製造方法
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof
CN109616450B (zh) * 2018-11-08 2021-05-18 清华大学深圳研究生院 一种封装材料及其应用
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
TWI896542B (zh) 2019-07-23 2025-09-11 德商漢高股份有限及兩合公司 高熱通量多元件總成之熱管理
KR102565178B1 (ko) * 2020-11-12 2023-08-08 성균관대학교산학협력단 연성-강성-연성 다층 구조 열 계면 소재, 이의 제조 방법 및 이를 포함하는 방열 장치 또는 시스템

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869954A (en) * 1987-09-10 1989-09-26 Chomerics, Inc. Thermally conductive materials
US4938992A (en) * 1988-01-07 1990-07-03 Varian Associates, Inc. Methods for thermal transfer with a semiconductor
US5300809A (en) * 1989-12-12 1994-04-05 Sumitomo Special Metals Co., Ltd. Heat-conductive composite material
JP2882972B2 (ja) * 1993-06-15 1999-04-19 電気化学工業株式会社 放熱シート
US5679457A (en) 1995-05-19 1997-10-21 The Bergquist Company Thermally conductive interface for electronic devices
US6090484A (en) 1995-05-19 2000-07-18 The Bergquist Company Thermally conductive filled polymer composites for mounting electronic devices and method of application
JP3280224B2 (ja) * 1996-02-06 2002-04-30 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーンゲルシートおよびその製造方法
US5950066A (en) 1996-06-14 1999-09-07 The Bergquist Company Semisolid thermal interface with low flow resistance
JPH106440A (ja) * 1996-06-19 1998-01-13 Toray Dow Corning Silicone Co Ltd シリコーンゲル成形物と剥離性フィルムからなる複合成形体およびその製造方法
US5738936A (en) * 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
JP3434186B2 (ja) * 1996-11-06 2003-08-04 富士高分子工業株式会社 熱伝導性シリコーンゲル成形シート及びその製造方法
JP3531785B2 (ja) * 1997-07-02 2004-05-31 電気化学工業株式会社 電子部品用放熱部材の製造方法
US6432497B2 (en) * 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
JP3434678B2 (ja) * 1997-09-12 2003-08-11 電気化学工業株式会社 ゴムシートの製造方法
JP3425521B2 (ja) 1998-01-09 2003-07-14 信越化学工業株式会社 低硬度熱伝導性シリコーンゴムシートの表面粘着性低減方法
US6399209B1 (en) 1999-04-16 2002-06-04 The Bergquist Company Integrated release films for phase-change interfaces
US6165612A (en) 1999-05-14 2000-12-26 The Bergquist Company Thermally conductive interface layers
US6359334B1 (en) * 1999-06-08 2002-03-19 Micron Technology, Inc. Thermally conductive adhesive tape for semiconductor devices and method using the same
JP2002026203A (ja) * 2000-07-05 2002-01-25 Denki Kagaku Kogyo Kk 放熱スペーサー

Also Published As

Publication number Publication date
TWI264097B (en) 2006-10-11
EP1389801A3 (de) 2007-01-24
DE60331992D1 (de) 2010-05-20
CA2437243A1 (en) 2004-02-15
TW200414464A (en) 2004-08-01
EP1389801A2 (de) 2004-02-18
US6657297B1 (en) 2003-12-02
CA2437243C (en) 2008-02-05
JP2004080040A (ja) 2004-03-11
EP1389801B1 (de) 2010-04-07

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